דרושים » הנדסה » ATE Engineer

we are looking for a Failure Analysis Engineer.
Job Description:
Lead fault isolation and root cause analysis of memory and logic failures, including electrical, test, and yield failures, from initial failure signature through physical confirmation
Analyze failures at device, memory-cell, array, and circuit level, differentiating between design, test, device, process, and physical failure mechanisms
Correlate electrical characterization, memory-test and yield results, schematics, layout, and physical FA findings to identify and validate root cause
Develop and execute effective fault-isolation strategies, localizing failures down to the relevant cell, circuit, interconnect, or physical structure
Work closely with Design, Device, Test/Product, Process, Reliability, and Physical FA labs to solve complex failures and drive corrective actions
Improve FA methodologies, prepare and present engineering FA report on complex failure investigations

Be part of the team that is responsible for developing and optimizing the state-of-the-art analog circuits that power our embedded ReRAM and mixed-signal products.
In this role, you will take the lead on designing high-performance analog circuits, driving innovation in mixed-signal systems from concept through production. Youll partner closely with digital design, system architecture, and process engineering teams, playing a key role in bringing our next generation of memory products to market:
Design and develop complex analog circuits, including amplifiers, complex memory arrays, and LDOs, ensuring reliability and performance
Collaborate with cross-functional teams to define system specifications and architecture, translating requirements into actionable designs
Conduct thorough simulations and analyses to validate designs, using tools such as Cadence Virtuoso and Siemens Solido while identifying and mitigating risks early in the design process
Oversee the transition of designs from prototype to production, ensuring compliance with quality and industry standards
Apply deep expertise in analog circuit design - including amplifiers, voltage references, comparators, and ADCs/DACs - to push the boundaries of performance

Required Wafer-Scale System: Computation (LLM) and Communication (NoC) Co-Design
In this job opening, we are seeking a highly motivated and visionary researcher to join our team focused on chiplet-based computing systems. This role involves research and development in chiplet-based architectures, aiming to overcome performance and scalability limits of traditional compute platforms.
Responsibilities:
Conduct cutting-edge research on the co-design of communication and computation for wafer-scale systems. On the communication side, the work focuses on architecting Networks-on-Chip, providing scalable, high-bandwidth, and ultra-low-latency interconnects that efficiently span multiple dies and support fine-grained data movement. On the computation side, the research emphasizes optimizing and mapping training and inference workloads to fully exploit wafer-scale resources, improving performance, scalability, and energy efficiency through intelligent task placement and scheduling.
Investigate various aspects of system design, including:
Network-on-Chip design, further including Topology exploration, routing algorithms, and protocol/flow-control design to support high-throughput collective communication, low-latency synchronization, and efficient model/data parallelism
Expressing and Mapping LLM Parallelism to Wafer-Scale System that simplify LLM parallelism (e.g., tensor, pipeline, and data parallelism) and efficiently map training and inference workloads onto wafer-scale system.

We are looking for a highly analytical, detail-oriented Innovation Expert to join our Open Innovation team. This role is ideal for candidates who sit at the intersection of deep tech, startup ecosystem and academy, possessing strong technology analytical skills, clear communication, and a foundational background in computer architecture research.
In this role, you will drive our external innovation strategy by managing academic research collaborations, scouting early-stage deep-tech startups and conducting technical due diligence.
Key Responsibilities:
Academic Cooperation & Research Partnerships: Identify and build direct collaboration agreements with world-class professors, research labs, and universities. Facilitate joint research projects, tech-transfer initiatives, and track academic spin-offs.
Startup Scouting & Ecosystem Mapping: Actively identify, source, and map early-stage deep-tech startups and emerging tech companies globally within the companys strategic domains.
Technical Due Diligence: Evaluate startup technologies, product-market fit, and team capabilities. Analyze technical validity and assess how external innovations align with our internal roadmaps.
Ecosystem Analysis: Conduct deep-dive analyses of startup ecosystems, venture capital trends, and academic spin-offs to identify high-potential investment and collaboration opportunities.
Investment & Collaboration Support: Synthesize technical and commercial findings into clear, structured scouting reports, investment tech memos, and presentations for senior leadership to drive partnership or investment decisions.
Cross-Border Collaboration: Act as a bridge between startup founders, academic innovators, and internal global teams (including European and China-based business units) to facilitate joint POCs, or investment reviews.
Track Tech Domains: AI infrastructure, advanced semiconductors, hardware-software co-design, and AI data movement.

Required CPU Core Micro Architect
Job Description
Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.