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our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design CAD Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Participate in the development of flows & methodologies from Synthesis , Place& Route & all signoff flows.
Plan & execute flow releases, coordinate & track development tasks.
Exploration of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new tools features and methodologies to bring innovation with significant RoI.
Hands-on physical design block ownership end to end, from Synthesis floor planning, Place & Route with target to achieve best PPA.
Signoff on all domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Serve as the technical lead while mentoring and guiding team members.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design CAD Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Lead the development of flows & methodologies from Synthesis, Place & Route & All signoff flows.
Plan & execute flow releases, coordinate & track development tasks between the team.
Exploration of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new technologies tools & features and to bring innovation with significant RoI.
Serve as the technical lead while mentoring and guiding team members.

Which department will you join? our company's VLSI team - a group designing the EyeQ chips for ADAS and autonomous cars. The group is responsible for all disciplines of VLSI development, including but not limited to Logic Design, Design Verification, Microarchitecture, Analog and circuit design and layout, Physical and structural design (backend), Product and test engineering. Each Physical Design engineer has an end to end responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Engineer to join the growing Physical Design Team, responsible for state of the art SoC design from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner from RTL to GDS.
Floorplan exploration with guidance and collaboration with front-end and architecture teams.
STA: work with FE and floor planner to manage block and top level constraints and 1st level of timing analysis.
Synthesis exploration and final synthesis netlist: Scan insertion @ synthesis, clean checks from Lint, UPF & Spyglass.
Place & Route: from Synthesis netlist to final layout and signoff verification with target to achieve best power performance and area.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block or IP owner from RTL to GDS with horizontal domain ownership.
Collaboration with front-end and architecture teams to address issues, define design methodologies and improve QoR & convergence.
End to End ownership from Synthesis, DFT insertion, Floor Planning , Place & Route till signoff.
Signoff on all domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Exploratio of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new technologies tools & features and to bring innovation with significant RoI.
Technical support and mentoring the engineers in the team.

our company's EyeC VLSI team - a group designing the chips for RADAR systems for ADAS and autonomous cars. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an end to end responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design STA Technical Expert to join the growing Physical Design Team, responsible for state of the art SoC design from definition to Tape-Out.
What will your job look like:
Leading FC timing activities & methodologies for brand New SoC, from definition to TO.
Writing design constraints (SDC) for FC/IP/Block levels for all modes.
Involved in chip architecture definition for functional & DFT domains.
Working in close collaboration with the front-end & architecture team.
Working with engineers to identify and overcome roadblocks and obstacles.
Defining AC timing from spec to implementation.
Supporting complex clock structures.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Leading Subsystem/IP Layout activities for complex Sub Full Chip with several levels of hierarchies.
Floorplanning, top-down deliveries & bottom up rollup , Sub FC/ IP level integration & verification.
Signoff on all physical design domains PV, IR/EM, LEC, LP Verification.
Physical Verification expert, building, maintaining and enhancing the flow for new technologies, improving reliability & convergence ToT.
Servings as a technical expert while mentoring and guiding team members,
Hands-on physical design block owner from RTL to GDS , an option.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Timing Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Leading Subsystem/IP Timing activities for complex Sub FullChip with several levels of hierarchies.
Timing rollup , analysis & of blocks & sub system levels & timing signoff on Function & Scan models on Sub FC /IP level.
Define timing signoff methodologies, corners, derates margins and improve QoR & convergence.
Involved in the chip design & architecture definition for both functional & DFT domain.
Serve as the technical STA lead while mentoring and guiding team members.

