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we are seeking a highly motivated and experienced Senior Software Engineer for a position focused on developing innovative network device monitoring and visualization solution.
Your Impact

Design and develop visualization capabilities within our SDK environment
Lead the development of a brand-new comprehensive self-monitoring system for network devices from the ground up
Implement a comprehensive model for capturing and managing network state information
Drive cross-team collaboration and technical strategy
Work closely with senior technical leadership
Create and refine technical requirements and system designs
Build new systems and frameworks from the ground up

we are seeking a highly motivated and experienced Software Engineer for a position focused on developing innovative network device monitoring and visualization solution.
Your Impact

Design and develop visualization capabilities within our SDK environment

Lead the development of a brand-new comprehensive self-monitoring system for network devices from the ground up

Implement a comprehensive model for capturing and managing network state information

Drive cross-team collaboration and technical strategy

Work closely with senior technical leadership

Create and refine technical requirements and system designs

Build new systems and frameworks from the ground up

You will own the complete EVB hardware bring-up process from initial power‑on through release to internal engineering teams. This role is highly practical and technical, responsible for identifying and resolving complex board- and ASIC-level hardware issues, documenting findings, and driving corrective actions.

Key responsibilities
Own and execute complete EVB hardware bring-up, validation, and qualification activities in the lab.
Perform initial board power‑up, verify power rails and sequencing, validate clocks and resets, and exercise interfaces.
Lead hands‑on debugging and root‑cause analysis of board‑level and ASIC-related hardware failures.
Read and use complex hardware schematics and PCB layout data as primary debugging tools; review PCB manufacturing data when investigating failures.
Perform detailed lab measurements (oscilloscopes, VNAs, logic analyzers, power supplies, electronic loads) and correlate results with schematics, layout, ASIC requirements, and simulations.
Collaborate with SI and PI teams to investigate signal-quality, channel-loss, reflections, power-delivery, and noise issues.
Work with FPGA and BSP/SW engineers during initial system bring-up and debugging.
Document bring-up procedures, debug findings, measurements, known issues, workarounds, and solutions.
Support manufacturing and assembly debug (PCB, SMT, soldering, component and assembly-related failures).
Drive hardware issues through identification, root‑cause analysis, corrective action, implementation, and final validation.

Our team focuses on the PHY and system aspects of our devices, including PHY firmware, calibrations, system definitions, operations, and post-silicon validation.

Key responsibilities include:

Working with the latest silicon technologies and processes to build large-scale, complex devices at the forefront of feasibility.
Contributing to the development of PHY firmware and system calibrations.
Participating in system definitions, operations, and post-silicon validation activities.

What Youll Do:

Our unique design center integrates all silicon hardware and software development disciplines under one roof. We are revolutionizing the industry by building a new internet for the 5G era, with a unified, programmable silicon architecture that will underpin future routing products. Our devices are designed for adaptability across service providers and web-scale markets, delivering high speed without compromising programmability, buffering, power efficiency, scale, or feature flexibility.

We are seeking a high-driven, results-oriented multidisciplinary orchestrator to act as the primary catalyst for our development infrastructure. In this role, you will operate at the critical intersection of product strategy, hardware engineering, and lab operations, serving as the connective tissue that aligns disparate teams under a unified goal. You will be responsible for driving cross-functional alignment across the organization, effectively managing stakeholders with differing ownership to ensure infrastructure roadmaps scale alongside product milestones. This position requires a self-starter comfortable pushing for success in ambiguous environments, where you will translate high-level strategy into the tactical execution of the physical and virtual ecosystems that power our development lifecycle.

Your Impact

You will own the end-to-end lifecycle of infrastructure projects, ensuring that our Sanity Test Beds and development environments are optimized to meet aggressive product launch timelines. By bridging the gap between engineering roadmaps and infrastructure requirements, you will serve as the engine that ensures our teams have the right resources at the right time, regardless of technical or organizational complexity.

Key Responsibilities

Strategic Orchestration & Alignment

Unified Roadmap Integration: Translate complex product development roadmaps into long-term infrastructure requirements, driving cross-functional alignment between silicon milestones and lab availability.
Stakeholder Management: Act as the primary liaison between hardware engineering, software development, procurement, and lab operations; navigate competing priorities among stakeholders with differing ownership to keep teams synchronized.
Ambiguity Management: Proactively identify project roadblocks and navigate ambiguous environments to push critical-path dependencies to resolution.
Operational Velocity: Drive continuous improvement in infrastructure processes, identifying and removing friction to increase overall engineering velocity.
Operational Oversight & Execution

Strategic Capacity Planning: Lead high-stakes capacity management efforts, forecasting needs for power, rack space, and compute resources to proactively eliminate infrastructure bottlenecks.
Lifecycle Ownership: Oversee the full lifecycle of infrastructure projects-from initial procurement and technical specification through deployment, validation, and transition to operational readiness.
Visibility & Reporting: Drive the development of dashboards and reporting mechanisms to provide real-time visibility into infrastructure health, ensuring data-driven decision-making across the organization.
Vendor & Asset Optimization: Partner with cross-functional leadership to manage technical specifications, equipment lead times, and hardware lifecycles, ensuring a high-performance, cost-effective infrastructure footprint.

?Job Description and Responsibilities
* Perform initial fault diagnosis and troubleshooting of electronic products, including basic component-level debugging, with guidance from experienced team members.
* Program and test electro-mechanical products according to established procedures.
* Document test results and identified faults, escalating complex issues as needed.
* Collaborate with the production team to ensure product quality and efficient work processes.
* Configurate and test complex products and/or those requiring knowledge and/or Electronics Practical Engineer certification.

Reports to:
Production Manager

We are seeking a Software Embedded Development Engineer to design, develop, and optimize mission-critical embedded software for cloud infrastructure. You will join teams focused on networking, machine learning acceleration, and high-performance computing (HPC), impacting millions of AWS services globally.

Cutting-Edge Technology: Work on custom silicon (e.g., Graviton, ML accelerators) and innovative networking solutions at the intersection of hardware and software.

Growth & Innovation: Benefit from AWSs resources, mentorship programs, and opportunities to publish technical content.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.