דרושים » הנדסה » Electrical/Mechanical Engineering Technician - Data Center, TLV DCEO

About This Role:
As the Data Center Design Engineer, you will be the primary architect of our companys operational computing environments. You will bridge the gap between heavy infrastructure and high-performance computing by designing the "whitespace"- the critical area where our servers, storage, and network equipment live. Your work is fundamental to our companys mission of aligning the future of computing with the future of the climate; by optimizing power distribution, cooling, and equipment density, you directly enable the scalability and energy efficiency of our sustainable cloud platform.
You will join a bold, collaborative team where you will lead the planning and implementation of high-density layouts and modular infrastructure. The ideal candidate is a technical problem-solver who thrives in the intersection of mechanical, electrical, and network engineering. This is a full-time position designed for an innovative engineer who wants to build the physical foundation of an ethical and sustainable digital world.
What Youll Be Working On:
Whitespace Design & Planning: Architect comprehensive whitespace layouts, including rack placement and aisle configurations, to maximize equipment density while maintaining optimal airflow and accessibility.
Infrastructure Integration: Partner with Electrical and Mechanical teams to seamlessly integrate power delivery and cooling systems into the whitespace, ensuring robust support for high-performance cloud workloads.
Capacity & Growth Modeling: Develop sophisticated 3D models and capacity planning tools to project future utilization, ensuring our data centers remain scalable and redundant (N+1, 2N).
Connectivity Strategy: Coordinate with Network and Cloud teams to design and implement structured cabling and fiber management systems that meet rigorous performance and low-latency requirements.
Cross-Functional Leadership: Participate in design reviews and risk assessments, providing technical guidance to internal stakeholders and external contractors during construction and commissioning phases.
Compliance & Excellence: Enforce industry standards (TIA-942, ASHRAE) and local building codes to ensure every design is safe, compliant, and performs to the highest reliability standards.
Technical Documentation: Produce and maintain high-fidelity CAD/BIM drawings and schematics that serve as the definitive source for operations, maintenance, and auditing.
Continuous Innovation: Evaluate emerging modular technologies and design methodologies to relentlessly improve energy efficiency and site performance.

We're looking for exceptional engineers to join our Signal/Power-Integrity and Packaging team. A team that sits where the Silicon meets the Board, bridging the gap between what happens internally at the DIE and the overall system interconnect and the external memories and peer devices.
What sets us apart:
Small team, yet a one stop shop for IP electrical integration at the DIE level, Package design, SI/PI simulations, Layout, Board-design and advanced lab characterization.
Combining Signal-Integrity and Layout, to come up with optimized Package and PCB designs.
Holistic view of the entire interconnect, from the DIEs metals, through the Package, to the PCB traces, and all the way to the peer device.
In-depth post-silicon characterization, using advanced measurement techniques, far exceeding traditional compliance measurements.
Deep dive mentality, in both theory and the bolts and nuts that make the internal circuitry of the electrical interfaces.

The SIP (Signal-Integrity & Packaging) team is part of Annapurna-Labs Chip development team.
The team is dealing with the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
The teams work includes close work with the BackEnd team on integrating these interfaces to the Die, the package layout design of the BGAs substrate, Signal and power integrity simulations, and working with the system team to come up with optimal pin-out and optimal PCB breakout schemes.

As a SIP team member, you will assume responsibility for all electrical aspects of physical interfaces of advanced I/Os, PLL, Memory and SerDes interfaces, from integration at the Die level, through SI/PI simulation and package layout, to reference board design aspects.

This position is for an experienced engineer with strong background in high-speed electrical interfaces, such as DRAM, PCIe, Ethernet SerDeses. The line of work is multi-disciplinary, combining Package-Design, Back-End integration of electrical IPs, SI/PI extractions & simulations.


Key job responsibilities
Deep dive into electrical IPs, integrated into the DIE;
I/O ring design and close work with Backend team on floor-planning all I/O interfaces at the DIE level.
Lead test studies of Die bump-out arrangements and Package substrate breakout.
Lead layout test studies of package pin-out arrangements and PCB board breakout.
Design large and complex package substrates.
Carry advanced SI/PI extractions and simulations to validate the design from the silicon to the peer device at the board level.

We are seeking a highly driven, hands-on Production Engineering Leader to join our Operations & Manufacturing team. In this role, you will serve as the primary operational link to our Contract Manufacturers (CMs), drive the end-to-end NPI handoff process into steady-state production, manage legacy product lines, and streamline the production-side RMA pipeline.

If you thrive in a high-growth, fast-paced hardware environment, love diagnosing complex manufacturing challenges, and are passionate about continuous improvement, this is the role for you.

