דרושים » חשמל ואלקטרוניקה » Senior DFT Engineer

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we're seeking a visionary Physical Design Subsystem (Multiple IPs/Partitions) Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As the Physical Design Subsystem (Multiple IPs/Partitions) Lead you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SubSystem with your team for chips that drive the worlds largest AI clusters. You will lead the team and the transition from RTL to GDS, ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

Build and mentor a high-performing Partitions team , owning the end-to-end execution from Synthesis to Signoff
Take full ownership of Subsystem physical implementation, including floorplanning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Lead and guide external contractors and global partners to ensure seamless execution and delivery
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation

Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization

Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration

Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter

we are the production TEST team - responsible for the definition, development, and deployment of production TEST operations for the worlds most advanced socs for adas and self-driving vehicles.
this is your opportunity to join a team during its initial forming stage and leave your mark as our company assumes full ownership for its silicon production operations to enable high volume manufacturing for cutting-edge automotive products. what will your job look like?
work closely with the design teams from early stages of the design process to review dfx architecture and define TEST requirements.
define TEST methodologies and generate TEST content for high-speed interfaces of Embedded ip blocks (lpddr4/5, pcie gen4/5, d/ C /mphy).
TEST program coding, pattern conversion and pre-si validation (virtual TEST simulations)
support load board and probe card design activities.
lead post-si TEST program debug activities to enable delivery of samples to internal and external customers.
TEST program characterization and tuning to enhance TEST program quality to meet automotive standards.
support quality & reliability team to enable effective and timely qual plan execution.
lead TEST deployment activities with tier-one foundry and osat vendors to enable large-scale wafer-sort and final- TEST operations.

As a Principal/ Senior Principal ASIC Architect, you will be the blueprint creator for the future of AI infrastructure. You won't just follow specifications-you will lead the definition and execution of next-generation ASIC solutions targeting hyperscale data centers. From analyzing market requirements to guiding products through their entire lifecycle, your influence will be etched into the silicon that enables the next era of scale-up and scale-out connectivity. If you thrive on solving complex, unnamed challenges and want to shape the architectural foundation of AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Architectural Definition & Strategy

Lead the architectural definition of next-generation ASICs, translating complex market requirements into elegant, high-performance hardware specifications
Drive technical decision-making that balances power, performance, area, and cost (PPAC) to maintain competitive edge in the hyperscale ecosystem
Leverage deep domain expertise to integrate industry standards (Ethernet, UALink, PCIe) into cohesive systems solving demanding AI infrastructure challenges
Product Lifecycle Ownership

Own the architectural journey from initial concept through design, implementation, tapeout, and mass production
Ensure final products deliver on performance promises and meet hyperscaler requirements
Drive architectural exploration and performance modeling to validate design decisions
Technical Leadership & Cross-Functional Collaboration

Act as the technical North Star for the engineering organization in Israel
Collaborate across Architecture, Design, Verification, DFT, and Backend teams to ensure seamless execution
Influence and align cross-functional teams around unified technical vision through strong communication and leadership

As the Physical Design Chip Top Expert you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SoC Top level for chips that drive the worlds largest AI clusters. As PD Top Level Lead, you will own all PD disciplines of the Chip and own the T.O GDS that meet the chip signoff Criteria (Timing, LVS, EMIR, DRC, PV etc. ) ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

SoC Top level Ownership and oversee the Chip convergence.
Take full ownership of Top Level physical implementation, including floor planning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Work Closely with Package team on Bump map to Ballout taking into consideration all Signal integrity aspects

about the job
be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
the ai and infrastructure team is redefining whats possible. we empower our company customers with breakthrough capabilities and insights by delivering ai and infrastructure at unparalleled scale, efficiency, reliability and velocity. our customers, our company cloud customers, and billions of our company users worldwide. we're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge ai models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. from software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our tpus, vertex ai for our company cloud, our company global networking, data center operations, systems research, and much more.
responsibilities
collaborate with architecture, design, and verification teams to develop new product bring-up, validation, characterization, and qualification strategies, manufacturing TEST solutions for new high performance computing (hpc) products in advanced process technologies.
verify TEST solutions on pre-silicon models (simulation or emulation) and develop ate TEST modules, dc tests, binning, production flows, and characterization flows.
develop and validate TEST programs on ate platforms for new product integration (npi) in preparation for high volume manufacturing (hvm), working with ate vendors.
support product sustainability, including volume data analysis of screening and characterization data, TEST time and yield improvements, TEST escapees and return merchandise authorizations (rmas) assessments, failure localization, containment measure implementation, and partnership with design manufacturing, quality, and reliability teams to root cause and implement corrective actions.
develop tools, flows, and methodologies to continuously improve and automate the testing.