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we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks.

We are seeking an experienced Staff/ Principal Architect to lead the architecture of high-performance connectivity solutions, with a strong focus on PCIe, high-speed networking, and Ethernet-based systems.
This role will define next-generation architectures for AI infrastructure, working at the intersection of silicon, system, and protocol design. You will play a key role in shaping innovative solutions that enable hyperscale customers to build scalable, high-bandwidth, and low-latency systems.
This is a unique opportunity to join a new and growing Israel site, influence technical direction, and take ownership of critical architectural decisions impacting industry-leading products.
Key Responsibilities
Define and drive system and chip-level architecture for high-speed connectivity products
Lead architecture for PCIe-based interconnects, networking protocols, and Ethernet subsystems
Analyze system requirements and translate them into scalable and efficient hardware architectures
Drive tradeoff analysis across performance, power, latency, area, and cost
Collaborate with cross-functional teams including RTL, Physical Design, Firmware, Validation, and Product Engineering
Define and review micro-architecture specifications and ensure alignment across teams
Contribute to standard-based and custom protocols for next-generation AI infrastructure
Support performance modeling, simulation, and architectural validation
Work closely with customers and partners to understand emerging use cases and requirements
Mentor engineers and help build strong technical leadership within the Israel R&D center.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff/ Principal Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.
As a Staff/ Principal Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified
Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices
Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment.

Join a team developing next-generation AI accelerators, working at the intersection of AI algorithms, software, and hardware.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, We are looking for a Physical Design CAD Engineer with at least 3 years of hands-on experience in digital implementation flows. The ideal candidate is highly technical, curious, and eager to drive innovation by combining strong physical design knowledge with modern automation and GenAI-based methodologies.
This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.
Key Responsibilities
The Engineer will develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
Key responsibilities include:
Develop and support physical design CAD flows using industry-standard EDA tools
Build automation infrastructure for implementation, analysis, reporting, and debug
Support design teams in areas such as synthesis, floorplanning, placement, CTS, routing, timing, power, and physical verification
Create scripts and utilities to improve productivity, quality of results, and flow robustness
Support and enhance flows based on Synopsys Fusion Compiler
Explore and integrate GenAI solutions to accelerate debug, automate repetitive tasks, improve reporting, and enhance engineering productivity
Analyze tool results, logs, QoR metrics, timing reports, congestion, utilization, power, and design-rule issues.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.
This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.
You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.
Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM)
Understand root-cause analysis for voltage drop violations and EM risks
Be responsible and go-to person for any IR related issues.