לוח משרות דרושים Board Design משרה מלאה

we are seeking talented researchers to join our industry-leading Digital Intelligence Security Research Labs.
As a security researcher on our team, you will focus on identifying vulnerabilities within Apples ecosystem and developing innovative exploit strategies to gain access to iPhones and other devices, enabling the extraction of crucial evidence for law enforcements.
Key responsibilities:
Research on territories with little-explored vulnerability
Work on the production of world-unique capabilities to extract evidence from phones and other embedded devices.
iPhones and other iOS devices present tough challenges from a forensics perspective and involve hardware-backed encryption (SiDP), secure crypto coprocessor (SEP), and secured boot chain (SecureROM).
New iPhones present state-of-the-art exploit mitigations such as PAC, KTRR, and PPL.
Become a member of Labs Group, focusing on Security Research for mobile devices.
Execute your own (shell) code on top-notch technology mobile platforms hardened with challenging mitigations
Collaborate with a team of passionate researchers dedicated to solving modern digital intelligence challenges, years ahead of others in the industry.
Take part in world-class research results, assisting law enforcement by enabling lawful evidence extraction, and putting criminals behind bars every day.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

> Design and development of complex anlog & digital boards for Motion Control applications > Participate in the architecture design of future applications and products > Support existing designs, implement changes and reliability improvement enhancements, test and validate new designs Primary Duties and Responsibilities > Design and develop complex boards > Define Requirements, engineering specs and Validation documents > Select major components, lead layout and placement using contractors > Perform Bring-Up tasks, validate design, support transition to manufacturing, support the boards in their life cycle

We are looking for an experienced Hardware Design Engineer with a strong background in high-speed board design to join our Radar HW Group.
Our Imaging Radar organization develops automotive radar systems that enable advanced driver assistance and fully autonomous driving. The Radar HW Group has multidisciplinary responsibilities and owns the end-to-end development of all radar hardware which includes: RF and high-speed digital boards, IC packages, Mechanical solutions & Antenna design
What will your job look like?
Design high-speed boards from concept to production
Own all design stages: architecture, schematics, layout, modeling, and design reviews
Work on boards that include high-speed SERDES, LPDDR5/4, power circuits, and additional digital interfaces
Collaborate closely with RF, mechanical and system teams.

Required Senior Board Designer
Role Summary:
Serve as a key contributor within a hardware design team developing advanced ultrasound systems.
Lead and execute high‑quality PCB design with a focus on performance, reliability, manufacturability, and cost.
Collaborate with internal engineering groups and external partners to develop complex system modules.
Provide ongoing support, maintenance, and continuous improvement for legacy hardware platforms.
Job Responsibilities:
Drive the design and development of digital and analog circuitry across the full product lifecycle - from concept and prototyping through mass production.
Perform circuit analysis, simulations, and signal integrity verification for both analog and high‑speed digital designs.
Apply critical thinking and problem‑solving skills to identify issues, propose solutions, and communicate findings clearly.
Utilize Cadence/OrCAD tools for schematic capture and PCB layout.
Work effectively with cross‑functional teams, including mechanical, firmware, manufacturing, and external ODM partners.
Lead electrical design activities with external teams, ensuring technical alignment and high‑quality delivery of system sub‑modules.
Produce clear, thorough engineering documentation and communicate design decisions effectively.

Required Senior Board Design Engineer
Job Description Summary
Hardware engineer with strong background in system electrical design, power design, design for EMC/EMI and electrical safety , high power distribution units and boards design.
Responsibilities
Duties include (but are not limited to):
Provide electronic, electro-mechanical, or similarly related technical support for design, manufacture, or aftermarket repair services as assigned.
Troubleshoot complex equipment utilizing schematics and knowledge of the assigned technology, systems, and components.
Design and provide guidelines for EMC/EMI based on standards and experience.
Provide design guidelines for high power distribution units and power supply units.
Design and provide guidelines for safety based on standards.

