We are seeking a skilled Failure Analysis (FA) Engineer with expertise in X-ray inspection techniques to join our AV Platform team. The ideal candidate will specialize in using advanced X-ray imaging and other analysis methods to investigate product failures, identify root causes, and provide actionable insights to improve product quality and reliability
What will your job look like?
Perform detailed failure analysis using X-ray imaging systems and related diagnostic tools to inspect electronic components, assemblies, and materials.
Interpret and analyze X-ray images to detect structural anomalies, defects, voids, cracks, delamination, and other failure mechanisms.
Develop and optimize X-ray inspection procedures and protocols for failure analysis and quality control.
Prepare test specimens: cutting, mounting, grinding, polishing and chemical etching
Collaborate with product engineering, quality assurance, and manufacturing teams to support product development, troubleshooting, and continuous improvement efforts.
Prepare detailed technical reports documenting findings, root cause analyses, and recommended corrective actions.
Support reliability testing and failure mode analysis for new and existing products.
Requirements: Bachelors or Masters degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
Proven experience in failure analysis with a strong focus on X-ray imaging and inspection.
Proficiency in operating and interpreting data from X-ray inspection systems (e.g., 2D/3D X-ray CT).
Strong analytical and problem-solving skills with attention to detail.
Familiarity with semiconductor, electronics, or other relevant industry standards.
Excellent communication skills for reporting technical findings clearly and effectively.
Ability to work independently and as part of a cross-functional team.
Experience with complementary failure analysis tools e.g., SEM, FIB and optical microscopy.
This position is open to all candidates.