לוח משרות דרושים ייצור ותעשייה ביקנעם, לחיפוש זה נמצאו 87 משרות

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering.

2+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Excellent knowledge & experience with 3D software for mechanical design (Inventor/Creo).

Knowledge with some of the following various production technologies: PCB design, Sheet metal, Electronic Liquid cooling, Metal die casting, Machining (Milling), Extrusion, Plastic injection molding.

Producing of manufacturing documentation (Drawing, Specs).

Computers & software: PDP (Advantage), Office.

Self-motivated with a sharp learning curve.

Ability to manage multiple tasks while being very well organized (know how to work in Multitasking mode and priorities the tasks).

Multi- disciplinary abilities.

Strong communication skills, English & Hebrew, written and verbal. strong Interpersonal relationship.

Team player. ability to work independently and as a member of a team as well.

High Service oriented.



Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

Requirements:
* Bachelors degree in Mechanical or Biomedical Engineering from a leading university, GPA 85+
* 2-5 years of experience in a relevant engineering role
* Hands-on experience in the medical device industry - an advantage
* Familiarity with design control processes and standards (ISO 13485, FDA 21 CFR 820) - an advantage/
* Proficiency with SolidWorks - an advantage
* Full proficiency in English, including reading and writing technical documentation
* Team player with strong communication skills, self-driven and detail-oriented

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering / Physics / Material Engineering or higher, with 5+ years of experience in opto-mechanical and electro-mechanical product development, including PCB/PCBA design.

Strong understanding of failure analysis methodologies, root cause investigation, reliability engineering principles, and physics-of-failure analysis.

Hands-on experience debugging complex opto-electro-mechanical systems and identifying thermal, mechanical, assembly, manufacturing, and reliability-related failure mechanisms.

Experience leading complex technical investigations, including DOE execution, 8D methodology, and preparation of detailed investigation and failure analysis reports.

Strong background in mechanical simulations for components and assemblies as part of product design and failure analysis activities.

Hands-on experience with laboratory and analytical tools such as microscopy, X-ray, CT scanning, thermal imaging, strain/stress measurements, and optical lab equipment in clean room environments.

Knowledge of optical manufacturing processes, inspection methods, optical modules, fiber-optic interconnects, and multidisciplinary system integration.

Excellent hands-on experience with 3D CAD tools; Creo is an advantage. Strong understanding of manufacturability, GD&T, CTF dimensioning, and statistical tolerance analysis techniques.

Self-motivated team player with strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Active involvement in the development of opto-mechanical telecommunication devices.

Exposure development of advanced thermal solutions such as heat-pipes, vapor chambers and liquid cooling.

Experience working in high-volume manufacturing environments with a strong focus on reliability, yield improvement, and design for manufacturability (DFM).

Experience with mechanical stress simulation tools such as ANSYS Mechanical.

Record of working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering or higher degree.

8+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Self-motivated with a sharp learning curve and able to work independently and as a teammate.

Excellent hands-on experience with 3D CAD.

Strong background in design of components for high-volume manufacturing technologies, such as: stamping, die casting, extrusion, and injection.

Experience in developing fixtures/jigs for product assembly/testing.

High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and geometric tolerancing.

Experience in defining and executing DOE (design of experiment)

Strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

Requirements:
What we need to see:
B.Sc. in Electrical / Mechanical/ Material/ Chemical Engineering, or similar or equivalent experience.
12+ years of experience in the Hardware design development or testing arena or as Process Engineer.
Preferable 5+ years in the field of quality.
Experience in manufacturing process or test engineering, board design/assembly or semiconductors knowledge and previous experience.
Background with hardware qualification, reliability processes, quality procedures and tools.
Familiarity with quality methods Risk assessment failure analysis and FMEA.

Requirements:
B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.

3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.

Hands-on experience with destructive sample preparation techniques including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.

Strong experience operating analytical equipment such as: SEM, FIB, X-ray / CT, Optical microscopy

Strong understanding of hardware failure mechanisms in semiconductor devices, electronic packages, PCBs, solder joints, connectors, or optical assemblies.

Experience developing structured root cause investigations using physical evidence.

Excellent analytical, documentation, and communication skills.

Ability to independently drive complex investigations from initial failure through final root cause.

Requirements:
What we need to see:

BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.

2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.

Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.

Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.

High awareness for quality, robustness, and manufacturability.

High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.

Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.

Curious and creative problem solver, well organized and multi-tasker.


Ways to stand out of the crowd:

Hands-on FEA mechanical simulation experience - Advantage.

Team / Group / Project management - Advantage.

Experience with manufacturing environment and manufacturing statistics tools.

Background in engineering semiconductor manufacturing processes.

Requirements:
Qualifications:
Bachelors degree in engineering or a related technical field.
Experience working with electronic, mechanical, or electromechanical products.
Strong understanding of quality management systems and supplier quality processes.
Experience conducting supplier audits and QBRs.
Strong communication and interpersonal skills.
Ability to manage multiple priorities and work independently.
Proficiency in Microsoft Office applications.
Fluent in English (written and spoken).

Preferred Qualifications:
Lead Auditor certification.
CQE (Certified Quality Engineer) certification.
Experience with ERP and PLM systems, priority- advantage.
Experience in high-tech, aerospace, or semiconductor industries- advantage.

Required Skills & Competencies:
Root Cause Analysis (5 Why, Fishbone, 8D).
First Article Inspection (FAI).
Corrective and Preventive Actions (CAPA).
Supplier Auditing and QBRs.
Data Analysis.
Technical Report Writing.
Cross-functional Collaboration.
Decision-making.
Presentation Skills.
Knowledge of ISO standards, AS9100 - advantage.

Requirements:
B.Sc in Mechanical Engineering from an accredited university.
2+ years of experience as a team manager with multidiscipline knowledge and capabilities.
Soft skills ability to create an engaging relationship , strong communication skills, problem-solving abilities, leadership qualities.
Hard skills: High level of technical knowledge.
Fluent English.
Full time position located in Yokneam.

Requirements:
B.Sc. in Mechanical / Mechatronics Engineering (or related field).

5+ years of experience in Process / Production / NPI Engineering.

Strong background in manufacturing environments.

Knowledge of Lean, SPC, PFMEA, and problem-solving methodologies.

Hands-on, analytical, and detail-oriented with strong ownership.

Excellent communication and teamwork skills.