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We're looking for a hands-on systems engineer to lead prototyping and low-volume assembly (tens to hundreds of units) - taking hardware from first builds to a repeatable process, designed with scale-up and BOM cost in mind.
Responsibilities :
Lead prototype and pilot builds; turn lessons into a repeatable assembly process.
Plan assembly flows, fixtures/jigs, and the right (minimal) automation - engineering simplicity first.
Own the project plan (Gantt) and budget; design for scale-up with BOM cost awareness and DFM feedback to R&D.
Define test and inspection strategy, including environmental testing where needed.
Measure and improve yield and rework with data; work daily with R&D, production, and vendors on the floor.

Semi Conductor Devices (SCD), a leading worldwide supplier of high-end Infrared Detectors and thermal imaging cores, is looking for an Analog / Mixed-Signal VLSI Designer to join its VLSI R&D group. The role involves design and validation of custom analog and mixed-signal ASICs (ROICs) for advanced IR imaging systems, working closely with experienced analog, digital, system, and hardware teams.
Responsibilities:
Design and verify Analog and Mixed-Signal circuit blocks for IR image sensors (ROICs) under the guidance of senior designers Participate in the full ASIC development flow: specification review circuit design verification integration silicon bring-up lab validation Contribute to block-level simulations, documentation, and design reviews Work closely with digital designers, layout engineers, electronics, and system teams to support chip integration Support post-silicon validation and lab measurements, including debug and correlation to simulations Gain exposure to advanced CMOS processes, image sensor architectures, and system -driven design constraints.

The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

*Part-Time or Full-Time Opportunity

Responsibilities:
The research focuses on designing next-generation rack and SuperPod architectures that combine elasticity through resource pooling with optimal performance enabled by holistic co-design across applications, parallel programming models, interconnect fabrics, and compute, memory, and switch chip architectures. On the communication side, the work architects scalable, high-bandwidth, and low-latency scale-up fabrics across multiple chips at rack and SuperPod scale. On the memory side, it explores richer protocol semantics beyond traditional load/store operations to reduce unnecessary data movement and rethinks memory hierarchies to expose large-scale capacity with near-local latency. On the compute side, it analyzes the requirements of General Compute and Generative AI workloads and their parallel programming models to fully leverage large-scale system resources.
Investigate and prototype new architectural features, including but not limited to:
o Tiered Memory: Explore advanced memory organizations, including hardware-managed caching, to enable software-transparent, fine-grained promotion and demotion of cache lines across the memory hierarchy.
o Prefetching/Speculation: Evaluate and design existing and next-generation hardware prefetching and speculation mechanisms to effectively hide local and remote memory latencies at rack and SuperPod scale.
o Near-Memory/Network Processing: Develop support for key primitives executed at the memory and network layers to minimize unnecessary data movement across sparse, dense, and pointer-based data structures.
o Workload-Centric Co-Design: Study optimal parallelization strategies at rack and SuperPod scale for both General Compute and Generative AI workloads, and design dedicated hardware support for widely used parallel programming primitives such as RPCs and collective communication.
Write reports and papers on the research results and present them.

Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.

*Part-Time or Full-Time Opportunity

In this job opening, we are seeking a highly motivated and visionary researcher to join our team focused on chiplet-based computing systems. This role involves research and development in chiplet-based architectures, aiming to overcome performance and scalability limits of traditional compute platforms.

Responsibilities:
Conduct cutting-edge research on the co-design of communication and computation for wafer-scale systems. On the communication side, the work focuses on architecting Networks-on-Chip, providing scalable, high-bandwidth, and ultra-low-latency interconnects that efficiently span multiple dies and support fine-grained data movement. On the computation side, the research emphasizes optimizing and mapping training and inference workloads to fully exploit wafer-scale resources, improving performance, scalability, and energy efficiency through intelligent task placement and scheduling.
Investigate various aspects of system design, including:
Network-on-Chip design, further including Topology exploration, routing algorithms, and protocol/flow-control design to support high-throughput collective communication, low-latency synchronization, and efficient model/data parallelism
Expressing and Mapping LLM Parallelism to Wafer-Scale System that simplify LLM parallelism (e.g., tensor, pipeline, and data parallelism) and efficiently map training and inference workloads onto wafer-scale system

As HW Architect Team Leader, you will combine deep technical leadership with people leadership. You will shape next-generation networking silicon while building and mentoring a strong architecture team.

What Youll Be Doing
Lead, manage, and mentor a team of HW architects, fostering technical excellence and innovation.
Drive research, evaluation, and architectural definition of next-generation SoCs - from product requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet and NIC switches.
Lead system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate cross-functionally with design, verification, modeling, software, and other architecture teams to ensure end-to-end system alignment.
Identify and evaluate new technologies, methodologies, and architectural approaches for future products.
Provide technical direction, make key architectural trade-offs, and ensure execution excellence.

We are looking for an ATE Engineer to join our multidisciplinary team in central Israel.
The role involves developing and implementing complex automated test solutions, from requirements analysis through direct integration with hardware and Automated Test Equipment (ATE).
Key Responsibilities:
Translate Test Requirements Documents (TRD) into automated Test Sequences/Scenarios using NI TestStand or OTM (ORION).
Develop, maintain, and enhance automated test sequences and deploy them in laboratory environments.
Integrate measurement instruments and communication protocols with ATE systems, perform debugging, and support troubleshooting activities.
Develop software components and DLLs in C# or C for hardware communication, when required.
Work closely with Hardware, Electronics, and Integration teams, including reading and interpreting electrical schematics.