לוח משרות דרושים Board Design משרה מלאה, לחיפוש זה נמצאו 41 משרות

Requirements:
You're the right fit if:
Bachelor's degree in Electrical Engineering.
7+ years of experience in board design working on multidisciplinary products.
Experience in board design tools, preferably Siemens EDM / Xpedition.
Deep understanding of Signal Integrity (SI) and Power Integrity (PI).
Experience in digital circuits design, power design, and analog circuit design.
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation.
Familiarity with PLM tools, especially Windchill.

Advantages
Experience with FPGA-based systems.
Experience in medical devices or other regulated industries.
Background in thermal design and power optimization.

Requirements:
Must
B.Sc. in Electrical or Electronic Engineering
3+ years of board design experience.
Experience with processors, DDR, Ethernet, PCIe, power, and high-speed interfaces.
Strong hands-on debugging and laboratory skills.
Independent, technically strong, and a good team player.
Advantage:
Experience with telecommunications products.
Experience with FPGA/VHDL.
Experience with OrCAD and Allegro.

Requirements:
* B.Sc. in Electrical Engineering.
* 5+ years of experience in board-level hardware design.
* Strong experience in analog and digital design, simulations, and component selection.
* Hands-on experience with hardware bring-up, testing, and integration.
* Experience with OrCAD design tools (mandatory).
* Familiarity with EMC/EMI standards.
* Experience with STM32 microcontrollers (an advantage).
* Fluent in Hebrew and English. Preferred Qualifications
* Experience with MIL- STD standards.
* Knowledge of programmable devices (CPLD / FPGA).
* Ability to work with software teams and read Embedded code.
* Customer-facing experience and willingness to travel abroad.
* Experience with Nvidia, Qualcomm, or similar SOM platforms.

Requirements:
Bachelor's degree in electrical engineering
At least 3 years of experience in digital electronic board design
Experience with requirements capture and top-level architecture
Understanding of PCB layout methodologies and high-speed PCB design concepts
Experience working with signal integrity simulation tools such as Hyperlynx, Ansys, or similar tools
Experience with PCB design tools such as Altium Designer, Mentor Expedition, or Cadence
Experience in Voltage Regulated Modules DC/DC (VRM) design - Advantage
Background in retimers and redrivers - Advantage
Experience in Analog Circuit Design (amplifiers, filters, etc.) - Advantage
Problem-solving skills, teamwork abilities, and effective communication skills.

Requirements:
B.Sc. or M.Sc. in Electrical Engineering or a related field.
2+ years of hands-on experience in VLSI backend design or a relevant physical design domain.
Strong understanding of the Place & Route flow.
Hands-on experience with physical synthesis, place and route, optimization, timing closure, or design floor planning.
Preferred Qualifications:
Understanding of physical construction and integration concepts across backend implementation.
Knowledge of physical design verification methodology, including LVS and DRC.
Familiarity with physical design EDA tools such as Synopsys, Cadence, or similar platforms.
Ability to learn independently, take ownership of assigned tasks, and work effectively with teammates.
Strong problem-solving skills and attention to detail in complex technical environments.

Requirements:
B.Sc. in Electrical Engineering or equivalent practical experience.
3+ years of experience as a hardware/board design engineer, with a strong background in executing complex hardware projects.
Experience in high-speed and multi-layer PCB design.
Hardware-oriented, with experience in measurements, characterization, and using lab equipment and hands-on experience in PCB bring-up and systematic debugging.
Preferred Qualifications:
Demonstrated success in leading multi-disciplinary projects.
Strong project management abilities, self-driven, with excellent interpersonal skills.
System orientation with a multi-disciplinary approach and multitasking capabilities.

Requirements:
Bachelors degree in Electrical or Computer Engineering.
At least 3 years of experience in hardware or post-silicon validation.
Hands-on experience with lab equipment performing high-speed, clock, and precise voltage measurements.
Knowledge of high-speed interfaces and high-power DC/DC design.
Preferred Qualifications
Experience bringing up ASICs on EVBs with Board Design, FPGA, SerDes, and Software teams.
Proficiency in debugging issues in the lab using VNA/TDR, oscilloscopes, and phase noise analyzers.
Experience developing testing environments, performing validation activities, and analyzing data.
Familiarity with production testing and yield improvement.

Requirements:
A VLSI Design Engineer with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevant background.
2+ years of hands-on experience in a relevant domain
Strong understanding of Place & Route flow
Preferred Qualifications:
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.

Requirements:
B.Sc./M.Sc. in Electrical Engineering from a top university
6+ years of experience in a relevant field
RTL design experience
Familiarity with UVM and functional verification methodologies
Preferred Qualifications:
Experience with MATLAB simulations and bit-exact modeling environments
Familiarity with mixed-signal systems and environments
Knowledge and hands-on experience with Clock Domain Crossing (CDC)

Requirements:
Bachelors degree in Electrical Engineering or a related field.
5+ years of experience in package, PCB, or high‑speed design engineering.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for layout and design.
Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
Preferred Qualifications:
Masters degree in Electrical Engineering
Experience with advanced packaging technologies, interposers, or multi‑die systems
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations
Proven track record to drive design improvements and lead stakeholder coordination throughout the design process

Requirements:
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Prior technical leadership or package ownership on high-volume products .

Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.

Requirements:
What we need to See:

B.Sc./M.S.c.in Electrical Engineering or Practical Engineer certificate or equivalent experience.

10+ years experience with electro-optical and High-Speed Board Design.

Strong background in high-frequency and broadband (>20GHz) design.

Strong system-level understanding.

Background in thermal and mechanical design considerations.

Good SI/PI understanding in perspective of multi-layer PCB design.

Experience in electro-optical and High-Speed lab environment - High-end measurements.

Knowledge of electro-optical components: Drivers, CDR, Gearbox, DSP, Lasers, Detectors, Amplifiersetc.

Strong abilities to work as part of a team. Highly motivated.



Ways to stand out from the crowd:

Design and knowledge with Data-Center environment [Switches/CPU/DPU/GPU]

Experience in layout extraction and board-level simulation.

Knowledge with board-design tools (Cadence environment).

Familiar with NRZ/PAM-4 signaling schemes as well as familiar with various communication protocols: SPI, I2C, SerDes, PCIe, Ethernet.

Previous experience as a technician/Practical Engineer at IDF technology units.

Requirements:
* Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
* Participate in the development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
* Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly.
* Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps.
* Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
* Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and system.
* Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance.
* Utilize state-of-the-art laboratory equipment. Requirements What Were Looking For:
* B.Sc. in Electrical Engineering.
* 8+ years as a board designer with experience in executing complex hardware projects.
* Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
* Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
* Experience in design ownership on major blocks/clusters from definition through implementation phases.
* Strong hands-on laboratory skills and debugging capabilities.
* Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
* Strong project management skills, independence, and excellent interpersonal abilities.
* Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
* Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate:
* Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
* Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
* Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
* Practical experience with high-speed sampling oscilloscopes and optical spectrum analyzers.
* Experience with optical transceivers.
* Knowledge of photonic integration technology and its ecosystem.
* Experience in lab automation using Python -based tools.

Requirements:
What we need to see:

B.Sc. in Electrical Engineering (or equivalent experience).

2+ years as a board designer, experience in complex HW projects execution.

Hands-on lab skills.

Background in leading Multi layer PCB design.

Experience in high current power delivery design.

Personal: Project management skills, independent, excellent interpersonal relationship.


Ways to stand out from the crowd:

Experience in data-center switches products design for high volume manufacturing.

Proven knowledge in high speed design .

Experience in embedded systems design.

Knowledge in advanced PCB technology.