You will join a team of talented and experienced Signal/Power Integrity (SI/PI) & Electrical Validation engineers with wide scope of responsibility, from Pre-Silicon SI/PI simulations to Post-Silicon Electrical validation and debugging, covering all High-Speed interfaces and Power Delivery of our company EyeQ ASIC products.
What will your job look like:
You will deal with design, simulations, optimization and debugging of high-speed interfaces - like LPDDR4/5, PCIe Gen4/5, C/DPHY, Multi Giga-Bit Ethernet, High-Speed interfaces over Power Cables, Power Delivery Networks.
You will develop Layout guidelines, review the physical design process and check its quality.
You will deal with state-of-the-art signal & power integrity simulation tools and methodologies, advanced results analysis, optimization/verification of our company and customers' PCB designs, etc.
This is a dynamic work environment that requires interfacing with Silicon & Hardware design engineers, IP providers, Electrical and System Validation teams, Customer Application Engineers, EDA tools vendors, and product managers.
The proximity to Electrical Validation activities - we are a single SI/EV team - is another strong advantage, enabling joint simulation-measurements efforts.

You will join a team of talented and experienced Signal/Power Integrity (SI/PI) & Electrical Validation engineers with wide scope of responsibility, from Pre-Silicon SI/PI simulations to Post-Silicon Electrical validation and debugging, covering all High-Speed interfaces and Power Delivery of our company EyeQ ASIC products.
What will your job look like:
You will deal with design, simulations, optimization and debugging of high-speed interfaces - like LPDDR4/5, PCIe Gen4/5, C/DPHY, Multi Giga-Bit Ethernet, High-Speed interfaces over Power Cables, Power Delivery Networks.
You will develop Layout guidelines, review the physical design process and check its quality.
You will deal with state-of-the-art signal & power integrity simulation tools and methodologies, advanced results analysis, optimization/verification of our company and customers' PCB designs, etc.
This is a dynamic work environment that requires interfacing with Silicon & Hardware design engineers, IP providers, Electrical and System Validation teams, Customer Application Engineers, EDA tools vendors, and product managers.
The proximity to Electrical Validation activities - we are a single SI/EV team - is another strong advantage, enabling joint simulation-measurements efforts.

We are seeking an experienced and driven Quality and Reliability (Q&R) Engineer to own and manage the qualification and long-term reliability of advanced automotive semiconductor products. In this role, you will be responsible for defining, executing, and ensuring product compliance with industry standards (e.g., AEC-Q100, JEDEC, ISO26262), collaborating cross-functionally with design, test, packaging, and manufacturing teams to ensure robust quality performance throughout the product lifecycle.
What your job will look like:
Lead end-to-end quality and reliability activities for new automotive product introductions (NPI), including definition of Q&R plans, stress test strategy, and execution of qualification.
Define and align qualification strategy with AEC-Q100, JEDEC (JESD22), and customer-specific requirements.
Drive reliability risk assessments (FMEA, FMEDA, fault tree analysis) in collaboration with functional safety and design teams.
Manage product qualification timelines, budgets, and documentation, including reliability test reports, risk mitigation plans, and deviation justifications.
Interface with OSATs and test/assembly partners to ensure reliability test execution, including HTOL, ELFR, HAST, PTC, HTSL, and solder joint reliability.
Lead root cause analysis and corrective actions for product or qualification-related failures (FA/8D process).
Act as the Q&R voice in cross-functional reviews (DFX, tape-out, production ramp, and PCN).
Track field returns, drive reliability monitoring, and contribute to continuous improvement activities.
Support audits, customer quality inquiries, and product certifications as needed.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

we are seeking Product Managers to lead the development and management of advanced features for autonomous vehicles (AVs). This role will focus on creating exceptional products for both global automotive partners and our company's internal AV development.
What will your job look like?
Act as a technical product owner, for productizing and driving our company's AV features to meet performance and quality goals.
Collaborate with internal stakeholders (R&D , Product and Business Development) and external partners to define the product roadmap, ensuring alignment with our company's strategy and timelines.
Own the process of requirements elicitation to capture stakeholder needs and translate them into actionable product specifications.
Define and monitor data-driven performance KPIs to ensure product excellence.
Develop and maintain accurate, comprehensive documentation for internal and external use.
Support Business Development during pre-sale processes and customer onboarding.
Partner with leading car manufacturers, including conducting workshops, test drives, and product tuning to ensure adoption and satisfaction.
Champion cross-functional collaboration, managing initiatives in a matrix environment to ensure successful execution.