לוח משרות דרושים חשמל ואלקטרוניקה

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) and RF semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC and RF die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

We are looking for an experienced Automation Engineer to join our dynamic engineering team. This role is ideal for someone with a solid background in automation development, who thrives in an agile environment and is passionate about continuous learning and collaboration.
What will your job look like:
Design, develop, debug, and maintain automation solutions using Python and Airflow
Integrate and monitor workflows using Grafana for observability and alerting
Work with Visa protocol (or similar) for secure data exchange and communication
Collaborate cross-functionally with developers, product managers, and QA teams to deliver high-quality automated systems
Troubleshoot, debug, and optimize automation pipelines for performance and reliability
Contribute to architectural decisions and improvements in automation frameworks and tools
Maintain clear documentation and knowledge sharing with team members.

We are looking for a Electrical Engineer Student to join our R&D team.



Job Description:

Resolve the company products technical issues and continuously support and improve the products quality.

Conduct technical investigations and experiments, drive for root cause identification as a part of the NCMR process.

Perform verification and validation activities for the production line.

Direct Manager: HW Engineer

We are seeking a highly motivated and skilled System Engineer to join our team, focusing on automotive imaging radar systems. This role is pivotal in bridging the gap between our cutting-edge radar technology and our automotive customers' evolving needs. As the key technical focal point, you will lead customer engagements, manage system-level requirements, and ensure successful integration and performance of our radar solutions in real-world automotive applications.
What will your job look like?
Develop system requirements and architecture that align with customer needs
System architectures and flows for critical functions, including boot processes, power-on sequences, system health monitoring, and diagnostics
Engage with customers, analyze and understand customer requirements and maximize alignment with existing solutions.
Program planning with internal and external customers: define, map dependencies, and prioritize the scope of customer releases.

we are seeking a Senior Product Manager to lead the definition of our company Imaging Radar. our company Imaging Radar is designed to deliver supreme performance enabling Driving by Radar. This role will focus on creating exceptional products for both global automotive partners and our company's Autonomous Driving Platforms enabling the revolution of Autonomous Driving.
What will your job look like?
Act as a technical product owner, for defining, productizing and driving our company's Imaging Radar to lead in performance and meet the cost, vehicle integration and quality goals.
Collaborate with internal stakeholders (R&D , Product and Business Development) and external partners to define the product roadmap, ensuring alignment with our company's strategy and timelines.
Own the process of requirements elicitation to capture stakeholder needs and translate them into actionable product specifications.
Define and monitor data-driven performance KPIs to ensure product excellence.
Develop and maintain accurate, comprehensive documentation for internal and external use.
Support Business Development during pre-sale processes and customer onboarding.
Partner with leading car manufacturers, including conducting workshops, test drives, and product tuning to ensure adoption and satisfaction.
Champion cross-functional collaboration, managing initiatives in a matrix environment to ensure successful execution.

The EyeQ SoC Performance Modeling and Profiling team is part of the EyeQ Platform Group (EPG), working on both current and next-generation designs for ADAS (Advanced Driver-Assistance Systems) and Autonomous Vehicles (AV). Performance models and profiling tools are essential components of the EPG infrastructure they are used during the hardware architecture definition phase of the EyeQ chip and by software developers to optimize performance.
What will your job look like:
You will be part of team that develops EyeQ SoC Performance Modeling environment and emulators
You will work on SOC performance analysis and optimizations.
You will be running HW benchmarks, to measure HW performance and to calibrate the simulation environment to match the performance of the silicon board.
You will be working on HW performance analysis and tuning, and influence future company EyeQ SoC design.
You will have the opportunity to work on open-source simulation and profiling tools and adopt them to our company's needs.
You will work closely with HW architects and SW/Algorithms developers.

The EyeQ SoC Performance Modeling and Profiling team is part of the EyeQ Platform Group (EPG), working on both current and next-generation designs for ADAS (Advanced Driver-Assistance Systems) and Autonomous Vehicles (AV). Performance models and profiling tools are essential components of the EPG infrastructure they are used during the hardware architecture definition phase of the EyeQ chip and by software developers to optimize performance.
What will your job look like:
You will be part of team that develops EyeQ SoC Performance Modeling environment and emulators
You will work on SOC performance analysis and optimizations.
You will be running HW benchmarks, to measure HW performance and to calibrate the simulation environment to match the performance of the silicon board.
You will be working on HW performance analysis and tuning, and influence future company EyeQ SoC design.
You will have the opportunity to work on open-source simulation and profiling tools and adopt them to our company's needs.
You will work closely with HW architects and SW/Algorithms developers.

The team is responsible for developing technologies, calibration methodologies and the respective instrumentation for calibration and validation of our products. These solutions will be used during New Product Introduction (NPI) and transferred to mass production.

The role of a Depth Camera Systems Engineer is to design and deploy effective calibration and test strategies for our depth sensors across our product range.

Responsibilities:
X-functional collaboration to define general calibration and test methods for depth cameras applicable across our full range of products.
Optimization of the calibration and test methods to move towards the next generation of factory testing.
Introduction of new test coverages with minimal impact on current test infrastructure.
Work with a team of SW engineers to implement the calibration and test coverages during NPI.
Develop repeatable and reproducible processes that meet mass production requirements without affecting customer experience.
Simulation and analysis the calibration of novel depth sensing modules influenced by the (optical) properties of the test setup.