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we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Formal Verification Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the formal verification strategy for chips that power the world's largest AI clusters.
As the Formal Verification Engineer, you will be a foundational member of our Israel R&D center. You wont just execute tasks; you will define the Formal verification strategy for chips that drive the worlds largest AI clusters. You will dive deep into the technical details, proving the correctness of complex designs and ensuring they flawlessly meet specifications.
Key Responsibilities
Own and develop formal verification environments from scratch through to sign-off
Apply formal verification methodologies and strategies to prove the correctness of intricate designs
Work closely with the Architecture, Design, and DV teams to identify verification needs and pinpoint design requirements
Create robust formal environments, analyze complex RTL designs, and apply advanced formal techniques to find corner-case bugs
Analyze verification results, identify failures, and collaborate directly with designers to resolve issues efficiently
Architect and develop generic, common formal functions and properties to be reused across multiple projects.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Front-End CAD Engineer to join our local engineering powerhouse from the ground up.
As a Front-End CAD Engineer, you will be the backbone of our chip design ecosystem. You wont just be using tools; youll be architecting the methodologies, automation scripts, and design flows that enable our hardware teams to push the limits of silicon performance. Your work directly impacts the productivity of the design team and the time-to-market for our next-generation processors.
Key Responsibilities
Develop, maintain, and optimize RTL generation tools, building automated IPs and SoC schemes
Create robust applications using Python and Tcl to automate models build, regression and analysis tools and other assisting tools for all disciplines in front-end flows
Evaluate and integrate Electronic Design Automation (EDA) tools from vendors like Cadence, Synopsys, and Mentor Graphics
Define the methodologies of usage and integrate AI tools in this fast-growing field impacting all VLSI development flows.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our company products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in EMIR CAD to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will continuously develop the Electro-Migration and IR Drop (EMIR) flow, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) flow
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Collaborate closely with Analog/SerDes designers to integrate current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis flow
Understand root-cause analysis for voltage drop violations and EM risks
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data.

We are looking for best-in-class Chip Design Verification Engineer to join our outstanding Networking Silicon engineering team. We are developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! Come and take a significant part in designing and verifying our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.

What you will be doing:

Join accelerators IP group in Beer-Sheva, working on RiscV processor IPs.

Verification for chip blocks according to specifications under challenging constraints and with high orientation to power, area and performance.

Daily work might involve any or all aspects of chip development: Verification, Design.

Work closely with Firmware and other groups around the globe.

We are looking for a best-in-class Senior Full-Chip Verification Engineer with a strong infrastructure mindset to join our Networking Silicon team. In this role, you will be responsible for the development and verification of our next-generation NICs at the system level, while also driving the evolution of the simulation infrastructure powering our verification flows. You will contribute to the architecture of high-speed communication devices by driving full-chip verification execution for the networking solutions powering the world's most advanced data centers, in a meaningful, growing environment where you make a huge impact in a technology-focused company.

What you'll be doing:

Simulation Infrastructure & Acceleration: Identify bottlenecks in the verification flow and engineer creative solutions - building frameworks, optimizing regressions, and accelerating simulation throughput through innovative tooling.

Multi-Language Development: Work across a diverse technology stack (SystemVerilog/UVM, Specman, Python, C/C++, scripting) - writing code and solving problems at every layer, from RTL testbenches to infrastructure utilities and automation.

System-Level Debug & Analysis: Gain a strong understanding of chip micro-architecture and features, investigate, debug, and resolve cross-block issues to guarantee feature correctness and compliance.

AI-Enhanced Development: Accelerate development by leveraging cutting-edge AI coding tools and frameworks - applied to both verification and infrastructure challenges.

Cross-Team Collaboration: Work closely with multiple teams within organizations such as Architecture, u-arch, Firmware and all units inside the NIC.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary System Validation Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
Job Description
The mission of this role is to perform system validation for our companys highly advanced devices, that includes defining strategy, develop tools, innovate, be creative to make sure devices are performing as they should in all aspects, logical, performance, durability, stress and more.
You will be part of the site located at Israel (Haifa - Matam), surrounded with highly experienced and professional engineers who will escort, mentor and support you on your journey at our company Labs Israel.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Staff DFT Engineer at our company Labs, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.
Key Responsibilities
DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks.

We are seeking a Front-End Integration Engineer for the NIC Silicon group. Join our team in our Networking business unit and be part of the innovative build and implementation of the next generation Network Adapter Silicon chips. Contribute to the development of powerful communication devices.

What You'll Be Doing:

Own and maintain Continuous Integration pipelines. Monitor, complete, and fix daily and nightly CI flows in front-end build areas. These include Lint, Synthesis, Equivalence Checking and Simulation.

Automate EDA Flows: Build, develop, and maintain robust automation scripts using Python, Tcl scripting, and Shell to integrate EDA tools (Synopsys, Cadence) into automated build pipelines.

Manage Perforce Integration: Maintain multi-IP branch/stream strategies, manage workspace specs, complete hardware build drops, and handle release labels/tags in Perforce (Helix Core).

Support Engineering Teams: Act as the primary point of contact for RTL and verification engineers to debug flow crashes, bottlenecks, environment setups, and CI failure reports.

Enforce Quality Gates: Implement automated check-in and change list triggers to run sanity checks, linting, and style enforcement before code is committed to main streams.

Optimize Infrastructure: Monitor compute farm resources (LSF) and storage usage to reduce pipeline runtime and improve overall execution efficiency.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.