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Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

As an R&D Mechanical Engineer at Augury, you will own the design of new parts and assemblies, design parts for machining and injection molding, perform analytical calculations and V&V tests.

Youll work closely with mechanical, hardware, V&V, sustain, manufacturing, and external sub contractors, to deliver innovative, reliable, and scalable IoT devices.

A Day In Your Life
Design mechanical parts and mechanisms, for highly challenging environments, from initial concepts, through all design phases, until transfer to production.
Master 3D CAD models and drawings for mechanical components, assemblies, jigs, and fixtures (including release management and GD&T).
Design for plastics: mostly parts for injection molding, compression and other classical manufacturing methods.
Run prototype validation: mechanical inspection, stress testing, sealing, field testing and support high level system validation procedures.
Cooperate with multidisciplinary teams (HW, V&V, FW, Algo), utilizing analytical thinking and strong theoretical background.
Transfer parts for production, in collaboration with the engineering team, and following product lifecycle methodologies.
Work with subcontractors and vendors in Israel and internationally.

We are developing leading edge products, manufactured on leading edge technologies. We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Primary responsibilities:
- Development of DfX (DfM, DfT, DfQ&R, etc.) methodologies and BKMs (Best Known Methods).
- DfX activities during the product design stage.
- Product quality & reliability validation (QRV) and ongoing quality & reliability monitoring (OQRM).
- Q&R engineering of volume manufacturing: auditing, monitoring, risk assessment and disposition of non-conformance events/non-conforming material, defining and implementing corrective actions.
- RMAs: investigation, disposition, reporting and follow-up.

We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.