Key Responsibilities

Contract Manufacturer (CM) Management & Line Ownership

CM Operations & Execution: Drive day-to-day operational and technical alignment with external CMs to ensure high build execution, product yield, and strict adherence to quality and schedule targets.
Manufacturing Bottlenecks: Identify and resolve yield drops, component shortages/substitutions, or assembly issues directly with vendor engineering teams.
ECO/ECN Release: Oversee engineering change implementation across active production runs at the CM, maintaining clear configuration control.
NPI Composition Handoff & Legacy Product Support

NPI to Production Handoff: Lead the operational composition and transfer of new product introductions (NPI) from R&D into scalable volume manufacturing at the CM level.
Legacy Product Management: Maintain operational health, sustaining engineering, and end-of-life (EOL) management for legacy product lines to ensure ongoing delivery stability.
Process Documentation: Define standard operating procedures (SOPs), assembly routing, build packages, and work instructions for incoming product variants.
Production RMA Process

RMA Pipeline Management: Take ownership of the production side of the Return Merchandise Authorization (RMA) process, ensuring rapid triage, dispositioning, and turnaround times.
Feedback Loop: Feed critical quality, design, and manufacturing insights back to R&D and Quality teams to drive design-for-manufacturability (DFM) improvements.
Continuous Improvement

Yield & Efficiency Optimization: Track key operational metrics (First Pass Yield, Scrap, Cycle Time) and implement engineering fixes to minimize waste and reduce lead times.
Tooling & Fixturing: Coordinate with suppliers to design, validate, or upgrade assembly fixtures, jigs, and test setups.

As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, within a dynamic, open, fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for excellent electrical engineering graduates to join our talented Physical Design team, which develops our next generation products for the cloud market.
We will be conducting a unique training program for three months, where where you will be studying the following with our technical experts and team leaders:
* Backend development flow and stages (RTL to GDS).
* A wide variety of relevant tools and knowledge.
* Practical experience with the most advanced technologies in the industry.

Key job responsibilities
Join our three-month training program where you'll work alongside technical experts and team leaders to gain:
*Backend development expertise (RTL to GDS flow).
*Hands-on experience with industry-leading tools and technologies.
*Practical skills in AI-driven innovations and cutting-edge methodologies.
You'll collaborate with cross-functional teams throughout the chip development cycle and become an essential part of our dynamic physical design team, playing a critical role in next-generation cloud computing solutions development.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

Required Senior Silicon DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.

We are looking for a Senior Mechanical Engineer to join our rapidly expanding, multi-talented team in central Tel Aviv. In this role, you will be a part of the Flytrexs mechanical team - responsible for developing drones and sub-assembly as well as leading a full product lifecycle in addition to experiments, lab work and team work. Main Responsibilities:
* Ownership of complex mechanical engineering and design initiatives.
* Comprehensive Design Lifecycle: Leading the process from initial concepts through detailed 3D modeling and engineering.
* Technical Documentation: Preparing and maintaining production data, including assembly guides, technical drawings, and BOMs.
* Cross-functional Collaboration: Contributing to physical prototyping and cross-disciplinary development projects.
* Problem Solving: Identifying and fixing mechanical problems during the prototype evaluation phase.
* Expertise & Collaboration: Serving as a technical resource while supporting routine operations and team objectives.

We are seeking a motivated Senior System Validation Engineer to join our growing post-silicon validation team in Israel and support next-generation connectivity products for AI and data-center applications.
In this role, you will perform system-level post-silicon validation, characterization, and debug across silicon, hardware, firmware, and software. You will support silicon bring-up and PVT/corner testing, develop and execute functional and system validation tests, analyze results, and work with cross-functional teams to identify and resolve complex system issues.
This is a highly hands-on lab position. The primary location is Haifa, with temporary support at the Ramat Gan lab as needed.
Key Responsibilities:
Develop and execute post-silicon functional and system validation from silicon bring-up through production readiness.
Run PVT, silicon corner, stress, characterization, and qualification testing across a wide range of operating conditions.
Develop validation tests to verify functionality, performance, stability, power, and operating margins.
Debug issues across silicon, hardware, firmware, drivers, and system software.
Validate high-speed interfaces such as PCIe, CXL, Ethernet/SerDes, and DDR, as well as common system interfaces.
Develop Python scripts and automation to improve validation coverage, regression, and test efficiency.
Analyze validation data, identify issues and trends, and drive problems to root cause and closure.
Work closely with hardware, architecture, firmware, software, design, and DV teams to investigate and resolve issues.
Support the transition of new silicon from initial bring-up to a qualified, production-ready product.
Operate system platforms and laboratory equipment to support validation and debug.
Document test results, issues, root cause, and recommendations and communicate findings clearly.

As we expand our presence in Israel, we're seeking a talented Staff/ Principal Design Verification Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, developing the verification environments that ensure our next-generation AI silicon performs flawlessly.

As a Staff/ Principal Design Verification Engineer, you will be a vital contributor to the quality and reliability of our Israel R&D center. You will work on the front lines of functional verification, developing testbenches and environments that validate high-performance digital blocks, subsystems, and full-chip designs. You will tackle complex verification challenges that ensure our connectivity solutions meet the rigorous demands of the world's largest AI clusters. If you thrive on solving technical puzzles and want to play a key role in delivering cutting-edge AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Verification Environment Development
Contribute to the design and development of ASIC verification environments, focusing on unit-level and subsystem functional blocks
Develop and maintain SystemVerilog/UVM-based components including traffic generators, monitors, and checkers to ensure robust testing
Execute detailed verification plans for challenging digital designs, ensuring all functional requirements are met and verified

Coverage & Quality Assurance
Implement functional coverage models and analyze results to identify gaps in the verification process
Drive designs toward 100% verification closure through comprehensive test development
Contribute to verification methodology improvements and best practices

Debug & Cross-Functional Collaboration
Work closely with design engineers to identify, root-cause, and resolve complex hardware bugs early in the development cycle
Apply analytical skills and debugging techniques to solve intricate verification challenges
Collaborate effectively in a fast-paced, team-oriented R&D environment