לוח משרות דרושים

If you are a hands-on person with experience in leading a team of Embedded SW engineers and you want to be a part of the Autonomous vehicle revolution, we are looking for you! As our RT Embedded SW Team Leader you will lead the development of Embedded SW involving various tools and cutting-edge technologies in Real-Time environment.
What will your job look like?
Lead a team of Embedded RT Engineers.
Develop drivers and SW support for new HW including debugging and integration.
Interact with external customers and multiple departments in our company for requirement gathering and correct integration of new features.

If you are a hands-on person with experience in leading a team of Embedded SW engineers and you want to be a part of the Autonomous vehicle revolution, we are looking for you! As our RT Embedded SW Team Leader you will lead the development of Embedded SW involving various tools and cutting-edge technologies in Real-Time environment.
What will your job look like?
Lead a team of Embedded RT Engineers.
Develop drivers and SW support for new HW including debugging and integration.
Interact with external customers and multiple departments in our company for requirement gathering and correct integration of new features.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

we are seeking Product Managers to lead the development and management of advanced features for autonomous vehicles (AVs). This role will focus on creating exceptional products for both global automotive partners and our company's internal AV development.
What will your job look like?
Act as a technical product owner, for productizing and driving our company's AV features to meet performance and quality goals.
Collaborate with internal stakeholders (R&D , Product and Business Development) and external partners to define the product roadmap, ensuring alignment with our company's strategy and timelines.
Own the process of requirements elicitation to capture stakeholder needs and translate them into actionable product specifications.
Define and monitor data-driven performance KPIs to ensure product excellence.
Develop and maintain accurate, comprehensive documentation for internal and external use.
Support Business Development during pre-sale processes and customer onboarding.
Partner with leading car manufacturers, including conducting workshops, test drives, and product tuning to ensure adoption and satisfaction.
Champion cross-functional collaboration, managing initiatives in a matrix environment to ensure successful execution.

our company's Autonomous Driving Software Group in Jerusalem is looking for an experienced C++ developer to join our team! Our group is responsible for developing new ethernet switch architecture and tools to replace existing code with a modern, scalable design. We enable support for new design wins and help scale our companys technology to run efficiently in vehicles, contributing to saving lives and enabling autonomous driving.
What will your job look like?
Take part in designing and developing large-scale network applications running on our cutting edge platforms which have our industry leading EyeQ chip.
You will work on a complex real-time system involving multiple sensors as part of a broader automotive system architecture.
The main application is developed in C++ for Linux environments.
You will develop advanced simulation software used company-wide, integrating the latest company's technologies.

Join our companys HIL Team Where Real-World Driving Meets Real-Time Simulation Be part of the innovation powering our companys autonomous vehicle technology. Our Hardware-in-the-Loop (HIL) team, part of the Simulation Group, is developing the next generation of simulation platforms - bringing real-world sensor data into the lab to enable faster, safer, and more efficient AV development. The HIL system lets developers replay precise, high-fidelity driving scenarios to test the full autonomous stack - from perception to control - using real sensors, real timing, and real-world complexity.
What will your job look like?
Design & Build a high-performance HIL simulation platform in modern C++ (C++23) for real-time data replay.
Engineer the Core: Develop the data injection engine that streams and synchronizes recorded sensor and vehicle signals with sub-millisecond accuracy.
Solve Real-Time Challenges: Tackle complex software/hardware integration problems across latency, determinism, and networking.
Optimize Deeply: Profile and debug Linux systems from user space to kernel space, resolving bottlenecks in schedulers, drivers, and memory subsystems.
Collaborate Across Domains: Work with algorithm teams, systems engineers, and other stakeholders to deliver scalable, production-ready solutions.
Stay Sharp: Continuously evolve your expertise in C++, real-time systems, performance tuning, and simulation technologies.