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We are looking for a versatile Senior Software R&D Engineer and a dedicated team member to join our multidisciplinary group. This role places a heavy emphasis on hardware bring-up, low-level software development, and collaborative engineering. You will be a core player in a tight-knit team, moving seamlessly between different phases of system creation-from architecting board support packages (BSPs) and troubleshooting new hardware boards to designing high-performance application features.
Location: Ramat Hachayal, Tel Aviv. Hybrid option once a week.
Responsibilities:
Active Team Member: Collaborate daily within a diverse R&D team. Brainstorm solutions, conduct peer code reviews, and share knowledge to elevate the teams capabilities.
Hardware Bring-up & BSP: Lead the software-side bring-up of next-generation hardware. Design, develop, and debug Board Support Packages (BSPs) to seamlessly bridge the hardware-software boundary.
HW/SW Integration: Partner closely with hardware engineers to diagnose system-level bottlenecks, read schematics, and ensure optimal hardware performance.
Real-Time Feature Implementation: Design and develop high-performance software features and real-time application layers for our flagship product.
Product Implementation Design: Translate complex product requirements into scalable, highly reliable software designs and system architecture.

Required Design Verification Vision Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, youll work to shape the future of an edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive cutting-edge distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead the verification of an edge AI IP, to be used in our edge-AI products.
Lead a team of chip verification engineers. Plan tasks, allocate people, hold verification design/code reviews, and drive verification execution.
Plan the verification of digital design blocks, including writing test plans, and other verification documents.
Code development of verification features and capabilities, and participate in RTL debug.
Work closely with Architecture, Software, Design, and Physical Design stakeholders to make technical decisions and represent project status throughout the development process.

As a key member of our best-in-class CAD Group, you will be part of building innovative designs. We will apply your hands-on experience in power EM/IR analysis to develop, define and refine the methodologies and flows for gate-level, as well as transistor level designs. Major tasks will include functional static / dynamic IR analysis, scan mode IVD analysis, package and interposer model handling, 3DIC and multi die analysis, power EM analysis, SigEM, power switch modeling, design abstract and reuse for EM/IR purposes, IP / SoC level EMIR sign-off / ECO, and much more.

In this highly visible role, your primary responsibilities will include:
- Development of custom EM/IR solutions that scale with accuracy and capacity challenges.
- Streamline and automate EM/IR flow with ownership of the entire flow.
- Support and collaborate with design groups (Physical-design and integration, Circuit-design / Power / Package & System / Technology) on their EM/IR requirements for various post-layout flows.
- Work side by side with EDA vendors and foundries for tool qualification, debug, and enhancement.

We are seeking a Physical Design Manager.
Meet the Team:
Physical Design team within Silicon One is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Your Impact:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As the Physical Design Manager, you will provide strategic and technical leadership to a team of engineers, guiding them through the entire chip design lifecycle. You will be responsible for the group's output, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

we are seeking an ATE TEST Development Engineer! The role includes development of Automated TEST Equipment (ATE) TEST stations, including digital tests and RF tests. The engineer will be responsible for TEST system development from the requirements definition stage through delivery of the TEST system to the customer and its maintenance. The role also includes technical characterization and definition of project documents such as SPEC, SOW, TRD. Education Required: Bachelors degree in Electrical Engineering.

We are looking for an Experienced System Engineer to join the Elipson System Engineering team (Raman spectroscopy product line).
Part of our Elipson System Engineering organization (metrology for high-volume semiconductor manufacturing)
Own system-level features and capabilities end-to-end taking ideas from concept and feasibility through specification, implementation, qualification, and customer deployment - to improve product performance, stability, and customer success
Work closely with software, optics, algorithm, electronics, and mechanical engineering teams, and support customers worldwide (in-house and on-site)
Hands-on, physics-based system problem solving spanning optics, spectral signal processing, calibration design, performance analysis, and automation-on a tool deployed at leading semiconductor manufacturers
Responsibilities
What will you be doing:
Perform advanced root cause analysis and troubleshooting of complex, physics-based system issues, both in-house and at customer sites
Conduct proof-of-concept and feasibility testing for new hardware, software, and algorithmic features.
Drive system-level features end-to-end: translate customer needs into feasibility studies, system requirements, cross-discipline design, and qualification plans
Collaborate closely with software, optics, algorithm, electronics, and mechanical engineering teams to deliver robust system performance
Perform data analysis and statistical evaluations to support system development decisions and customer performance optimization
Conduct performance analysis, error budgeting, and system characterization to quantify and reduce measurement variability
Design and implement system tests and calibrations (including specification definition and Python-based scripting/automation).

