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we are looking for a Failure Analysis Engineer.
Job Description:
Lead fault isolation and root cause analysis of memory and logic failures, including electrical, test, and yield failures, from initial failure signature through physical confirmation
Analyze failures at device, memory-cell, array, and circuit level, differentiating between design, test, device, process, and physical failure mechanisms
Correlate electrical characterization, memory-test and yield results, schematics, layout, and physical FA findings to identify and validate root cause
Develop and execute effective fault-isolation strategies, localizing failures down to the relevant cell, circuit, interconnect, or physical structure
Work closely with Design, Device, Test/Product, Process, Reliability, and Physical FA labs to solve complex failures and drive corrective actions
Improve FA methodologies, prepare and present engineering FA report on complex failure investigations

Be part of the team that is responsible for developing and optimizing the state-of-the-art analog circuits that power our embedded ReRAM and mixed-signal products.
In this role, you will take the lead on designing high-performance analog circuits, driving innovation in mixed-signal systems from concept through production. Youll partner closely with digital design, system architecture, and process engineering teams, playing a key role in bringing our next generation of memory products to market:
Design and develop complex analog circuits, including amplifiers, complex memory arrays, and LDOs, ensuring reliability and performance
Collaborate with cross-functional teams to define system specifications and architecture, translating requirements into actionable designs
Conduct thorough simulations and analyses to validate designs, using tools such as Cadence Virtuoso and Siemens Solido while identifying and mitigating risks early in the design process
Oversee the transition of designs from prototype to production, ensuring compliance with quality and industry standards
Apply deep expertise in analog circuit design - including amplifiers, voltage references, comparators, and ADCs/DACs - to push the boundaries of performance

The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

*Part-Time or Full-Time Opportunity

Responsibilities:
The research focuses on designing next-generation rack and SuperPod architectures that combine elasticity through resource pooling with optimal performance enabled by holistic co-design across applications, parallel programming models, interconnect fabrics, and compute, memory, and switch chip architectures. On the communication side, the work architects scalable, high-bandwidth, and low-latency scale-up fabrics across multiple chips at rack and SuperPod scale. On the memory side, it explores richer protocol semantics beyond traditional load/store operations to reduce unnecessary data movement and rethinks memory hierarchies to expose large-scale capacity with near-local latency. On the compute side, it analyzes the requirements of General Compute and Generative AI workloads and their parallel programming models to fully leverage large-scale system resources.
Investigate and prototype new architectural features, including but not limited to:
o Tiered Memory: Explore advanced memory organizations, including hardware-managed caching, to enable software-transparent, fine-grained promotion and demotion of cache lines across the memory hierarchy.
o Prefetching/Speculation: Evaluate and design existing and next-generation hardware prefetching and speculation mechanisms to effectively hide local and remote memory latencies at rack and SuperPod scale.
o Near-Memory/Network Processing: Develop support for key primitives executed at the memory and network layers to minimize unnecessary data movement across sparse, dense, and pointer-based data structures.
o Workload-Centric Co-Design: Study optimal parallelization strategies at rack and SuperPod scale for both General Compute and Generative AI workloads, and design dedicated hardware support for widely used parallel programming primitives such as RPCs and collective communication.
Write reports and papers on the research results and present them.

Be part of a team responsible for designing the next generation of mobile devices. The position includes responsibility for system analysis and HW architecture design for high-speed and low-power interfaces, networking protocols, storage processing, including acceleration of protocols reducing overall power consumption. The job requires collaboration with multiple engineering functions and teams in various geographical locations. It includes identifying system use, requirements definitions, understanding of industry specification for interfaces, operating in industry Standards committees, SW and HW interaction, performance analysis, and more.

Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.

*Part-Time or Full-Time Opportunity

In this job opening, we are seeking a highly motivated and visionary researcher to join our team focused on chiplet-based computing systems. This role involves research and development in chiplet-based architectures, aiming to overcome performance and scalability limits of traditional compute platforms.

Responsibilities:
Conduct cutting-edge research on the co-design of communication and computation for wafer-scale systems. On the communication side, the work focuses on architecting Networks-on-Chip, providing scalable, high-bandwidth, and ultra-low-latency interconnects that efficiently span multiple dies and support fine-grained data movement. On the computation side, the research emphasizes optimizing and mapping training and inference workloads to fully exploit wafer-scale resources, improving performance, scalability, and energy efficiency through intelligent task placement and scheduling.
Investigate various aspects of system design, including:
Network-on-Chip design, further including Topology exploration, routing algorithms, and protocol/flow-control design to support high-throughput collective communication, low-latency synchronization, and efficient model/data parallelism
Expressing and Mapping LLM Parallelism to Wafer-Scale System that simplify LLM parallelism (e.g., tensor, pipeline, and data parallelism) and efficiently map training and inference workloads onto wafer-scale system

As HW Architect Team Leader, you will combine deep technical leadership with people leadership. You will shape next-generation networking silicon while building and mentoring a strong architecture team.

What Youll Be Doing
Lead, manage, and mentor a team of HW architects, fostering technical excellence and innovation.
Drive research, evaluation, and architectural definition of next-generation SoCs - from product requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet and NIC switches.
Lead system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate cross-functionally with design, verification, modeling, software, and other architecture teams to ensure end-to-end system alignment.
Identify and evaluate new technologies, methodologies, and architectural approaches for future products.
Provide technical direction, make key architectural trade-offs, and ensure execution excellence.

The ATE Engineer is responsible for development of ATE test station development, including system architecture, test strategy, and transition from R&D to production. We are seeking a highly experienced professional with a strong background in RF, digital, and system-level testing, and with the ability to guide technical decisions, solve complex integration challenges, and support advanced test equipment for production environments.

What will you do:

Design and develop Automated Test Equipment (ATE) for RF, digital, and mixed-signal products at board and system levels.

Lead the technical definition and implementation of test strategies in collaboration with R&D, product engineering, and manufacturing teams.

Own the technical analysis of system schematics, block diagrams, and interface requirements to define robust and reliable ATE solutions.

Support production lines by troubleshooting test failures and optimizing test processes for yield and throughput improvements.

Provide technical guidance for integration with software and firmware control and automation systems.

Evaluate and select test instruments, fixtures, and measurement techniques based on product specifications.

Maintain documentation for test systems, including design files, calibration procedures, and troubleshooting guides.

Mentor engineers and technicians on ATE methodologies, operation, and maintenance.

The position is responsible for the technical leadership as well as the team management of ATE test station development and automation SW infrastructure, from system architecture, test strategy, down to production. We are seeking a highly experienced professional with a strong background in RF, digital, and system-level testing, and with the ability to guide technical decisions, and mentor engineers on ATE methodologies, operation, and maintenance.


Team Responsibility
Design and develop Automated Test Equipment (ATE) for RF, digital, and mixed-signal products at board and system levels.
Technical definition and implementation of test strategies in collaboration with R&D, product engineering, and manufacturing teams.
ATE integration with software and firmware control as well as with automation systems.