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2 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.

Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.

Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.

Taking part inflows development.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience.

Knowledge in physical design flows and methodologies (PNR, STA, physical verification).

Deep understanding of all aspects of Physical construction and Integration.

Knowledge in Physical Design Verification methodology LVS/DRC.

Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).

Great teammate.
This position is open to all candidates.
 
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10/02/2026
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineer to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you will be doing:

Physical design of blocks/top-level according to specifications under challenging constraints targeting for the best power, area, and performance.

Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.

Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.

Taking part inflows development.

Act as Partition/Unit level physical design technical leader and focal point.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering.

5+ years of experience in physical design.

Proven experience in RTL2GDS flows and methodologies.

Knowledge in physical design flows and methodologies (PNR, STA, physical verification).

Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).

Great teammate.
This position is open to all candidates.
 
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10/02/2026
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be responsible for chip floorplan and pin placement, ensuring integration within our innovative builds.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

You will perform physical layout implementation, planning and optimization, contributing to the development of our groundbreaking chips.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering.

You should have at least 5+ years of hands-on layout experience, demonstrating your proven expertise.

A strong background in Physical Verification methodology, including ERC, LVS and DRC, is necessary.

In-depth knowledge of advanced silicon process technologies.

Familiarity with physical build EDA tools, including Synopsys and Cadence.

A great teammate who thrives in a collaborative environment.

AI tools orientation or alternatively a desire to learn.

Ways to stand out from the crowd:

Experience in Linux environments.

TCL, Python, shell scripting abilities.

Experience with data collection and analysis.

Understanding of the chip and die verification process.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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11/02/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
Our Chip Design group is looking for best-in-class Verification Engineers to join our outstanding Silicon Engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a significant part in designing and verifying our groundbreaking and innovative chips, and enjoy working in a meaningful, growing, and highly professional environment where you make a huge impact in a technology-focused company.

What youll be doing:

Verification for chip blocks/entities according to specifications under challenging constraints and with high orientation to performance.

Daily work involves acquaintance with all aspects of chip development: Design, Micro- Architecture, Firmware, Production, and Verification.

Engage in cutting-edge PCIe generation working on latest PCIe gen7.
Requirements:
What we need to see:

B.SC./ M.SC. in Computer Engineering/Electrical Engineering/Communication Engineering or equivalent experience.

5+ years of experience in Verification.

High Level of English.

High motivation to grow and excel.

Ways to stand out from the crowd:

Knowledge in PCI Express standard.

Validated experience in Verification or RTL Frontend ASIC Design (Chip Design).

Background in Specman.

Background in RTL uArch & coding.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
We are seeking a CAD Engineer to join the Physical Design team.

You'll be joining our Physical Design team within us, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

You will be the tech lead for CAD within the team, leveraging your extensive backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Requirements:
Minimum Qualifications:
A VLSI Design Engineer with extensive experience in backend design.
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevent background.
5+ years of hands-on experience in a relevant domain.
Strong understanding of Place & Route flow.

Preferred Qualifications:
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
Physical Design team within us is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.

Your Impact
You'll be part of the team, which is at the heart of our software and ASIC design efforts.

You'll handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
Requirements:
Minimum Requirements:
A VLSI Design with extensive experience in backend design.
B.Sc./M.Sc. in Electrical Engineering.
Strong understanding of Place & Route flow.
7+ years of hands-on experience in a relevant domain

Preferred/Advantageous Qualifications:
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate, self-learning skills, and ability to work autonomously.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of experience with static timing analysis, including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and frequency goals setup with technology scaling.
Experience in constraints development for sub systems or SOC.
Preferred qualifications:
Experience with full-chip static timing analysis and timing closure.
Experience with scripting languages (e.g., Python, Perl, or TCL).
Experience with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), static timing analysis (STA), formal verification, and clock domain crossing (CDC).
Knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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2 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We are now looking for a Senior Chip Design RTL Design Engineer for the Switch Silicon group.

As a Chip Design Engineer at NVIDIA's Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state of the art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What you'll be doing:

Work in a combined design and verification team which develops some of the switch silicon core units.

Plan and Design RTL units / blocks according to Arch & Micro arch specifications under challenging constraints with high orientation to power, area, and performance.

Build reference models, verify and simulate chip blocks/entities according to specifications.

Work closely with multiple teams within organizations such as Architecture, Micro- Architecture, and FW.
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering.

5+ years of experience in RTL design or RTL verification.

Previous experience in networking - an advantage.

A team player with good communication and interpersonal skills.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Evaluate, analyze, implement, and integrate SRAMs, other memories (such as multiport register files), and custom circuits. Drive proper IP integration and margins with the physical design team.
Partner with foundries and IP providers, as well as internal technology, physical design, and architecture teams, to optimize products for PPA, schedule, and reliability in advanced CMOS nodes.
Drive and support test chip design, execution, and validation of critical circuit IPs.
Design and build custom circuits at the transistor and gate levels to support physical design and power-performance-area optimization.
Drive development of a leading edge technology platform for custom, high performance ASICs and SoCs, from design through manufacturing, packaging, and test.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience in Circuit Design, Physical Design (RTL-to-GDS), or Technology Development, including advanced nodes (e.g., 7nm or below).
Experience with custom circuit/IP and physical design, including Place and Route (PNR) and Static Timing Analysis (STA).
Experience in scripting and automation using Tcl and Python (or Perl).
Experience with SPICE and transistor level design in advanced nodes.
Experience in CMOS device physics, finfet/GAA/nanosheet architectures, and layout parasitics.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience working with major foundry technology files (PDKs), standard cell libraries, metal stacks, and other features.
Understanding of characterization and verification of standard cells/SRAMs/register files, including knowledge of power, noise, variation, and IR analysis.
Understanding of collaterals for front end and back end design teams.
Excellent track record of delivering optimized custom circuits/memories/IPs and PNR blocks for product tapeout.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design Team Manager within the Server Chip Design team, you will oversee the IP and SoC VLSI design cycle from architecture to production. In this role, you will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads.
You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and SoC.
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
Knowledge of one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
This position is open to all candidates.
 
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