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join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

as a quality and reliability (q&r) engineer, you will lead the qualification and long-term reliability of advanced system -on-chip ( SOC ) and RF semiconductor products for automotive applications. youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
what will your job look like:
define and manage quality and reliability specifications, simulations, and qualification plans for SOC and RF die and package.
plan and execute automotive-grade qualifications per standards such as aec-q100, jedec jesd22, and iatf 16949.
design and implement die-level and package-level stress tests.
select and prepare electrical, environmental, and mechanical TEST platforms for reliability testing.
define requirements for pre-si q&r (e.g. esd, lu, em, ir drop), design-for- TEST (dft), electrical characterization, and post-si q&r testing of digital, mixed-signal and RF socs.
collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (osats).
lead failure analysis, reliability modeling, and corrective action processes (e.g., 8d, fmea, fmeda).
document and certify automotive standards compliance, including ppap/apqp deliverables.

our company has been transforming computer graphics, pc gaming, and accelerated computing for more than 25 years. its a unique legacy of innovation thats fueled by great technology-and amazing people. today, were tapping into the unlimited potential of ai to define the next era of computing. an era in which our gpu acts as the brains of computers, robots, and self-driving cars that can understand the world. doing whats never been done before takes vision, innovation, and the worlds best talent. as an employee, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. come join the team and see how you can make a lasting impact on the world.
are you ready to take your engineering career to the next level? our company , a world-class technology company, is seeking a passionate package engineer to join our team in israel. in this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated ic substrates for our groundbreaking products. at our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. as a package engineer, you will work closely with si, layout, and asic design teams to develop complex, top-of-the-line asic packages. you will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
what you will be doing:
leading development of cutting-edge microelectronics packaging of our networking business units future products, evaluating our products for reliability and performance.
review manufacturability readiness at each milestone. 
work with world leading vendors to develop highly challenging packaging solutions.
leading the development of groundbreaking microelectronics packaging for our networking business unit's future products
collaborating with world-leading vendors to develop highly ambitious packaging solutions
thriving in a dynamic and challenging environment
join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
monitor substrate and assembly production kpis and collaborate with cross functional teams to define and monitor yield improvement plans for continuous improvement and establish quality standards.
lead process changes reviews, prepare and present data in change control board meetings, lead technical reviews of product changes throughout the supply chain.

we are looking for a creative, independent product engineer to join our company networking business unit. for over two decades, our networking has continuously reinvented itself, delivering industry leading high speed interconnect products. our solutions set the standard for performance, scalability, and innovation enabling true end to end high speed ethernet and infiniband solutions.
as we continue to grow, we are seeking exceptional engineers to help drive the next wave of technological advancement. in this role, you will take a leading position in the interconnect cluster performance domain. you will work closely with global technical teams to gain deep architectural insight, investigate customer complaints, and drive product excellence. if you are passionate about building high-quality products that make a real-world impact, we want to hear from you.
what youll be doing:
maintain high-quality product deliveries through in depth Big Data analysis and failure analysis
improve product performance by collaborating with process, mechanical, hardware, and thermal teams
lead high impact task forces and cross functional working groups
help design and enhance product TEST plans to ensure high customer satisfaction
manage failure analysis for both field and lab issues
collaborate closely with customer support, marketing, engineering, quality, and reliability teams

we are seeking an experienced, analytical, and highly motivated engineer to lead chip and pcb npi activities for networking products. this role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. the ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. as part of our networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.
what you'll be doing:
lead chip/substrate/osat/pcb qualification for networking products (2nd source).
collaborate with engineering teams to identify suitable substrate suppliers based on technical capability and capacity and define the qualification plan.
coordinate and lead changes through the ecr/ccb process.
work with engineering teams to create the product bom and plan initial qualification activities on the assy floor.
track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.
develop and execute risk plans for material requirements prior to qualification completion.
identify critical paths and bottlenecks; implement risk management methodologies.
develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.
create and maintain systems for data management and task tracking using power BI and other advanced systems, including ai-driven tools.

