לוח משרות דרושים מהנדס חשמל בחיפה

We are currently looking for a Performance Simulation Expert develop and evaluate next generation performance features as well as develop the future generation of our Compute system simulation infrastructure, models and analysis tools
Develop and analyze performance and power features in our cycle accurate pre-silicon model and improve the accuracy of the current Server system simulator
Design the architecture of the new generation system simulation platform that will be used to analyze performance of Server (Compute and AI) workloads and identify performance bottlenecks
Develop new technologies, methodologies and tools for simulation. Analysis and debug of applications and workload on Huawei servers
Propose and simulate optimizations and innovations on the HW and SW in order to improve server performance for given workloads
Distribute the simulation platform, train and support other teams in China and in Europe using the simulation platform, technology and methodology.

We are looking for an experienced and creative AI processor VLSI Architect to architect and model the core of our next generation processors.

The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Architect will take charge of defining a processor on chip inter-connect and coherent fabric that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will be part of a team developing Application-specific integrated circuits (ASICs) used to accelerate networking in data centers. You will have multiple responsibilities in areas such as project definition, design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators.You will also be responsible for performance analysis for a networking stack.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead an ASIC subsystem.
Understand how ASIC subsystem interacts with software and other ASIC subsystems to implement data center networks.
Define hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design & Power Methodology Team Manager within the Server Chip Design team, you will be responsible of managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use the ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the Design Activities at IPs, SubSystems(S.S) and SoC.
Plan, execute, track progress, assure quality, report status of the assigned activity.
Lead a team of designers both directly and in teams.
Define the Block/SoC level design documents such as Micro Architectural Specifications.
Own IP, S, SoC strategies for clocks, resets, and debugs. Enforce global methodologies and drive enhancements.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer PCBs (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (HBM/DDR5).
Design and validate high-speed interfaces including PCIe Gen 6.0/7.0, 400G/800G/1.6T Ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering >1000A currents with fast transient response for AI processors.
Work with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board by debugging hardware issues using oscilloscopes, TDRs, and logic analyzers to root-cause failures to component, assembly, or design issues.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define and implement solutions for complex design, integration and verification problems using in-house and external technical solutions or tools. Ensure chip quality by implementing best practices and implementing quality control measures.
Involve in project development and convergence with the highest quality, agreement with issues as they arise through design and implementation, or equivalent relevant experience.
Connect between RTL design, physical design, DFT, external IPs and SoC while maintaining project priorities.
Maintain project infrastructure and stability.

The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Evaluate, analyze, implement, and integrate SRAMs, other memories (such as multiport register files), and custom circuits. Drive proper IP integration and margins with the physical design team.
Partner with foundries and IP providers, as well as internal technology, physical design, and architecture teams, to optimize products for PPA, schedule, and reliability in advanced CMOS nodes.
Drive and support test chip design, execution, and validation of critical circuit IPs.
Design and build custom circuits at the transistor and gate levels to support physical design and power-performance-area optimization.
Drive development of a leading edge technology platform for custom, high performance ASICs and SoCs, from design through manufacturing, packaging, and test.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Plan and execute the verification of digital design blocks by understanding specifications and working with design engineers to define key verification scenarios.
Develop, execute, and debug full-chip/system on a chip (SoC) tests on emulation platforms.
Collaborate with design engineers to debug tests and ensure functional correctness of design blocks.
Define and implement various coverage measures to capture stimulus and corner-case scenarios. Work with software and post-silicon validation teams to reproduce failures on emulation.
Drive coverage analysis to identify verification gaps and demonstrate progress towards tape-out. Explore new verification and emulation methodologies and implement them.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help build SoCs by driving quality and reliability processes from the Integrated Circuit (IC) perspective. Working with various cross-functional teams, you will develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute test plans. Within the larger organization, you will collaborate with global hardware quality and reliability, silicon design, validation, and engineering teams. You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis.
The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define and lead qualification hardware and test developments in front of internal teams and external vendors.
Define and execute Silicon and package qualification activities (e.g., HTOL, ELFR, ESD/LU, b/HAST, THB, etc.).
Extract, manipulate, and analyze large volumes of data from Silicon and package qualification programs (e.g., HTOL, ELFR, ESD, LU, UHAST, TCT, etc.), High Volume MFG, and field returns to identify failure mechanisms, reliability trends, and opportunities for yield, quality, and reliability improvement.
Own cross-functional investigation of IC quality and reliability issues to identify root causes and develop solutions (e.g., RMA Triage, Analytics, Failure Analysis, etc.).
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI, HCI, Time zero failures, etc.) to predict silicon device failure mechanisms, degradation patterns, and lifetime behaviors.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.