We are looking for a highly experienced Senior Thermal Engineer to join our Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.
The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.
Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.
What will your job look like?
Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
Requirements: M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
Excellent technical communication skills in English.
Nice to have:
Experience in semiconductor package thermal design and characterization.
Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.
This position is open to all candidates.