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our company has been transforming computer graphics, pc gaming, and accelerated computing for more than 25 years. its a unique legacy of innovation thats fueled by great technology-and amazing people. today, were tapping into the unlimited potential of ai to define the next era of computing. an era in which our gpu acts as the brains of computers, robots, and self-driving cars that can understand the world. doing whats never been done before takes vision, innovation, and the worlds best talent. as an employee, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. come join the team and see how you can make a lasting impact on the world.
are you ready to take your engineering career to the next level? our company , a world-class technology company, is seeking a passionate package engineer to join our team in israel. in this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated ic substrates for our groundbreaking products. at our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. as a package engineer, you will work closely with si, layout, and asic design teams to develop complex, top-of-the-line asic packages. you will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
what you will be doing:
leading development of cutting-edge microelectronics packaging of our networking business units future products, evaluating our products for reliability and performance.
review manufacturability readiness at each milestone. 
work with world leading vendors to develop highly challenging packaging solutions.
leading the development of groundbreaking microelectronics packaging for our networking business unit's future products
collaborating with world-leading vendors to develop highly ambitious packaging solutions
thriving in a dynamic and challenging environment
join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
monitor substrate and assembly production kpis and collaborate with cross functional teams to define and monitor yield improvement plans for continuous improvement and establish quality standards.
lead process changes reviews, prepare and present data in change control board meetings, lead technical reviews of product changes throughout the supply chain.

we are looking for a creative, independent product engineer to join our company networking business unit. for over two decades, our networking has continuously reinvented itself, delivering industry leading high speed interconnect products. our solutions set the standard for performance, scalability, and innovation enabling true end to end high speed ethernet and infiniband solutions.
as we continue to grow, we are seeking exceptional engineers to help drive the next wave of technological advancement. in this role, you will take a leading position in the interconnect cluster performance domain. you will work closely with global technical teams to gain deep architectural insight, investigate customer complaints, and drive product excellence. if you are passionate about building high-quality products that make a real-world impact, we want to hear from you.
what youll be doing:
maintain high-quality product deliveries through in depth Big Data analysis and failure analysis
improve product performance by collaborating with process, mechanical, hardware, and thermal teams
lead high impact task forces and cross functional working groups
help design and enhance product TEST plans to ensure high customer satisfaction
manage failure analysis for both field and lab issues
collaborate closely with customer support, marketing, engineering, quality, and reliability teams

we are seeking an experienced, analytical, and highly motivated engineer to lead chip and pcb npi activities for networking products. this role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. the ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. as part of our networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.
what you'll be doing:
lead chip/substrate/osat/pcb qualification for networking products (2nd source).
collaborate with engineering teams to identify suitable substrate suppliers based on technical capability and capacity and define the qualification plan.
coordinate and lead changes through the ecr/ccb process.
work with engineering teams to create the product bom and plan initial qualification activities on the assy floor.
track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.
develop and execute risk plans for material requirements prior to qualification completion.
identify critical paths and bottlenecks; implement risk management methodologies.
develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.
create and maintain systems for data management and task tracking using power BI and other advanced systems, including ai-driven tools.

we are now looking for an engineering lab technician in the optical assembly team to support developing new nvidia's products. this newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help build and develop our industry leading transceivers. in this role you will run multiple sophisticated assembly platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. the primary responsibility is to support our engineering teams during development to ensure outstanding quality gpu server products may be released to the market and delight our customers so that ai scientists and datacenter operators can achieve their professional aspirations using nvidia technology. the new lab team member will work independently to complete daily tasks according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.
what youll be doing:
participating in development of new packaging technologies while working tightly with process development team.
prepare and conduct experiments to TEST new assembly technologies and materials.
operation and maintenance of variety of platforms involved in process of packaging - wire bonding/pick&place/active alignment.
maintain laboratory hardware and handle materials.

Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.

What you'll be doing:

You own silicon bring-up schedule from power on to production release.

Negotiate silicon and board demand with teams and drive a bottom-up forecast.

Oversee and manage chip and board allocations across the company.

Lead prototype chip delivery to internal customers.

Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase.

Identify and mitigate risks to schedules and programs.

Communicate status to cross-functional teams as well as upper management.

Continuously evaluate internal tools and processes and drive fixes to improve productivity.

Create new and fix existing processes between different teams.

Drive implementation of SW tools for data analytics and process evaluation.