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We are looking for a highly skilled Senior Thermal-Mechanical Engineer to join our mechanical engineering team as a key player in the development of next-generation high-performance compute platforms for autonomous driving systems.
This key position includes leading the thermal-mechanical design and cooling architecture of advanced electronic systems throughout all lifecycle stages-from concept to mass production-while working closely with hardware, PCB layout, mechanical, validation, manufacturing, suppliers, and customers.
What will your job look like?
Lead the thermal-mechanical design process from concept through validation, NPI, and production.
Define cooling architectures and optimize air- and liquid-cooling solutions for high-power electronic systems.
Perform thermal simulations and analyses using tools such as Icepak, FloTHERM, Fluent, or equivalent.
Perform mechanical simulations and analyses using tools such as ANSYS Mechanical, Abaqus, Nastran, or equivalent.
Correlate simulation results with lab measurements and drive solutions that meet system requirements.
Lead thermal validation, prototyping, environmental testing, and reliability activities.
Collaborate closely with cross-functional teams, suppliers, subcontractors, and customers.
Support mechanical design and serve as a technical focal point for complex thermal-mechanical challenges.

We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.