As a member of the Package Design Team, you will:
Lead package design tasks, being responsible for planning, coordinating with partners, and driving schedules from start to finish.
Optimize package pinouts, stack-ups, placements, power distribution, and high-speed routing while balancing functional needs, manufacturing constraints, and performance considerations.
Collaborate with silicon floor plan, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency.
Work closely with layout editors to implement the package design, ensuring alignment with high-speed signal and functional interface requirements.
Enhance design methodologies and procedures, collaborating with vendors and developers to improve product quality and design efficiency.
Requirements: Minimum Qualifications:
Bachelors degree in Electrical Engineering or a related field.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for layout and design.
Preferred Qualifications:
Masters degree in Electrical Engineering.
Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing.
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations.
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process.
Hands-on experience with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers.
This position is open to all candidates.
