דרושים » הנדסה » Wafer-Scale System: Computation (LLM) and Communication (NoC) Co-Design

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

As a Software Development Engineer in Test on our team, you will own the quality of Nitro card embedded software and firmware. You will design, develop, and maintain test automation for embedded systems and components, covering hardware interface verification, real-time firmware behavior validation, firmware update integrity, and fleet-scale deployment confidence. You will collaborate closely with firmware development teams to troubleshoot complex system-level problems at the hardware-software boundary and ensure timely delivery of high-quality Nitro card software to AWS Cloud solutions.

Key job responsibilities
- Own the firmware test automation framework - architect, develop, and extend a Python-based validation solution that scales across multiple Nitro card generations and hardware platforms, automating test coverage across the full firmware stack from boot sequences through board management layers and card-level system integration.
- Design and implement traceable, specification-driven test cases that validate firmware functional correctness, fault tolerance, and performance across hardware components, communication interfaces, and cross-subsystem interactions.
- Optimize CI/CD pipelines by integrating pre-merge and post-merge firmware validation, defining trigger policies per hardware generation, enforcing coding-standard compliance, and reducing commit-to-validated cycle time.
- Troubleshoot complex embedded system failures by analyzing firmware logs, system traces, and hardware diagnostics, then translate field incidents into targeted regression suites that prevent recurrence.
- Collaborate with firmware and hardware teams during new-generation silicon bring-up, define test plans, drive quality gates for production release, and mentor teammates on testing best practices and system architecture.

A day in the life
You start your morning reviewing overnight CI results and triaging any firmware validation failures flagged across active Nitro card generations. Mid-morning, you pair with a firmware engineer to debug a boot-sequence regression discovered during pre-merge testing, using hardware-in-the-loop test benches and system traces. After lunch, you join a design review for a next-generation Nitro card, providing input on testability and proposing validation strategies for new subsystem interfaces. Later, you refine your test framework to improve coverage for a recently released feature, then wrap up by sharing your findings in a team knowledge-sharing session.

We are looking for a highly analytical, detail-oriented Innovation Expert to join our Open Innovation team. This role is ideal for candidates who sit at the intersection of deep tech, startup ecosystem and academy, possessing strong technology analytical skills, clear communication, and a foundational background in computer architecture research.
In this role, you will drive our external innovation strategy by managing academic research collaborations, scouting early-stage deep-tech startups and conducting technical due diligence.
Key Responsibilities:
Academic Cooperation & Research Partnerships: Identify and build direct collaboration agreements with world-class professors, research labs, and universities. Facilitate joint research projects, tech-transfer initiatives, and track academic spin-offs.
Startup Scouting & Ecosystem Mapping: Actively identify, source, and map early-stage deep-tech startups and emerging tech companies globally within the companys strategic domains.
Technical Due Diligence: Evaluate startup technologies, product-market fit, and team capabilities. Analyze technical validity and assess how external innovations align with our internal roadmaps.
Ecosystem Analysis: Conduct deep-dive analyses of startup ecosystems, venture capital trends, and academic spin-offs to identify high-potential investment and collaboration opportunities.
Investment & Collaboration Support: Synthesize technical and commercial findings into clear, structured scouting reports, investment tech memos, and presentations for senior leadership to drive partnership or investment decisions.
Cross-Border Collaboration: Act as a bridge between startup founders, academic innovators, and internal global teams (including European and China-based business units) to facilitate joint POCs, or investment reviews.
Track Tech Domains: AI infrastructure, advanced semiconductors, hardware-software co-design, and AI data movement.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

We are looking for a Post-Silicon Validation Engineer with strong hands-on experience in PCIe link bring-up, physical-layer debug, and silicon validation. Engineer will work closely with Design, Architecture, Firmware, Software, Engineering teams.

Key Responsibilities
Perform hands-on post-silicon validation.
Debug PCIe link issues including link training, LTSSM, equalization, recovery, resets, and link stability.
Analyze PCIe state-machine traces, protocol traces, registers, logs, eye diagrams, and lab measurements.
Drive complex issues from initial failure through root-cause analysis and final resolution.
Work closely with silicon, firmware, software, architecture, and signal-integrity engineers to isolate issues across HW/FW/SW boundaries.
Validate PCIe functionality across different generations, platforms, configurations, and operating conditions.
Develop and execute PCIe validation plans, stress tests, corner-case scenarios, and interoperability tests.
Develop automation to improve validation coverage, debug efficiency, and regression testing.

Required CPU Core Micro Architect
Job Description
Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

Be part of the team that is responsible for developing and optimizing the state-of-the-art analog circuits that power our embedded ReRAM and mixed-signal products.
In this role, you will take the lead on designing high-performance analog circuits, driving innovation in mixed-signal systems from concept through production. Youll partner closely with digital design, system architecture, and process engineering teams, playing a key role in bringing our next generation of memory products to market:
Design and develop complex analog circuits, including amplifiers, complex memory arrays, and LDOs, ensuring reliability and performance
Collaborate with cross-functional teams to define system specifications and architecture, translating requirements into actionable designs
Conduct thorough simulations and analyses to validate designs, using tools such as Cadence Virtuoso and Siemens Solido while identifying and mitigating risks early in the design process
Oversee the transition of designs from prototype to production, ensuring compliance with quality and industry standards
Apply deep expertise in analog circuit design - including amplifiers, voltage references, comparators, and ADCs/DACs - to push the boundaries of performance

As we expand our presence in Israel, we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging.
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies.
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market.

System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs.
Ensure rapid cycles from RTL to functional stability through systematic debug approaches.
Own technical blocks and drive them to completion independently.

Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios.
Ensure seamless hardware-software integration for AI infrastructure connectivity.
Collaborate with Design and Verification teams to optimize emulation strategies.

Were expanding our teams and looking for an Experienced Physical Design Engineer who is ready to make a massive impact
NOTE: By applying for this position, you will have the opportunity to indicate your preferred work location: Haifa or Petach Tikva.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS .
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).