דרושים » הנדסה » Senior system Engineer - Optical Sensing Systems

The Senior Silicon Photonics PIC Design Engineer will help build next-generation Photonic Integrated Circuits (PICs) that power high-performance optical interconnect solutions. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components, while contributing to optical test instrumentation for emerging semiconductor test markets.
As a member of the Silicon Photonics Engineering Staff, you will be a key player in the definition, implementation, and validation of complex automated test equipment that interfaces optical ports of silicon photonic devices at all stages of fabrication, from wafer probe to packaged test.
Lead the design, simulation, layout, and system-level testing of advanced silicon photonics components and Photonic Integrated Circuits.
Utilize simulation and design tools, including Ansys/Lumerical and Cadence Virtuoso, to design, validate, and optimize photonic designs.
Collaborate closely with design, layout, EIC, packaging, validation, quality, and system architecture teams to develop high-performance integrated photonic circuits and validate link performance.
Partner with fab and process engineers to define and optimize device design and implement process monitoring structures.
Develop test and qualification plans in coordination with validation and quality engineering teams.
Conduct rigorous testing and characterization of devices and PICs, including passive and active photonic components.
Engage in direct collaboration with silicon foundries to streamline processes and support successful tape-out execution.

The Senior Silicon Photonics PIC Design Engineer will help build next-generation Photonic Integrated Circuits (PICs) that power high-performance optical interconnect solutions. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components, while contributing to optical test instrumentation for emerging semiconductor test markets.
As a member of the Silicon Photonics Engineering Staff, you will be a key player in the definition, implementation, and validation of complex automated test equipment that interfaces optical ports of silicon photonic devices at all stages of fabrication, from wafer probe to packaged test.
Lead the design, simulation, layout, and system-level testing of advanced silicon photonics components and Photonic Integrated Circuits.
Utilize simulation and design tools, including Ansys/Lumerical and Cadence Virtuoso, to design, validate, and optimize photonic designs.
Collaborate closely with design, layout, EIC, packaging, validation, quality, and system architecture teams to develop high-performance integrated photonic circuits and validate link performance.
Partner with fab and process engineers to define and optimize device design and implement process monitoring structures.
Develop test and qualification plans in coordination with validation and quality engineering teams.
Conduct rigorous testing and characterization of devices and PICs, including passive and active photonic components.
Engage in direct collaboration with silicon foundries to streamline processes and support successful tape-out execution.

we bring connectivity and intelligence to everyday products and packaging; things previously disconnected from the internet of things. our platform combines cloud services and iot pixels, computing elements that can power themselves by harvesting radiofrequency energy. this revolutionary mixture of cloud and semiconductor technology is used by some of the worlds largest brands, food, and pharmaceutical companies to change how we make, distribute, sell, use, and recycle products. our investors include amazon, verizon, ntt docomo, qualcomm, pepsico, and softbank vision fund 2. join us and help pave the way for the new iot.
our TEST & product team is responsible for keeping a target of a very aggressive cost limit of the production testing (wafer sort) while performing comprehensive testing of all the units functionalities. this involves:
development of the tests using the teradyne uf tester.
development of unique and advanced TEST hw.
monitoring and analyses the production data.
fa (failure analysis) when issues are discovered.
innovative dft (design for testability) with the design team.
responsibilities:
development of wafer sort TEST programs through a close relationship with the system team.
development of the future products dft and dfm through close collaboration with the design team.
improvement of the production data analysis and reports through close relationships with the cloud and data teams.
working with the external abroad TEST houses.
decision-making based on massive data analysis (pass criteria, improvements of the tests, identification of failures).
integrate new and innovative testing methods for a new technology sector.
specify and work with external vendors for the tester hw (probe-card and load-board).
specify and work with external vendors for the htol hw, TEST program.

We are looking for a Technical support to join our growing robotics startup. This role is hands-on and multidisciplinary, involving installation, maintenance, troubleshooting, and on-site support of complex robotic systems. The systems combine mechanics, hardware, electronics, and advanced software, and require strong system-level understanding. The position includes work at our companys facilities as well as international travel, primarily for system installations, demos, and field troubleshooting. As part of our rapidly growing, small, motivated, and multi-disciplinary team, this position is the first dedicated role in its domain, providing a unique opportunity to contribute to a new area within the company.

Responsibilities
Maintain, test, and troubleshoot robotic systems at the companys facilities.
Install, calibrate, and commission robotic systems at customer and partner sites abroad.
Lead on-site system setup and troubleshooting during demos and early deployments.
Diagnose and resolve hardware, mechanical, and software issues in the field
Perform hands-on replacement and repair of mechanical and electromechanical components.
Work closely with R&D teams (software, mechanical, electrical, algorithms) to deeply understand the system.
Gather knowledge from internal engineering teams and apply it independently in the field.
Provide technical feedback from the field to improve system robustness and usability.
Document issues, procedures, and best practices.

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.

As SIPI engineer youll be required to design and analyze high speed analog/digital signals for networking products, with emphasis on high speed signal and power analysis of ASIC, Package and PCB. Model/simulate/characterize high speed systems, including high speed I/Os, chip packages, printed circuit boards, and system interconnects. Overcome the challenges of ultra-high data rate and cutting-edge technology. We use the latest silicon technologies and processes to build largest scale and most complex devices at the edge of feasibility.

Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.

Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.

Define product specifications, develop electrical schematics, and guide component selection.

Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

We are seeking a high-driven, results-oriented multidisciplinary orchestrator to act as the primary catalyst for our development infrastructure. In this role, you will operate at the critical intersection of product strategy, hardware engineering, and lab operations, serving as the connective tissue that aligns disparate teams under a unified goal. You will be responsible for driving cross-functional alignment across the organization, effectively managing stakeholders with differing ownership to ensure infrastructure roadmaps scale alongside product milestones. This position requires a self-starter comfortable pushing for success in ambiguous environments, where you will translate high-level strategy into the tactical execution of the physical and virtual ecosystems that power our development lifecycle.

Your Impact

You will own the end-to-end lifecycle of infrastructure projects, ensuring that our Sanity Test Beds and development environments are optimized to meet aggressive product launch timelines. By bridging the gap between engineering roadmaps and infrastructure requirements, you will serve as the engine that ensures our teams have the right resources at the right time, regardless of technical or organizational complexity.

Key Responsibilities

Strategic Orchestration & Alignment

Unified Roadmap Integration: Translate complex product development roadmaps into long-term infrastructure requirements, driving cross-functional alignment between silicon milestones and lab availability.
Stakeholder Management: Act as the primary liaison between hardware engineering, software development, procurement, and lab operations; navigate competing priorities among stakeholders with differing ownership to keep teams synchronized.
Ambiguity Management: Proactively identify project roadblocks and navigate ambiguous environments to push critical-path dependencies to resolution.
Operational Velocity: Drive continuous improvement in infrastructure processes, identifying and removing friction to increase overall engineering velocity.
Operational Oversight & Execution

Strategic Capacity Planning: Lead high-stakes capacity management efforts, forecasting needs for power, rack space, and compute resources to proactively eliminate infrastructure bottlenecks.
Lifecycle Ownership: Oversee the full lifecycle of infrastructure projects-from initial procurement and technical specification through deployment, validation, and transition to operational readiness.
Visibility & Reporting: Drive the development of dashboards and reporting mechanisms to provide real-time visibility into infrastructure health, ensuring data-driven decision-making across the organization.
Vendor & Asset Optimization: Partner with cross-functional leadership to manage technical specifications, equipment lead times, and hardware lifecycles, ensuring a high-performance, cost-effective infrastructure footprint.