our company has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. Its a unique legacy of innovation thats fueled by great technologyand amazing people. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. As a worker, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.
Are you ready to take your engineering career to the next level? our company, a world-class technology company, is seeking a passionate Senior Package Engineer to join our team in Israel. In this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated IC substrates for our groundbreaking products. At our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you'll be doing:
Leading the development of groundbreaking microelectronics packaging for our company Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Thriving in a dynamic and challenging environment
Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues.
Requirements: BSc or equivalent experience in Mechanical Engineering / Materials Engineering / Physics or similar
10+ years of experience ,at least 5 years of experience with complex ASIC package development and manufacturing
Experience co-working with subcontractors and vendors
Vision and focus for projects and team
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule
Ways to stand out of the crowd:
Hands-on FEA mechanical simulation experience
Team / Group / Project management - advantage
Experience with manufacturing environment and manufacturing statistics tools (for example JMP)
Background in semiconductor manufacturing processes.
This position is open to all candidates.