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Mechatronics & Components Engineer We are seeking a Mechatronics & Components Engineer to support the development of advanced products through selection, evaluation, and integration of mechanical and electromechanical components.

About Us: HSL (HighSecLabs) is a leading high-tech company specializing in cybersecurity and advanced technology solutions, including secure electronic enclosures and isolation systems for defense, government, and critical infrastructure. We pride ourselves on a professional, supportive, and growth-oriented work environment where employees can develop and thrive.
We are currently seeking a Senior Mechanical Designer for a full-time position. This is an excellent opportunity to lead complex projects from concept to mass production and make a real impact in a dynamic, innovative environment.
Responsibilities Develop and lead mechanical assemblies in collaboration with hardware engineers. Design structures and enclosures for products compliant with MIL-STD-810 (airborne and ground systems). Work with SOLIDWORKS and prepare detailed drawings of parts and assemblies. Support manufacturing and assembly processes, including work with suppliers in Israel and abroad. (Advantage) Thermal, cooling, and optical design of systems.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

be part of a team that pushes boundaries, developing custom silicon solutions that power the future of direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our mission is to organize the world's information and make it universally accessible and useful. our team combines the best of ai, software, and hardware to create radically helpful experiences. we research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. we aim to make people's lives better through technology.as a power and signal integrity engineer, you will be responsible for the design and characterization of signal and power integrity of our ic designs. you will design the external electrical interfaces of the device, from their signal/power-integrity and electrical usage perspectives.you'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our ic designs meet systems design budgets and achieve the highest performance. you will work with systems architects, asic design, systems engineers, and partner cross-functionally with teams and external vendors/partners.the ml, systems, & cloud ai (msca) organization at designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all services (search, youtube, etc.) and cloud. our end users are, cloud customers and the billions of people who use services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
design and optimize power distribution networks (pdn) across chip, package, and board levels. this includes managing power/ground planes, decoupling capacitors, and power gating strategies.
conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (ssn/sso), voltage drops (ir drop), and electromagnetic interference (emi).
implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like upf/cpf.
generate precise electrical models (e.g., s-parameters, spice models) for components such as packages, pcbs, and connectors for use in simulations.
execute lab measurements utilizing TEST equipment like oscilloscopes, vector network analyzers (vna), time domain reflectometers (tdr), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

A leading medical device company developing advanced minimally invasive technologies is seeking an experienced and motivated Mechanical Engineer to join its R&D team. This role reports to the Director of R&D and offers the opportunity to work in a dynamic, fast-paced environment.

we are a fast-growing, global leader in energy-based solutions for Aesthetics and Eye-Care. We are based in Yokneam, Israel (with offices also in Tel-Aviv) with a strong business performance worldwide.
Main Duties: Manage a product line lifecycle from all technical aspects. Design transfer support, solving production problems, post launch support.
Managing projects in engineering department
Manage subcontractor activities
Design transfer to production
Leading cost reduction activities with Procurement department
Leading quality improvement activities (Design, processes)
Supporting production (subcontractors)
ECO initiation and management.

Managing a service product throughout its entire life cycle. This involves creating comprehensive technical documents and training programs, as well as facilitating communication between internal departments to ensure accurate execution of product services and processes. The role also focuses on ensuring the profitability and market success of the service, requiring collaboration with various organizational groups and proactive problem-solving to preempt potential issues and provide effective solutions.
Provide support to company subsidiaries, service department, distributors, and service recondition center
Prepare technical documentation: product descriptions, service manuals, spare parts lists, technical Notes and training programs
Manage and analyze the product service activity from profit and loss aspects, and ensures management of a profitable service in the marketplace
Develops pricing and pricing changes and manages tariff updates in partnership with After-Sale and Finance.
Interfaces between the field and various organizational groups like Engineering, R&D, Planning, Financial Controls/Management Accounting, Sales, Marketing, etc.
Leads regularly scheduled meetings focused on system and operational solutions for failures, product changes, and new product development.
Implement and integrate new products and new processes with service field teams and subsidiaries
Define service processes, spare parts, tools, and testing criteria
Training-lead frontal classroom training courses including theory and hands-on sessions
Track faults and malfunctions, perform technical investigations, and apply conclusions
Execute global service and control policy and maintain compliance with company policies and procedures.