Our Systems Group is looking for a Systems Engineer to join the Integrated Metrology team, a multidisciplinary group of physicists and engineers working together to implement cutting-edge metrology technologies in the semiconductor industry from a unique and innovative perspective.
Responsibilities
What you will be doing:
Perform theoretical and experimental systems engineering to support state-of-the-art new and existing multidisciplinary optical measurement products
Drive the full lifecycle from customer needs through feasibility and concept evaluation, leading to cross-disciplinary system requirements, while defining and managing system KPIs
Conduct laboratory and on-site system diagnostics, troubleshooting, and problem-solving, including root-cause analysis, mitigation plans, implementation of robust system calibration methods, and product transfer to manufacturing
Work closely with multiple disciplines, including physics, optics, algorithms, mechanics, electronics, and software
Translate customers high-level requirements into detailed technical specifications
Travel to customer sites worldwide (2-3 times per year).

The Engineering department is looking for a Product Leader to be responsible for End-to-End system engineering related aspects
our Engineering department is part of DMD division.
You will be responsible for overseeing all NPI-related processes, ensuring manufacturability and sustainability across our multidisciplinary products, including both hardware and software.
Responsibilities
What will you be doing:
Lead NPI activities from the early design phases (DFx, prototyping) through the first article stage, implementation (High Volume Manufacturing), and ongoing sustainability
Lead and support aspects of existing products through ECO, including new Design, Failure Analysis, Wavers review, End Of Life substitute, Procedures
Act as a focal point with Supply Chain, Purchasing, Quality, Logistics, Service and R&D
Responsible of System aspects in Production line, through product cycle- NPI to End of Life
Support Production requirements, jigs/ test tools, troubleshooting, cost reduction activity and reliability.

Our Engineering department is seeking an NPI Electronic Engineer responsible for end-to-end electronics engineering aspects.
You will join the Engineering team within the DMD division and take ownership of all NPI-related processes. The role focuses on ensuring manufacturability and sustainability across our multidisciplinary products, including both hardware and software.
Responsibilities
What will you be doing:
Lead NPI activities from concept and DFx through first article, high volume manufacturing and ongoing sustainability
Own electronic modules through the full product cycle, NPI to End of Life
Lead ECO processes including new design introduction, Failure Analysis, Waiver reviews, EOL substitutions, and Procedure updates
Support Production with jigs, test tools, troubleshooting, cost reduction, and reliability improvements
Act as the focal point with Supply Chain, Purchasing, Quality, Logistics, and R&D
Source electronic components including PCBs, power supplies, cables, and electromechanical assemblies; define alternatives for obsolete or at-risk parts.

we are looking for a Senior Core Datapath Engineer.
Roles and Responsibilities:
Design, develop, and enhance I/O subsystems, virtualization, kernel programming, and memory management for cutting-edge system software products.
Drive performance optimization, and efficient memory management.
Perform in-depth debugging, triaging, and resolution of user and kernel-level, performance profiling, and memory-related issues.
Develop innovative solutions, addressing challenges in virtualization, multithreading, and hardware-software interaction.
Explore and implement new methodologies fostering continuous improvement and innovation.
Proactively identify bottlenecks in system design, and recommend and implement robust, scalable solutions.
Stay updated on evolving trends in kernel development, design, and virtualization technologies to bring innovative practices to the team.
Troubleshoot and optimize complex I/O and kernel features to enhance performance, scalability, and reliability.
Collaborate with cross-functional teams to align on design goals and ensure seamless integration with the system architecture.
Exhibit flexibility in taking on new or related tasks, showcasing adaptability and a proactive, problem-solving mindset.
Provide technical leadership in architecture design, problem-solving, and decision-making across complex technical domains.
Lead technical discussions, design reviews, and decisions on critical system challenges, driving the adoption of innovative solutions and best practices.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.