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Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our company's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our company AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a NPI and Layout package Engineer on the packaging team, you will be working on fast-paced products for consumer devices. In this role, you will work with Hardware Designers and Mechanical Engineers throughout the full product development life-cycle, supporting package outline, component placement and routing, using advanced package technologies while analyzing package reliability and manufacturability aspects.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design the layout of package substrates using Cadence Allegro Package Designer.
Apply package substrate layout design rules from manufacturing point of view and electrical requirement considerations.
Generate high-quality design documents for substrate manufacturers and package assembly houses.
Enhance the package design work continuously by developing initiatives that drive efficiency and improve quality/cost/schedule of the package layout work.
Manage new ASIC packages during the NPI phase as the primary engineering owner, overseeing the product life-cycle from design lockdown to mass production release.

We are seeking a skilled Failure Analysis (FA) Engineer with expertise in X-ray inspection techniques to join our AV Platform team. The ideal candidate will specialize in using advanced X-ray imaging and other analysis methods to investigate product failures, identify root causes, and provide actionable insights to improve product quality and reliability
What will your job look like?
Perform detailed failure analysis using X-ray imaging systems and related diagnostic tools to inspect electronic components, assemblies, and materials.
Interpret and analyze X-ray images to detect structural anomalies, defects, voids, cracks, delamination, and other failure mechanisms.
Develop and optimize X-ray inspection procedures and protocols for failure analysis and quality control.
Prepare test specimens: cutting, mounting, grinding, polishing and chemical etching
Collaborate with product engineering, quality assurance, and manufacturing teams to support product development, troubleshooting, and continuous improvement efforts.
Prepare detailed technical reports documenting findings, root cause analyses, and recommended corrective actions.
Support reliability testing and failure mode analysis for new and existing products.

We are looking for a talented Equipment Engineer, to support the development of a semiconductor platform based on revolutionary architecture.

Key job responsibilities
In this role, you will:
Provide technical support for the engineering test lab equipment (testers / handlers / TCU etc.).
Remotely support our Labs testing vendors in the Far East.
Write technical procedures for the lab users.
Provide technical training for the lab users.
Provide electrical / mechanical designs for lab Jigs.
Travel to our Labs vendors (3-4 BTs per year).

where experience meets innovation and drives excellence in every connection. We are fueled by creativity and diversity of thought in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their strengths, views, and experiences. We believe that our differences enable us to be a better team one that makes better decisions, drives innovation, and delivers better business results.

Opportunity Overview
We are seeking a highly motivated and collaborative Mechanical Engineer to support our Silicon Photonics Engineering group in Haifa, Israel. Development occurs in a dynamic and challenging global multi-site environment. This role will report to the SiPh Engineering Manager in North Reading, MA, USA.

You will lead and/or participate in platform product development initiatives within our Silicon Photonics product team. In the SiPh Engineering group, we focus on developing state-of-the-art Optical Instruments for our Semiconductor Test Equipment products. This optical test equipment is essential for the massive expansion in AI that the industry is currently experiencing.

You will create innovative and sound technical solutions to complex engineering problems. You will also identify essential requirements and key technical risks. You will work closely with Electrical Engineers, Systems Engineers, and Optical Engineers to design solutions for New Product Introduction and High-Volume Manufacturing.

Develop detailed mechanical designs using 3D CAD, along with creating 2D fabrication drawings
Create Engineering Change & Release documents (ECN / ECO)
Participate in internal design reviews
Work with Systems Engineering team to help define sub-systems, establish technical direction, and develop product strategies and long-term product roadmaps
Build, debug, and test prototype designs
Assist NPI team with the build and debug of customer early access units
Collaboration with procurement & supply chain to identify alternative vendors and suppliers