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We are looking for an experienced, forward-thinking, focused, analytical, and motivated Engineer to take ownership for the NPI and suppliers management in order to meet company targets. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which NV products acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. Youll be immersed in a diverse, supportive environment where everyone is encouraged to do their best work. Come join the team and see how you can make a lasting impact on the world.

What you'll be doing:

The NPI engineer will work alongside with R&D BU, finance, engineering and various multi-functional teams, leading NPI products from am operational perspective
Work with our partners worldwide to establish a supply chain incorporating business, manufacturing, technology, Engineering, quality, and additional aspects to assure design acceptance and manufacturability
Identify critical-paths, bottlenecks and implement risk management methodologies.
Define and lead execution to ensure delivery on schedule according to SOW and budget
Pave the way for NPI Production transition: Active participation from very early pre-design stages, highlighting needed operational related aspects while defining the infrastructure for the future transfer to production stage.
Develop an in-depth understanding of the vendors manufacturing capabilities and influence current and future product qualifications and loading decisions
Develop and implement project management methodologies and processes to improve tracking, transparency, execution, and day-to-day efficiency
Report program status to senior management.

We are looking for a creative and independent Product Engineer. NVIDIA Networking unit has continuously reinvented itself over two decades. Our high speed products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting End-to-End High-Speed Ethernet and InfiniBand Solutions. We're looking to grow our company and build our teams with smart people who can join us at the forefront of technological advancement.

We need a creative individual who will help lead interconnect Copper Based products yield performance in mass production environment. In addition, your responsibilities will include working with overseas manufacturing teams to increase yields, test coverage, and capacity, and reduce production costs. If you are passionate about enabling the highest quality products that will change the world, we want to hear from you!

What you'll be doing:

Maintaining high quality product deliveries to customers by data and failure analysis.

Improving Product performance by solving multiple problems with Process\ Mechanical\ Hardware and Thermal teams.

Leading high impact Task Forces and working Groups.

Designing and improving factory test plans (to improve coverage, time, cost, and yield).

Drive yield improvement, and fix the failure pareto.

Manage Failure Analysis of field and production failures.

Collaborate with different teams (including Customer Support, Marketing, Engineering, Quality, Reliability).

The Global Business Group is looking for a Business Director for the Dimensional Metrology Division (DMD) to join a diverse position that will consist of two main domains:
Focus on all business, penetration and operational activities for specific customer(s)/ territory
Work closely with the division stakeholders and local sales team to initiate and execute the strategy to meet the business objectives
Responsibilities
What will you be doing:
Define, align and execute on customers and accounts strategy together with the division stakeholders and territory sales team
Full accountability for all our divisional products revenue in his/her accounts, and gatekeeper for product profitability
Analyze the market landscape and competition, identify new business opportunities and drive engagements
Develop and grow relationships with relevant customers stakeholders
Customize marketing material and present at technical review meetings
Lead all delivery and operational processes to ensure on time deliveries
Ensure full alignment and execution with HQ departments on all activities
Ensure all product needs are mapped and addressed by the product management team
Manage the evaluation of new tools and major SW release at customers sites.

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products.
Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products.
Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements