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We are looking for a highly motivated and experienced Mechanical Engineer who will join our mechanical team and be responsible for designing and maintaining new and current products, focused on consumable wearable products.
The Mechanical Engineer will work on exciting projects to support our expanding portfolio of products related to our cancer treatment device from concept all the way through manufacturing, taking into consideration quality, regulation, cost-effectiveness, and manufacturing feasibility.
This is a full-time position at our R&D center, Haifa, Israel
ESSENTIAL DUTIES AND RESPONSIBILITIES:.
PCB and PCBA design for HW engineering.
Multidisciplinary products
Customized design and consideration of manufacturability as part of the design
Rigorous analyses of designs using appropriate methods such as FEA and dimensional tolerance analysis.
Consider automated production requirements as part of the design.
Evaluate requirements and determine mechanical requirements for the design and development of consumables.
Drive component and integration testing to verify that prototypes and production components/constructs meet design intent.
Assess requirements and set the mechanical requirements for the design and development of consumables.
Provide the data for a full production file (3D files, drawings of mechanical parts, assembly drawings and instructions, BOM)
Contact and manage suppliers and subcontractors for manufacturing.
Liaising with suppliers and production sub-contractors.
Conduct relevant research
Producing and implementing designs and test procedures
Perform the actual testing, evaluating, measuring, modifying, and re-testing of the design
Generate test reports and documentation

Were Hiring: Senior Mechanical Engineer - Robotics, Propulsion & Optical Systems & North district | R&D Robotics Division.

A cutting-edge technology company developing autonomous robotic platforms for large-scale solar power plants is looking for a Senior Mechanical Engineer with deep expertise in robotics, propulsion systems, turrets, sensors, cameras, and optical stabilization systems.
Job Description:
Lead mechanical design from concept to production for propulsion, rotation/turret systems, rugged enclosures, and precision mechanisms.
Integrate mechanical, electrical, control, and optical subsystems into a robust field-ready robotic platform.
Oversee prototyping, testing, DFM, and transition to production.
Own system documentation: drawings, BOMs, TEST plans, reports.
Support field issues, reliability improvements, and lifecycle maintenance.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our company's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our company AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a NPI and Layout package Engineer on the packaging team, you will be working on fast-paced products for consumer devices. In this role, you will work with Hardware Designers and Mechanical Engineers throughout the full product development life-cycle, supporting package outline, component placement and routing, using advanced package technologies while analyzing package reliability and manufacturability aspects.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design the layout of package substrates using Cadence Allegro Package Designer.
Apply package substrate layout design rules from manufacturing point of view and electrical requirement considerations.
Generate high-quality design documents for substrate manufacturers and package assembly houses.
Enhance the package design work continuously by developing initiatives that drive efficiency and improve quality/cost/schedule of the package layout work.
Manage new ASIC packages during the NPI phase as the primary engineering owner, overseeing the product life-cycle from design lockdown to mass production release.