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We are looking for a Quality Engineer to join our Ink Plant.
This role combines responsibility for plant quality activities with ownership of the day-to-day laboratory operations. The position plays a critical role in supporting production continuity, ensuring product quality, strengthening process control, and leading investigations and continuous improvement initiatives.
The ideal candidate is analytical, structured, comfortable working under pressure, and motivated to grow within a dynamic manufacturing environment.
What should you have?
Quality Responsibility:
Lead deviation investigations and root cause analyses
Manage non-conformances and drive corrective and preventive actions (CAPA)
Strengthen in-process controls and quality monitoring systems
Support batch release decisions in alignment with plant procedures
Drive standardization, documentation improvements, and KPI tracking
Analyze quality trends and provide data-driven recommendations
Support audits and ensure compliance with internal quality standards
Laboratory Operations Responsibility:
Take responsibility for the day-to-day operation of the laboratory
Ensure timely testing and responsiveness to production needs
Perform hands-on laboratory testing and analysis as required
Maintain testing standards, documentation accuracy, and procedural compliance
Optimize laboratory workflows and improve operational efficiency
Work closely with Production, Engineering, Planning, and Supply Chain to ensure smooth plant operations.

join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

as a quality and reliability (q&r) engineer, you will lead the qualification and long-term reliability of advanced system -on-chip ( SOC ) and RF semiconductor products for automotive applications. youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
what will your job look like:
define and manage quality and reliability specifications, simulations, and qualification plans for SOC and RF die and package.
plan and execute automotive-grade qualifications per standards such as aec-q100, jedec jesd22, and iatf 16949.
design and implement die-level and package-level stress tests.
select and prepare electrical, environmental, and mechanical TEST platforms for reliability testing.
define requirements for pre-si q&r (e.g. esd, lu, em, ir drop), design-for- TEST (dft), electrical characterization, and post-si q&r testing of digital, mixed-signal and RF socs.
collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (osats).
lead failure analysis, reliability modeling, and corrective action processes (e.g., 8d, fmea, fmeda).
document and certify automotive standards compliance, including ppap/apqp deliverables.

join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

our company has been transforming computer graphics, pc gaming, and accelerated computing for more than 25 years. its a unique legacy of innovation thats fueled by great technology-and amazing people. today, were tapping into the unlimited potential of ai to define the next era of computing. an era in which our gpu acts as the brains of computers, robots, and self-driving cars that can understand the world. doing whats never been done before takes vision, innovation, and the worlds best talent. as an employee, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. come join the team and see how you can make a lasting impact on the world.
are you ready to take your engineering career to the next level? our company , a world-class technology company, is seeking a passionate package engineer to join our team in israel. in this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated ic substrates for our groundbreaking products. at our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. as a package engineer, you will work closely with si, layout, and asic design teams to develop complex, top-of-the-line asic packages. you will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
what you will be doing:
leading development of cutting-edge microelectronics packaging of our networking business units future products, evaluating our products for reliability and performance.
review manufacturability readiness at each milestone. 
work with world leading vendors to develop highly challenging packaging solutions.
leading the development of groundbreaking microelectronics packaging for our networking business unit's future products
collaborating with world-leading vendors to develop highly ambitious packaging solutions
thriving in a dynamic and challenging environment
join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
monitor substrate and assembly production kpis and collaborate with cross functional teams to define and monitor yield improvement plans for continuous improvement and establish quality standards.
lead process changes reviews, prepare and present data in change control board meetings, lead technical reviews of product changes throughout the supply chain.

we are looking for a creative, independent product engineer to join our company networking business unit. for over two decades, our networking has continuously reinvented itself, delivering industry leading high speed interconnect products. our solutions set the standard for performance, scalability, and innovation enabling true end to end high speed ethernet and infiniband solutions.
as we continue to grow, we are seeking exceptional engineers to help drive the next wave of technological advancement. in this role, you will take a leading position in the interconnect cluster performance domain. you will work closely with global technical teams to gain deep architectural insight, investigate customer complaints, and drive product excellence. if you are passionate about building high-quality products that make a real-world impact, we want to hear from you.
what youll be doing:
maintain high-quality product deliveries through in depth Big Data analysis and failure analysis
improve product performance by collaborating with process, mechanical, hardware, and thermal teams
lead high impact task forces and cross functional working groups
help design and enhance product TEST plans to ensure high customer satisfaction
manage failure analysis for both field and lab issues
collaborate closely with customer support, marketing, engineering, quality, and reliability teams

we are seeking an experienced, analytical, and highly motivated engineer to lead chip and pcb npi activities for networking products. this role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. the ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. as part of our networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.
what you'll be doing:
lead chip/substrate/osat/pcb qualification for networking products (2nd source).
collaborate with engineering teams to identify suitable substrate suppliers based on technical capability and capacity and define the qualification plan.
coordinate and lead changes through the ecr/ccb process.
work with engineering teams to create the product bom and plan initial qualification activities on the assy floor.
track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.
develop and execute risk plans for material requirements prior to qualification completion.
identify critical paths and bottlenecks; implement risk management methodologies.
develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.
create and maintain systems for data management and task tracking using power BI and other advanced systems, including ai-driven tools.