we are now looking for an engineering lab technician in the optical assembly team to support developing new nvidia's products. this newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help build and develop our industry leading transceivers. in this role you will run multiple sophisticated assembly platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. the primary responsibility is to support our engineering teams during development to ensure outstanding quality gpu server products may be released to the market and delight our customers so that ai scientists and datacenter operators can achieve their professional aspirations using nvidia technology. the new lab team member will work independently to complete daily tasks according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.
what youll be doing:
participating in development of new packaging technologies while working tightly with process development team.
prepare and conduct experiments to TEST new assembly technologies and materials.
operation and maintenance of variety of platforms involved in process of packaging - wire bonding/pick&place/active alignment.
maintain laboratory hardware and handle materials.

we are seeking a skilled failure analysis (fa) engineer with expertise in x-ray inspection techniques to join our av platform team. the ideal candidate will specialize in using advanced x-ray imaging and other analysis methods to investigate product failures, identify root causes, and provide actionable insights to improve product quality and reliability what will your job look like?
perform detailed failure analysis using x-ray imaging systems and related diagnostic tools to inspect electronic components, assemblies, and materials.
interpret and analyze x-ray images to detect structural anomalies, defects, voids, cracks, delamination, and other failure mechanisms.
develop and optimize x-ray inspection procedures and protocols for failure analysis and quality control.
prepare TEST specimens: cutting, mounting, grinding, polishing and chemical etching
collaborate with product engineering, Quality Assurance, and manufacturing teams to support product development, troubleshooting, and continuous improvement efforts.
prepare detailed technical reports documenting findings, root cause analyses, and recommended corrective actions.
support reliability testing and failure mode analysis for new and existing products.

be part of a team that pushes boundaries, developing custom silicon solutions that power the future of direct-to-consumer products. you'll contribute to the innovation behind products loved by millions worldwide. your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our mission is to organize the world's information and make it universally accessible and useful. our team combines the best of ai, software, and hardware to create radically helpful experiences. we research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. we aim to make people's lives better through technology.as a power and signal integrity engineer, you will be responsible for the design and characterization of signal and power integrity of our ic designs. you will design the external electrical interfaces of the device, from their signal/power-integrity and electrical usage perspectives.you'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our ic designs meet systems design budgets and achieve the highest performance. you will work with systems architects, asic design, systems engineers, and partner cross-functionally with teams and external vendors/partners.the ml, systems, & cloud ai (msca) organization at designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all services (search, youtube, etc.) and cloud. our end users are, cloud customers and the billions of people who use services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
design and optimize power distribution networks (pdn) across chip, package, and board levels. this includes managing power/ground planes, decoupling capacitors, and power gating strategies.
conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (ssn/sso), voltage drops (ir drop), and electromagnetic interference (emi).
implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like upf/cpf.
generate precise electrical models (e.g., s-parameters, spice models) for components such as packages, pcbs, and connectors for use in simulations.
execute lab measurements utilizing TEST equipment like oscilloscopes, vector network analyzers (vna), time domain reflectometers (tdr), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

in this role, you will help build socs by driving quality and reliability processes from the integrated circuit (ic) perspective. working with various cross-functional teams, you will develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute TEST plans. within the larger organization, you will collaborate with global hardware quality and reliability, silicon design, validation, and engineering teams. you will have an understanding of ic flows, wafer processing, testing, qualification, yield, reliability, and failure analysis.the ml, systems, & cloud ai (msca) organization at google designs, implements, and manages the hardware, software, Machine Learning, and systems infrastructure for all google services (search, youtube, etc.) and google cloud. our end users are googlers, cloud customers and the billions of people who use google services around the world. we prioritize security, efficiency, and reliability across everything we do - from developing our latest tpus to running a global network, while driving towards shaping the future of hyperscale computing. our global impact spans software and hardware, including google clouds vertex ai, the leading ai platform for bringing gemini models to enterprise customers.
responsibilities
define and lead qualification hardware and TEST developments in front of internal teams and external vendors.
define and execute silicon and package qualification activities (e.g., htol, elfr, esd/lu, b/hast, thb, etc.).
extract, manipulate, and analyze large volumes of data from silicon and package qualification programs (e.g., htol, elfr, esd, lu, uhast, tct, etc.), high volume mfg, and field returns to identify failure mechanisms, reliability trends, and opportunities for yield, quality, and reliability improvement.
own cross-functional investigation of ic quality and reliability issues to identify root causes and develop solutions (e.g., rma triage, analytics, failure analysis, etc.).
develop and implement physics-based statistical quality and reliability models (e.g., elf, tddb, nbti, hci, time zero failures, etc.) to predict silicon device failure mechanisms, degradation patterns, and lifetime behaviors.