דרושים » ייצור ותעשייה » Mechatronics & Components Engineer (6225)

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

be part of a team that pushes boundaries, developing custom silicon solutions that power the future of direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our mission is to organize the world's information and make it universally accessible and useful. our team combines the best of ai, software, and hardware to create radically helpful experiences. we research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. we aim to make people's lives better through technology.as a power and signal integrity engineer, you will be responsible for the design and characterization of signal and power integrity of our ic designs. you will design the external electrical interfaces of the device, from their signal/power-integrity and electrical usage perspectives.you'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our ic designs meet systems design budgets and achieve the highest performance. you will work with systems architects, asic design, systems engineers, and partner cross-functionally with teams and external vendors/partners.the ml, systems, & cloud ai (msca) organization at designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all services (search, youtube, etc.) and cloud. our end users are, cloud customers and the billions of people who use services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
design and optimize power distribution networks (pdn) across chip, package, and board levels. this includes managing power/ground planes, decoupling capacitors, and power gating strategies.
conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (ssn/sso), voltage drops (ir drop), and electromagnetic interference (emi).
implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like upf/cpf.
generate precise electrical models (e.g., s-parameters, spice models) for components such as packages, pcbs, and connectors for use in simulations.
execute lab measurements utilizing TEST equipment like oscilloscopes, vector network analyzers (vna), time domain reflectometers (tdr), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

We are redefining urban mobility by proving that autonomous vehicles can navigate complex environments using vision-only technology.
As our Hardware Systems Integration Engineer, you will be the lead architect responsible for the "nervous system " of our vehicles. You won't just be selecting components; you will be evaluating infrastructure that enables our AI software to see, process, and React to the world in Real-Time.
Responsibilities:
* Vision-Centric Architecture: Lead the selection and integration of high-dynamic-range (HDR) automotive-grade cameras.
* Compute Platform Selection - Evaluate and benchmark high-performance edge platforms (e.g., NVIDIA Orin, Qualcomm Snapdragon, Ambarella, or custom SOC solutions) capable of handling massive parallel video streams with minimal latency.
* Thermal & Power Integrity: Design integration of computing HW into automotive grade environment. This work can be done with external suppliers.
*  system Synchronization: design and ensure sensor synchronization.
* Redundancy Planning: architect fail-operational hardware systems to ensure the vehicle remains safe even if a specific component or communication bus fails.
* Present to and consult with the group leaders as to hardware design trade-offs

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

about the job
be part of a team that pushes boundaries, developing custom silicon solutions that power the future of direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.the ml, systems, & cloud ai (msca) organization at google designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all google services (search, youtube, etc.) and google cloud. our end users are googlers, cloud customers and the billions of people who use google services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including google clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
lead the schematic capture and component selection for high-density, multi-layer pcbs (20+ layers) incorporating high-power asics (tpus/cpus), fpgas, and high-speed memory (hbm/ddr5).
design and validate high-speed interfaces including pcie gen 6.0/7.0, 400g/800g/1.6t ethernet (pam4). collaborate with signal integrity (si) engineers to define routing constraints and stack-up.
design multi-phase power regulators (vrms) capable of delivering >1000a currents with fast transient response for ai processors.
work with pcb layout designers to guide placement and routing of critical signals and power planes.
lead the lab bring-up of first-silicon/first-board by debugging hardware issues using oscilloscopes, tdrs, and logic analyzers to root-cause failures to component, assembly, or design issues.

Define the AI core architecture that will shape the next generation of AI chips, leading the global competition in AI computing power. As a key contributor to the competitiveness of AI core architecture, we drive chip architecture innovation starting from algorithm evolution, building a full-stack closed-loop capability of "algorithm-architecture-circuit-system," and creating a globally leading, independently controllable AI accelerator core to support the Ascend AI ecosystem and the implementation of large model strategies.
Responsibilities:
Modeling of HW specification of new architecture and microarchitecture. Working closely with architect and microarchitecture on modeling the specification.