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About Us: HSL (HighSecLabs) is a leading high-tech company specializing in cybersecurity and advanced technology solutions, including secure electronic enclosures and isolation systems for defense, government, and critical infrastructure. We pride ourselves on a professional, supportive, and growth-oriented work environment where employees can develop and thrive.
We are currently seeking a Senior Mechanical Designer for a full-time position. This is an excellent opportunity to lead complex projects from concept to mass production and make a real impact in a dynamic, innovative environment.
Responsibilities Develop and lead mechanical assemblies in collaboration with hardware engineers. Design structures and enclosures for products compliant with MIL-STD-810 (airborne and ground systems). Work with SOLIDWORKS and prepare detailed drawings of parts and assemblies. Support manufacturing and assembly processes, including work with suppliers in Israel and abroad. (Advantage) Thermal, cooling, and optical design of systems.

Responsibilities
Design the mechanical aspects of the entire system and its components. Create production and assembly drawings. Collaborate effectively as a member of the R&D team. Engage in hands-on activities. Facilitate knowledge transfer to team members.
we offer a stimulating work environment where talented professionals can thrive. If you are passionate about cutting-edge technologies, eager to contribute to a dynamic team, and dedicated to delivering excellence, we invite you to apply today. Join our purpose-driven culture and help shape the future of data center cooling solutions.
Location- Sderot

The New Product Introduction (NPI) Leader Engineer will function as a key member of the Operations team, ensuring an orderly transition from R&D to Operations. The NPI / Product Lead Engineer will be responsible for new product introduction, manufacturing processes, product documentation, technical aspects, tooling, support test equipment, and automation for both new and existing products. In addition, the engineer will support sustaining manufacturing products and activities.

Responsibilities
Responsible for building and managing Product/Production file, Product documentation, BOM, jigs/tools/Fixtures design, DFXs, production needs and troubleshooting.
Serve as the Operations technical focal point and collaborate cross functionally with R&D, engineering, supply chain, quality in the electronic/electrical discipline
Lead test-related projects with subcontractors delivering electrical and mechanical test equipment to the production line.
Responsible for conducting the product ECO process, including implementation and configuration control.
Manage and execute FAIs at subcontractors sites.
Validate manufacturing processes to meet targets for production output and quality standards.
Support Operations engineering processes such as waivers and deviations, EOL, FMEA, root cause analysis, continuous improvement, and audits. Support ongoing production processes and equipment and train subcontractors and production lines.
Support IQC, IPQC, and OQC documentation and processes.
Implement manufacturing transfer requirements, including TTP from Afimilk to suppliers and contract manufacturers and their second tier, if applicable.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

we are leading the global shift to additive manufacturing with innovative 3D printing solutions for industries such as aerospace, automotive, consumer products and healthcare. Through smart and connected 3D printers, polymer materials, a software ecosystem, and parts on demand, our company solutions deliver competitive advantages at every stage in the product value chain. The worlds leading organizations turn to our company to transform product design, bring agility to manufacturing and supply chains, and improve patient care.
As part of this role you will:
Provide on‑line engineering support and resolve mechanical/technical issues fast.
Improve yield, cycle time, labor efficiency, and overall production performance.
Maintain and optimize work instructions, documentation, tooling, and fixtures.
Support NPIs/EOL and collaborate with cross‑functional teams, subcontractors, and partners.
Reduce rework and scrap and lead second‑source qualifications to strengthen quality and supply resilience.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews