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The NPI Engineer is positioned at the interface between Engineering R&D and Manufacturing teams - providing technical and operational support throughout the product development and manufacturing lifecycle.
The role is responsible for ensuring product data accuracy, manufacturing readiness and resolving technical challenges encountered during assembly processes.
The position requires a strong technical foundation, attention to detail and a solid understanding of electronic components, PCB assemblies and manufacturing processes.

We are seeking a highly motivated NPI Engineer to support cross-functional Engineering R&D and Manufacturing teams.
The role requires hands-on experience with printed circuit board assemblies (PCBAs), from design through manufacturing and a solid understanding of product lifecycle management, component engineering, and manufacturing operations.
The NPI Engineer will bridge engineering design requirements with manufacturing execution, resolve technical challenges on the assembly floor and support successful product introductions in a dynamic, global environment.

Responsibilities
Support Product Lifecycle Management (PLM), including engineering changes, product data accuracy and configuration control.
Review and maintain Bills of Materials (BOMs), identifying discrepancies and risks.
Support component engineering, including part definition, catalogingd and alternative part evaluation.
Provide technical guidance on Surface Mount Technology (SMT), PCB assembly, and mechanical assembly processes.
Investigate manufacturing and quality issues, define corrective actions, and drive process improvements.
Collaborate with Engineering, R&D, Operations, and Manufacturing teams to ensure production readiness.
Develop and maintain manufacturing documentation, including assembly instructions and production specifications.

We are seeking an experienced and multifaceted Mechanical NPI & Manufacturing Engineer to own mechanical systems engineering, manufacturing transfer, advanced packaging, and thermal/liquid cooling integration across our high-performance networking portfolio.
In this role, you will lead end-to-end mechanical execution from late-stage R&D through volume manufacturing at global EMS/ODM facilities. Your scope spans chassis-level systems up to full-rack scale integration, custom packaging/palletization design, and advanced data center liquid cooling architectures. You will serve as the technical authority for mechanical quality, supplier qualification, transit reliability, and production line optimization.
Key Responsibilities
NPI Transfer & Manufacturing Execution:
Lead seamless NPI-to-mass-production transfers, cataloging & verifying BOM completeness, 2D/3D drawing releases, and fabrication readiness for standalone switches and fully integrated rack systems.
Author, validate, and maintain detailed Mechanical Assembly & Process Instructions for global contract manufacturing lines.
Define together with R&D precision assembly parameters: torque specifications, fastening tooling, screw tightening sequences, and structural assembly guidelines.
Design, validate, and commission mechanical assembly jigs, alignment fixtures, and high efficiancy tooling to ensure repeatable line assembly.
Advanced Packaging, Palletization & Logistics Engineering:
Design and validate primary and secondary packaging solutions, including custom cushioning (EPE/EPP foam), corrugated structures, and chassis transit protection.
Define ESD shielding, Moisture Barrier Bags (MBB), and desiccant requirements for high-sensitivity optical and electronic assemblies.
Optimize palletization patterns, container cube utilization, stacking strength calculations, and pallet weight distribution for global freight.
Plan, execute, and certify transit/drop testing in accordance with international standards.
Manage day-to-day shipping deviations, packaging waivers, and disposition of in-transit damage.
Labeling & Regulatory Compliance Integration:
Design unit, carton, and pallet labels; select and qualify label substrates, adhesives, and print ribbons for environmental durability (abrasion, high temperature, humidity, UV resistance per UL standards).
Manage the physical integration and placement of global regulatory markings on chassis surfaces, rating plates, and packaging.
Thermal Management & Liquid Cooling Architecture:
Address mechanical-thermal integration challenges within high-power chassis and optical cages .
Oversee mechanical validation and assembly of Liquid Cooling systems for high-density compute/switching gear, including cold plates, manifolds, quick disconnects , hoses/piping routing, fluid loop integrity, and leak detection mechanisms.

We are looking for an NPI & System Product Engineer to drive the transition of advanced networking switches and data center infrastructure systems from late-stage R&D validation & NPI into scalable mass production.
In this role, you will lead the handoff from DVT completion into PVT entry, support the setup and deployment of new production lines at global Contract Manufacturers, and execute capacity ramp-up plans toward High-Volume Manufacturing. You will serve as the technical operational link between R&D design/NPI teams and factory lines, ensuring line balancing, fixture readiness, yield optimization, and hands-on root-cause failure analysis (RCA).
Key Responsibilities
Production Readiness:
Support the technical handoff from R&D DVT exit to Operations PVT readiness.
Track and verify closure of open DVT hardware issues, check BOM readiness, and validate manufacturing gating criteria before mass production.
Execute PVT build plans to ensure product design tolerances align with factory process capabilities.
New Production Line Setup & Deployment:
Participate in the setup, line balancing, and deployment of new manufacturing lines and assembly workcells for chassis and full-rack integrated systems at CM facilities.
Validate physical workstation setups, line assembly flows, operator guidelines, and improve processes.
Verify assembly fixtures, press-fit tooling, and automated test stations during new line deployment.
Create and maintain production test procedures.
Capacity Ramp-Up & Takt Time Optimization:
Monitor station takt times, identify line bottlenecks, and drive cycle-time reduction initiatives.
Support the duplication and operational verification of line fixtures, tooling, and test stations to meet capacity scaling targets.
Track production ramp-up from pilot runs through full-rate High-Volume Manufacturing.
System Product Engineering & Yield Optimization:
Monitor key manufacturing metrics across PCBA & box-build assembly lines: First Pass Yield (FPY), Line Fallout, and Scrap Rate.
Use Statistical Process Control (SPC) and factory telemetry logs to identify systemic yield detractors.
Assist in refining production test limits, calibration procedures, and screening guardbands during volume ramp.
Root Cause Analysis (RCA) & Debugging:
Perform hands-on failure triage on system-level dropouts, intermittent hardware faults, and line fallouts during PVT and ramp-up.
Use schematics, Cadence Allegro board layouts, scopes, JTAG, and diagnostic tools to isolate component vs. process defects.