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As a Service Quality Engineer youll be the first point of contact for all service quality matters, assure key quality processes deliverables are compliant with industry standards, analyze service metrics, create and lead continues improvement projects.

Your role:

Collaborate with cross functional business and quality groups to ensure patient safety and quality requirements are met in all CT products
Review and provide quality inputs for service deliverables in NPI projects and LCM sustain projects
Perform as an expert on quality of service process deliverables and assure all deliverables are compliance
Analyzes service and markets metrics and performance indicators, preparing detailed reports that highlight trends, deviations, and areas for improvement
Assure filed work instructions are adequate and compliant
Lead cross functional projects and collaborate with markets quality and service functions to create continuance improvement

Mechatronics & Components Engineer We are seeking a Mechatronics & Components Engineer to support the development of advanced products through selection, evaluation, and integration of mechanical and electromechanical components.

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

as a quality and reliability (q&r) engineer, you will lead the qualification and long-term reliability of advanced system -on-chip ( SOC ) and RF semiconductor products for automotive applications. youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
what will your job look like:
define and manage quality and reliability specifications, simulations, and qualification plans for SOC and RF die and package.
plan and execute automotive-grade qualifications per standards such as aec-q100, jedec jesd22, and iatf 16949.
design and implement die-level and package-level stress tests.
select and prepare electrical, environmental, and mechanical TEST platforms for reliability testing.
define requirements for pre-si q&r (e.g. esd, lu, em, ir drop), design-for- TEST (dft), electrical characterization, and post-si q&r testing of digital, mixed-signal and RF socs.
collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (osats).
lead failure analysis, reliability modeling, and corrective action processes (e.g., 8d, fmea, fmeda).
document and certify automotive standards compliance, including ppap/apqp deliverables.