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We are We are seeking a Senior Switch Silicon Security Architect to define end-to-end security across switch silicon, firmware, networking protocols, and management stacks. Working with architecture, engineering, and product teams, this role will shape security from early design through validation, manufacturing, and deployment.

What you'll be doing:

Research, design, and drive the implementation of hardware and software security architectures for switch platforms that meet internal requirements, customer needs, and industry standards.

Develop threat models and define end-to-end security architectures for hyperscale networking solutions spanning silicon, firmware, high-performance networking protocols, and management stacks.

Partner across us with hardware, software, research, and product teams to shape the strategic direction of switch silicon and fabric-level security.

Define and drive multi-generation security roadmaps for switch silicon, networking protocols, and fabric-level solutions.

Engage directly with customers to understand their security requirements and translate them into switch silicon and system architectures that address both component and solution-level needs.

Represent us in industry standards bodies and collaborate with external partners to shape emerging security standards and drive interoperability across silicon and networking ecosystems.

We are looking for an excellent Senior Firmware Engineer to join the FW group in Tel-Aviv / Raanana. As a Senior Engineer you will be taking part in designing, implementing and leading major development firmware features, delivering the next-generation data center products who lead the AI revolution.

The Firmware team develops cutting-edge networking features for cloud, HPC and AI. We drive the data growth of the worlds biggest companies. With talented engineers around the globe, the work environment is dynamic, meaningful, and fast-paced. Are you ready for the challenge?

What you will be doing:

Collaborate with architecture and different software design teams as part of the software development lifecycle.

Design and implement new features in the core of our firmware.

Work in pre and post-silicon development environments of next-generation networking products.

Gain a deep understanding of system debugging, networking technology, and stacks, as well as the HW/FW/SW relationship.

Innovate! Bring our FW NVLINK products to shine in customers view.

We are looking for an excellent Firmware Design Engineer for NVIDIA FW PHY Group. The person will closely work with NVIDIA FW development, architecture, chip design teams and gain deep understanding of NVIDIA's Networking products and technologies.

We have some of the most forward-thinking and hardworking people in the world working for us. Are you a creative and autonomous engineer who loves a challenge? Are you ready to become the engineer you always wanted to be? Come and be part of the best chip design team in the industry!

What youll be doing:

Enabling new SerDes and Optical Technologies

Implement FW functionality in signal processing units of NVIDIA products

Work closely with the architecture, HW, and SW design teams

Define implement and maintain FW algorithm to control the Silicon

Develop and test FW on emulation & simulation environments during the Pre-silicon phase

Debug and screen HW/FW/SW issues

Take an active part in silicon bring-up and SW development phases

Lead data-driven discussions about the product functionality and areas for improvement

We are looking for a creative and motivated Software Engineer to join our SONiC open source NOS team. Our team is responsible for the design and integration of SONiC across our Networking products. In this role, youll have the opportunity to work on next-generation, high-speed networking solutions for AI data centers, contribute to open-source projects, and collaborate with experts across us and the broader SONiC community.

Youll help lead the development of new SONiC networking features and chassis management capabilities across our Networking products. Were looking for someone who enjoys solving complex technical challenges, learning quickly, and collaborating in a dynamic and diverse team environment.

What youll be doing:

Design, integrate, and deliver new features as part of the SONiC release train across our Networking products.

Develop networking and chassis management capabilities for next-generation platforms.

Work in a Continuous Deployment environment with fast development and deployment cycles.

Collaborate with experienced teams across our Networking and with members of the broader SONiC open-source community.

Develop high-quality, production-ready code that is published and reviewed in leading open-source environments.

Take ownership of features from design and implementation through integration and delivery.