Senior Board Design Engineer Own the hardware. Drive the innovation. Shape the system. We are looking for a Senior Board Design Engineer to take a leading role in designing and developing complex electronic boards for advanced defense systems. This is a high-impact, hands-on technical leadership role within a hardware team-ideal for someone who thrives on ownership, influences architecture decisions, and enjoys working across multidisciplinary environments. What Youll Do
- Lead end-to-end board design - from concept to production
- Own hardware architecture and drive key technical decisions
- Deliver across the full lifecycle: schematics, layout guidance, bring-up, validation & production
- Act as a technical focal point across hardware and cross-functional teams
- Collaborate closely with software, mechanical, and system engineers
- Work with suppliers, subcontractors, and manufacturing partners
- Perform deep debugging, analysis, and root-cause investigations
- Take part in design reviews, EMC testing, system validation & field trials
- Support manufacturing transition, including documentation and yield improvement

we are a global leader in the development and manufacturing of advanced infrared detectors and electro-optical solutions for defense and commercial applications.
We are seeking a skilled board designer with extensive experience in high-speed digital design to join our Board Design R&D Team. In this role, you will define system and hardware requirements, design FPGA-based hardware platforms, and validate high-speed interfaces such as DDR4, USB3, Ethernet, MIPI, and Camera Link. You will work closely with firmware, software, and mechanical engineers to deliver robust, production-ready Embedded systems for advanced electro-optical products.
Key Responsibilities
Define hardware requirements and prepare detailed design documentation for FPGA-based boards, including power architecture, configuration, and peripheral circuitry.
Develop schematics and oversee PCB layout for complex, high-speed multilayer boards.
Perform hardware simulations and signal analysis using tools such as LTspice and Cadence.
Design and validate high-speed interfaces including DDR4, USB3, Ethernet, MIPI, and Camera Link.
Define and manage PCB stack-ups, impedance control, differential pair routing, and high-speed layout constraints.
Conduct Signal Integrity (SI) and Power Integrity (PI) analysis to ensure performance, robustness, and reliability.
Lead prototype bring-up, testing, and debugging using lab equipment (oscilloscopes, logic analyzers, VNAs).
Collaborate with firmware, software, and mechanical teams to ensure full system integration.
Participate in design reviews, DFM/DFT processes, and continuous design improvements.
Support production and NPI activities, and resolve hardware-related manufacturing issues.

We are looking for Senior Hardware Engineer who can be part of the System& Platform R&D group, who is ready to take on technical leadership and help drive the development of complex, high‑performance hardware for communication and networking systems.
If youre passionate about high‑speed digital design, enjoy mentoring engineers, and thrive in a hands‑on technical environment.
What Youll Do?
Hardware Design & Ownership
Design high-speed digital boards (SerDes, DDR, Ethernet).
Own schematic development and closely oversee PCB layout.
Ensure robust SI/PI performance through analysis and review.
Lead board bring‑up, validation, troubleshooting, and optimization in the lab.
Cross‑Functional Collaboration
Work closely with SW, FPGA, mechanical, and RF teams for system integration.
Present technical insights, design updates, and project risks to management.

In this role, you will design complex boards from the requirements stage to bring up, support, and production.
Your tasks will include: requirements collection, design specifications, circuit design, component selection, schematic capture, circuit simulations, accompany layout with PCB designer, documentation, acceptance test specification, bring-up, debugging in the lab, and user support.
A significant part of the job will require proactive interaction with peers in Israel and in California.

As a Hardware Board Design Engineer , you will own the electrical design of complex Big Data Analytics systems. You will drive the development of next-generation Analytics Processing Unit (APU) accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Concept/Allegro, or similar).
Responsibilities:
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (APUs) and high-speed memory (LPDDR5/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 5, DDR5 and LPDDR5.
Collaborate and manage Signal Integrity (SI) engineers to define routing constraints and stack-up.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first silicon/first board. Debug complex hardware issues. Root-cause failures to component, assembly, or design issues