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Lead electronic board design for motion control and power applications, from concept to release (architecture, schematics, component selection, design reviews).
Own and manage the BOM: component selection, cost/performance optimization.
Work closely with PCB layout engineers: define constraints, stack up, routing rules for power, signals, EMC/EMI, and manufacturability (DFM).
Define and support PCB and board manufacturing for prototypes and samples (PCA): documentation, fabrication files, manufacturer interface, and build readiness.
Perform board bring-up, lab debug, and HW validation, including power stages, control, interfaces, sensors, and communication buses.
Define and execute HW verification and validation tests.
Provide hands on support to Embedded and FW engineers.
Bring manufacturing know how into the design: DFM/DFT considerations, TEST points, penalization

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem.
Virtually every electronic device in the world is produced using our technologies.
No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us.
KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays.
The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development.
KLA focuses more than average on innovation and we invest 15% of sales back into R&D.
Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the worlds leading technology providers to accelerate the delivery of tomorrows electronic devices.
Life here is exciting and our teams thrive on tackling really hard problems.
There is never a dull moment with us.

Job Description/Preferred Qualifications :
KLA-Tencor has manufacturing sites across the globe, including Belgium, China, Germany, Israel, Singapore and Milpitas (CA). The Global Operations (GOPS) team, comprised of Manufacturing, Supply Chain Management, Manufacturing Engineering, Installation, and Quality, is responsible for manufacturing our leading-edge technology. We partner with our world-wide supply base and our design engineering teams to bring new products to market. The GOPS team is continuously working to build our products Better, Faster, Cheaper.

The Film and Scatterometry Technology (FaST) Division provides industry leading metrology solutions for worldwide semiconductor IC manufacturers. The FaST Division portfolio of metrology products includes hardware and software solutions for optical film thickness, optical critical dimension (CD), composition, and resistivity measurement systems. These products are essential for the IC manufacturers as they provide critical metrology capabilities for the development and implementation of their advanced IC processes. The division consists of a global team located in US, Israel, China, and India.

We offer a competitive, family friendly total rewards package. We design our programs to reflect our commitment to an inclusive environment, while ensuring we provide benefits that meet the diverse needs of our employees.