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Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a NPI and Layout package Engineer on the packaging team, you will be working on fast-paced products for consumer devices. In this role, you will work with Hardware Designers and Mechanical Engineers throughout the full product development life-cycle, supporting package outline, component placement and routing, using advanced package technologies while analyzing package reliability and manufacturability aspects.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design the layout of package substrates using Cadence Allegro Package Designer.
Apply package substrate layout design rules from manufacturing point of view and electrical requirement considerations.
Generate high-quality design documents for substrate manufacturers and package assembly houses.
Enhance the package design work continuously by developing initiatives that drive efficiency and improve quality/cost/schedule of the package layout work.
Manage new ASIC packages during the NPI phase as the primary engineering owner, overseeing the product life-cycle from design lockdown to mass production release.

We have been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. Its a unique legacy of innovation thats fueled by great technologyand amazing people. Come join the team and see how you can make a lasting impact on the world. As an Optical Assembly Process Engineer, you become part of the R&D team, and you will be working on the forefront of the communication technology, building the interconnection infrastructure for the Sophisticated Computing and Artificial Intelligence revolution.

What you'll be doing:

Participate in the process of bringing up a new technology from the R&D stage, to the engineering and bring-up then to the high volume manufacturing lines.

Process development using passive and active alignment techniques and machines.

Owner for process development steps in a new product assembly.

New machine development with vendors for various processes.

Documentation of work instructions after process development.

Characterizing and investigating of the compatibility of new adhesives, soldering material, packaging material, etc. , to the optical, interconnect products.

Help in the debug of failures using various methods inspection and characterization methods.

Participate in taskforces related to mass production.

We are looking for a creative and independent Reliability Product owner. Our Networking unit has continuously reinvented itself over two decades. Our high-speed buses & network products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting End-to-End High-Speed Ethernet and InfiniBand Solutions We're looking to grow our company and build our teams with people who can join us at the forefront of technological advancement. We need a creative individual who will help transfer Network Silicon ICs products (Switch, NIC, SmartNic) from design engineering to mass production while ensuring meeting our milestones at high quality and reliability.

You will be exposed to various aspects of product qualification and will be responsible for integrating all future Network IC products reliability activities, from product risk assessment, failure mechanisms and reliability tests. You will define and prioritize the reliability milestones and drive the required activities to meet our compony goal. Your work will include multiple interfaces and phases from foundry through hardware, testing and quality & reliability Milestones requirements. If you are passionate about enabling of the highest quality Network products that will change the world, we want to hear from you!

What you'll be doing:

Prepare gap analyses and risk assessment based on Silicon and package product related features.

Prepare JEDEC based qualification plan for product reliability.

Interact with Hardware, Test Engineering, External vendor, NPI team to plan and lead all product aspects of reliability.

Apply trade-offs for material and schedule where necessary based on deep understanding of the product.

Problem solving leadership and re-planning as necessary.

Product parameters analysis and debug as necessary.

Monitor and supervise program progress to pre-defined milestones.

We are looking for a Manufacturing Technology Process Engineer someone who is excited to join a growing group of diverse individuals responsible for handling high-mixed manufacturing technologies challenges.

We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI the next era of computing. We are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence. Make the choice to join us today.

What youll be doing:

Work with SI, Thermal, Hardware engineering, IC development team to examine and understand road map requirements, understand the gaps. Collaborate with PCB, PCBA, materials vendors, R&D teams and management, drive capabilities to overlap with our NETWORKING needs.

DFX: Build and Sustain design guidelines for functionality, test ability, reliability, cost. Become an active member in industry Eng. forums, IPC, HDPUG, SMTA... Reflect our interest and affect Industry specs & agenda. Preform Industry Benchmarking.

Ongoing PCB/PCBA activities: New materials from Selection to Implementation. New manufacturing technologies study, proof of concepts and implementation on products. Provide ongoing technological and process improvements to meet quality, cost and production goals. Engage with production line work. Provide ongoing production support to ensure continuous production.

PCB, PCBA reliability modelling.

Drive CMs to excellence in aspects of manufacturing process, quality management and HVM mindset.

We are seeking a highly motivated Mechanical Engineer or Process Engineer with strong orientation to machines, to join the engineering team .
This role involves responsibility for defining and improving technological processes, providing technical support to our global production sites, and leading project-based activities including technology transfer from R&D to production and validation processes.
The position includes global support and collaboration with international teams.
Key Responsibilities:
Define, analyze, and optimize manufacturing processes.
Prepare technical documentation for engineering changes.
Plan, execute, and summarize validation activities for processes, equipment, and systems.
Transferring products from development to manufacturing.
Collaborate with global teams to support international operations.

We are looking for a Silicon Manager specializing in data flow management
Job description:
As a Silicon Data Flow Manager you will be responsible for improving silicon-photonics yield and performance through data-driven analysis, cross-functional collaboration and proactive issue resolution.
You will serve as the key interface between R&D, Process, and Production teams, ensuring efficient data flow, rapid issue identification and continuous process improvement across wafer fabrication, device testing, and packaging stages.
Responsibilities:
Perform silicon process and chip-level data analysis, establishing correlation between chip and wafer performance.
Lead process debug and yield loss analysis at chip/wafer level, driving root cause investigations and corrective actions.
Manage engineering approval forum to release production material.
Collaborate closely with vendors to implement new product tests and resolve technical/process issues.
Act as a key interface between design, testing, and production teams, ensuring alignment across the product lifecycle
Oversee and coordinate the transfer of data related to silicon design, testing, fabrication, and characterization between Production and R&D departments.
Develop and implement data management strategies to ensure data accuracy, security, and accessibility.
Maintain proper documentation of data transfer protocols, version control, and data integrity checks.
Support data analysis efforts to improve silicon performance, yield, and quality.
Ensure compliance with company policies and industry standards related to data security and confidentiality.

Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager.! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.

Our Networking division is a leading supplier of innovative end-to-end NVLINK, InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance, using our AI solution and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors, including high-performance computing, enterprise, data centers, cloud computing, big data, and Web 2.0.

What you'll be doing:

You own silicon bring-up schedule from power on to production release.

Negotiate silicon and board demand with teams and drive a bottom-up forecast.

Oversee and manage chip and board allocations across the company.

Lead prototype chip delivery to internal customers.

Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase.

Identify and mitigate risks to schedules and programs.

Communicate status to cross-functional teams as well as upper management.

Continuously evaluate internal tools and processes and drive fixes to improve productivity.

Create new and fix existing processes between different teams.

Drive implementation of SW tools for data analytics and process evaluation.