לוח משרות דרושים מהנדס חשמל משרה מלאה

This role has been designed as Hybrid with an expectation that you will work on average 2 days per week from our office.

Roles and Responsibilities:
Design, develop, and enhance I/O subsystems, virtualization, kernel programming, and memory management for cutting-edge system software products.
Drive performance optimization, and efficient memory management.
Perform in-depth debugging, triaging, and resolution of user and kernel-level, performance profiling, and memory-related issues.
Develop innovative solutions, addressing challenges in virtualization, multithreading, and hardware-software interaction.
Explore and implement new methodologies fostering continuous improvement and innovation.
Proactively identify bottlenecks in system design, and recommend and implement robust, scalable solutions.
Stay updated on evolving trends in kernel development, design, and virtualization technologies to bring innovative practices to the team.
Troubleshoot and optimize complex I/O and kernel features to enhance performance, scalability, and reliability.
Collaborate with cross-functional teams to align on design goals and ensure seamless integration with the system architecture.
Exhibit flexibility in taking on new or related tasks, showcasing adaptability and a proactive, problem-solving mindset.
Provide technical leadership in architecture design, problem-solving, and decision-making across complex technical domains.
Lead technical discussions, design reviews, and decisions on critical system challenges, driving the adoption of innovative solutions and best practices.

At our company Energy, we can. Our technology is key, but our people make the difference. Brilliant minds innovate. They connect, create, and keep us on track towards changing the world's energy systems. Their spirit fuels our mission.
Our culture is defined by caring, agile, respectful, and accountable individuals. We value excellence of any kind. Sounds like you?
Key Responsibilities:
The GIS Installation Commissioning & service Engineer will be responsible for executing installation, testing, and commissioning activities of Gas Insulated Switchgear (GIS) systems at various customer sites across India. The role requires strong technical acumen, field experience, and coordination skills to ensure successful completion of projects in compliance with our company standards, customer specifications, and international norms.
Key Responsibilities
Execute on-site GIS installation as per company standards and customer-approved drawings.
Perform pre-commissioning, HV testing, and Site Acceptance Tests (SAT) of GIS systems at customer premises.
Independently manage site activities, supervise technicians, and ensure adherence to quality and safety standards.
Prepare and maintain site documentation, including test reports, inspection records, and handover documents.
Preparation of SOP, MOS and other project documentation to support the team with back-office works
Interact directly with customers, addressing technical queries and ensuring clear communication.
Collaborate with factory, engineering, and project teams to resolve site issues and meet project timelines.
Ensure strict compliance with HSE (Health, Safety, and Environment) guidelines during all site operations.
Support continuous improvement initiatives and provide technical feedback for future design or process enhancements.

As an Associate Application Engineer, you will be involved in a structured Associate Application Engineer Training Program. This is a fast-track paid training program that challenges you to develop the expertise needed to tackle difficult technical problems.
Associate Application Engineers are members of a team of highly motivated individuals working with customers crafting the most sophisticated hardware and software systems in the world and whose applications span the electronics industry. This training program will give you outstanding insight into our technical marketing, product support, and sales organizations. Upon successful completion of this 12-month training program, you will be eligible to advance into one of these organizations.
The job location is in Israel in our Raanana office.

We are currently seeking an Application Engineer for our European Technical Organization, with focus on the Calibre line of products, market leader in physical verification and circuit verification.
The primary purpose of the position is to work closely with customers, and sales team to manage the technical engagement that supports sales campaigns and drive the adoption of our company Calibre software tools.
Responsibilities -
To develop close relationships with customers to be able to assess their technical requirements and the options/ability for our company's Calibre solutions to develop and implement technical sales plans. This may be through proactive telephone contact, delivery of presentations and demonstrations, articulating product value statements, and engagement in technical benchmarks and evaluations.
To drive products into customer projects to ensure adoption by creating methodology and flows; this may include infrastructure and integration into a customers environment and the identification of pilot projects for tool use and the debugging and bring-up of new methodologies and flows.
To uncover or qualify new opportunities, the technical viability of a lead and communicate the opportunity clearly to the sales team. Use this information to establish success criteria for technical engagements that effectively position our company areas of strength.
To provide technical leadership on all aspects of a sales campaign with the aim of contributing to account/area technical business plans.
To share, in a proactive manner, account, evaluation, competitor, technology and other useful information with peers, sales teams, management and product divisions to help us to compete more effectively.
To actively participate in out-bound marketing such as trade shows, workshops, seminars, webcasts.
We are seeking a highly motivated,results oriented and accountable person that strives on working in an international environment.
The position is based in Israel although you will be part of a team covering Europe and consequently should anticipate some international travel in Europe and US.

At Lumissil, we are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, Lumissil is the place to develop your skills, innovate, and grow your career. Why join us?
* Work on cutting-edge automotive projects
* Learn from a talented and supportive team
* Gain exposure to real-world automotive challenges
* Grow your career in a collaborative and inspiring environment If you’re ready to take the next step in your career and be part of something meaningful, we’d love to meet you! About The Position: As a Junior ASIC Design Engineer at Lumissil, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where you’ll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions
* Support and learn from real emulation platforms used in production-grade designs
* Contribute to RTL implementation and gain practical experience in design flows
* Assist with verification and backend (BE) activities, learning industry best practices
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation

Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market
System-Level Debug & Validation

Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs
Ensure rapid cycles from RTL to functional stability through systematic debug approaches
Own technical blocks and drive them to completion independently
Cross-Functional Collaboration

Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios
Ensure seamless hardware-software integration for AI infrastructure connectivity
Collaborate with Design and Verification teams to optimize emulation strategies

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews