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As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation

Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization

Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration

Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

As a Senior DFT Engineer at Astera Labs, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation

Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation

Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration

Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

As a Senior/Staff Design Verification Engineer, you will be a key architect of quality in our Israel R&D center. You won't just run tests-you will design comprehensive verification strategies for high-performance digital blocks, IPs, subsystems, and full-chip integration. You will work at the cutting edge of AI infrastructure connectivity where "good enough" isn't an option, owning end-to-end verification plans for our most challenging designs. If you thrive on solving complex verification challenges and want to ensure the quality of chips powering the world's largest AI clusters, this is your opportunity.

Key Responsibilities

Verification Environment Architecture & Development

Design and develop comprehensive ASIC verification environments across all levels-from unit-level and subsystems to full-chip integration
Build sophisticated SystemVerilog/UVM-based testbenches including protocol/traffic generators, monitors, checkers, and functional coverage models
Own end-to-end verification plans for highly complex digital blocks, defining the "how" and "what" to ensure 100% functional coverage
Quality Assurance & Debug Excellence

Drive the debug process and leverage advanced methodologies to find critical bugs before silicon
Develop and execute comprehensive test plans to verify functionality, performance, and corner cases
Ensure verification closure through rigorous coverage analysis and assertion-based verification
Cross-Functional Collaboration & Technical Leadership

Partner with design and system architects to solve intricate hardware verification challenges
Work alongside world-class teams where knowledge sharing and technical excellence are the standard
Contribute to verification methodology improvements and automation initiatives

we're seeking a highly skilled Front-End CAD Engineer to join our local engineering powerhouse from the ground up.

As a Front-End CAD Engineer, you will be the backbone of our chip design ecosystem. You wont just be using tools; youll be architecting the methodologies, automation scripts, and design flows that enable our hardware teams to push the limits of silicon performance. Your work directly impacts the productivity of the design team and the time-to-market for our next-generation processors.


Key Responsibilities

Develop, maintain, and optimize RTL generation tools, building automated IPs and SoC schemes
Create robust applications using Python and Tcl to automate models build, regression and analysis tools and other assisting tools for all disciplines in front-end flows
Evaluate and integrate Electronic Design Automation (EDA) tools from vendors like Cadence, Synopsys, and Mentor Graphics
Define the methodologies of usage and integrate AI tools in this fast-growing field impacting all VLSI development flows

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Extraction to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.

Key Responsibilities

Develop, qualify, and maintain automated RC extraction flows for high-performance AI SoCs
Own the setup and validation of foundry technology files (e.g., StarRC/Quantus techfiles, TLU+, ITF) across various process corners
Perform correlation studies between different extraction tools and 3D field solvers (e.g., Raphael, QuickCap) to ensure modeling accuracy
Collaborate closely with the Signal Integrity (SI) and Power Integrity (PI) teams to provide accurate parasitic data for critical high-speed nets and power grids
Implement automated scripts (Tcl/Python) to streamline extraction regressions, data parsing, and PEX-to-STA (Static Timing Analysis) handoffs
Analyze the impact of layout effects (LDE) and parasitics on timing and power, providing feedback to the implementation team to optimize PPA
Interface with EDA vendors and foundries to resolve extraction tool bugs and methodology gaps related to advanced nodes (5nm/3nm)

Tax Analyst will be responsible for tracking record and keeping businesses compliant with various applicable tax laws. Will seek and explore relevant incentives and impact of direct and indirect taxes, transfer pricing and filing requirements. Prepare tax estimations and tax accounting analysis and planning. Prepare material, oversee audit and seek potential tax saving opportunities.
in particular the Tax Analyst will be responsible for the following tasks:
Preparing and review of quarterly and annual income tax provisions and tax accounting
Forecasting quarterly global tax rate and expenses.
Administering tax audits on worldwide basis
Explore relevant tax regulations and investigate applicable tax law developments
Identifying and communicate issues that may arise in tax dealings
Record keeping of foreign income tax filings
Reconciling income tax accounts
Calculating and managing income tax advance payments exploring for benefit programs
The Tax Analyst will report to the Corporate Tax Director.

we are a world leader in 3D printing!
we are leading the global shift to additive manufacturing with innovative 3D printing solutions for industries such as aerospace, automotive, consumer products and healthcare. Through smart and connected 3D printers, polymer materials, a software ecosystem, and parts on demand, our company solutions deliver competitive advantages at every stage in the product value chain. The worlds leading organizations turn to our company to transform product design, bring agility to manufacturing and supply chains, and improve patient care.
As part of this role you will:
Provide on‑line engineering support and resolve mechanical/technical issues fast.
Improve yield, cycle time, labor efficiency, and overall production performance.
Maintain and optimize work instructions, documentation, tooling, and fixtures.
Support NPIs/EOL and collaborate with cross‑functional teams, subcontractors, and partners.
Reduce rework and scrap and lead second‑source qualifications to strengthen quality and supply resilience.

we're seeking a highly skilled Physical Design Engineer specializing in EMIR & Power Integrity to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will execute the Electro-Migration and IR Drop (EMIR) analysis and sign-off from block level to full-chip, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering. You will be responsible for validating power grid architectures to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Execute static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from the block level through to full-chip sign-off
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Work with Physical Design teams to implement optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Collaborate closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Perform root-cause analysis for voltage drop violations and EM risks, proposing and implementing layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with strict foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

We at our company are passionate believers in the value and power of 3D printing, and in the change it can bring to design, innovation and manufacturing. The solutions we create are used by over 20,000 enterprises worldwide, and are rapidly changing the way products are imagined, designed, marketed, produced, supplied and sold. We are literally shaping the world that surrounds us - from the products and services in our lives and homes, to our health and quality of life, our transport, security and economies, to how we teach, research and even learn.
The Global Planner & Floor Controller Student is responsible for planning, scheduling, and monitoring global production and material flows to ensure on-time delivery and operational efficiency. They coordinate between production sites, logistics, procurement, and warehousing to balance capacity, manage constraints, and maintain execution visibility. The role drives floor control activities, tracks work orders, and ensures alignment between planning and real-time factory performance.
Location: Kiryat Gat
Key Responsibilities:
Plan and oversee raw material (RM) requirements in alignment with production plans and forecasts, issue PR, and follow up on the supply plan.
Ensure material availability and timely supply to support production schedules
Collaborate with procurement, logistics, and production teams to ensure smooth and efficient material flow
Maintain and update production-related data, including inventory levels, shortages, and delivery schedules
Analyze data across two ERP systems to identify gaps, discrepancies, and improvement opportunities
Manage raw materials (RM) from receipt and quality release through transfer to the tolling site and final consumption
Ensure alignment and accuracy between internal records and toller stock levels, managed across separate ERP systems
Identify discrepancies, conduct root cause analysis, and drive resolution of issues.