We are global, with HQ in NYC and R&D centers in Tel Aviv, New York, Finland, Berlin, Belgium and San Diego. We work in a fast-paced environment and have a lot of challenges to solve. If you like to work in a huge scale environment and want to help us build products that have a huge impact on the industry, and the web - then your place is with us.
What you will do:
Develop and improve models that analyze millions of videos and images every day across the web, Smart TVs, YouTube, Facebook, Twitter, Instagram, TikTok and more to detect the content categories they are about.
Work alongside experienced data scientists and engineers in a cutting-edge environment, contributing to advanced ensembles of models at huge scale.
Participate in the full development cycle - from research and experimentation through to deployment - gaining hands-on experience with production ML systems.
Leverage AI-powered tools and assistants as part of your daily workflow to accelerate research, coding, and analysis.
Help advertisers avoid negative or irrelevant content and target what's most relevant to their brand, keeping the web free for everyone.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

We're looking for exceptional engineers to join our Signal/Power-Integrity and Packaging team. A team that sits where the Silicon meets the Board, bridging the gap between what happens internally at the DIE and the overall system interconnect and the external memories and peer devices.
What sets us apart:
Small team, yet a one stop shop for IP electrical integration at the DIE level, Package design, SI/PI simulations, Layout, Board-design and advanced lab characterization.
Combining Signal-Integrity and Layout, to come up with optimized Package and PCB designs.
Holistic view of the entire interconnect, from the DIEs metals, through the Package, to the PCB traces, and all the way to the peer device.
In-depth post-silicon characterization, using advanced measurement techniques, far exceeding traditional compliance measurements.
Deep dive mentality, in both theory and the bolts and nuts that make the internal circuitry of the electrical interfaces.

The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGAs substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.

As a SIP team member, you will assume responsibility for all electrical aspects of physical interfaces of advanced I/Os, PLL, Memory and SerDes interfaces, from integration at the Die level, through SI/PI simulation and package layout, to reference board design aspects.

This position is for an experienced engineer with strong background in high-speed electrical interfaces, such as DRAM, PCIe, Ethernet SerDeses. The line of work is multi-disciplinary, combining Package-Design, Back-End integration of electrical IPs, SI/PI extractions & simulations.


Key job responsibilities
Deep dive into electrical IPs, integrated into the DIE;
I/O ring design and close work with Backend team on floor-planning all I/O interfaces at the DIE level.
Lead test studies of Die bump-out arrangements and Package substrate breakout.
Lead layout test studies of package pin-out arrangements and PCB board breakout.
Design large and complex package substrates.
Carry advanced SI/PI extractions and simulations to validate the design from the silicon to the peer device at the board level.

We are looking for an energetic, detail-oriented individual to join our Data Center Engineering Operations Team. This committed group works to maintain the critical physical infrastructure that supports Amazon Web Services. Specifically, this team works to ensure that the data center's MEP operates at 100% availability while maintaining first-class customer service to the teams and groups within the data centers.
The Data Center Engineering Operations Facility Engineer is responsible for operating and maintaining all electrical, mechanical, and fire/life safety equipment within the data center. This person serves as a technical resource to support Amazon within its owned and operated data centers. Data center equipment that supports mission-critical servers must maintain better than 99.999% uptime. DCEO Facility Engineers are also tasked with driving innovation while reducing operational costs in the facilities.

DCEO Facility Engineers are Amazons front line responders for hands-on electrical and mechanical equipment troubleshooting and operation. This equipment includes, but is not limited to, stand-by diesel generators, switchgear, UPSs, PDUs, AHUs, chillers, cooling towers, chemical treatment systems, pumps, motors, VFDs, and building automation systems.


Key job responsibilities
- Operate and maintain mechanical and electrical equipment.
- Perform root cause analysis of equipment failures.
- Troubleshooting of facility and rack-level events within internal SLA.
- Ensure all safety procedures are adhered to while performing work.
- Able to work shifts (rotating work days during the weeks).
- Take daily operational readings of all mechanical and electrical equipment.
- Utilize internal CMMS to manage building workflows.

As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.

As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Be responsible and go-to person for any IR related issues.

As we expand our presence in Israel, we're seeking a talented Staff/ Principal Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.

As a Staff/ Principal Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified

Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices

Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment

As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support.
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions.
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams.

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient.
Apply design techniques to meet PPA (Power, Performance, Area) targets.
Contribute to design quality through verification and validation activities.

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives.
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter.
Collaborate effectively across teams to ensure seamless integration.

As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.