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26/08/2026
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27/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an energetic, detail-oriented individual to join our Data Center Engineering Operations Team. This committed group works to maintain the critical physical infrastructure that supports Amazon Web Services. Specifically, this team works to ensure that the data center's MEP operates at 100% availability while maintaining first-class customer service to the teams and groups within the data centers.
The Data Center Engineering Operations Facility Engineer is responsible for operating and maintaining all electrical, mechanical, and fire/life safety equipment within the data center. This person serves as a technical resource to support Amazon within its owned and operated data centers. Data center equipment that supports mission-critical servers must maintain better than 99.999% uptime. DCEO Facility Engineers are also tasked with driving innovation while reducing operational costs in the facilities.

DCEO Facility Engineers are Amazons front line responders for hands-on electrical and mechanical equipment troubleshooting and operation. This equipment includes, but is not limited to, stand-by diesel generators, switchgear, UPSs, PDUs, AHUs, chillers, cooling towers, chemical treatment systems, pumps, motors, VFDs, and building automation systems.


Key job responsibilities
- Operate and maintain mechanical and electrical equipment.
- Perform root cause analysis of equipment failures.
- Troubleshooting of facility and rack-level events within internal SLA.
- Ensure all safety procedures are adhered to while performing work.
- Able to work shifts (rotating work days during the weeks).
- Take daily operational readings of all mechanical and electrical equipment.
- Utilize internal CMMS to manage building workflows.
Requirements:
Basic Qualifications
- 2+ years of relevant work experience.
- Experience in relevant work.
- Can bend or twist the body into unusual positions while working.
- Can use hands to manipulate small wires and objects.
- Can walk on job sites in uneven terrain.
- Can work at heights and from ladders.

Preferred Qualifications
- 4+ years of data center engineering experience.
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.
- Knowledge of network design and layout as well as low voltage (copper/ fiber) cabling.
- Experience in data center engineering.
- Can perform physical tasks all day without becoming overly tired.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
5 years of experience in signal or power integrity or hardware design.
Preferred qualifications:
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Proficiency in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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30/09/2026
Job Type: Full Time
The Networking Diagnostics team is seeking a highly motivated and experienced engineer. This person must have hands-on technical expertise to develop critical diagnostic tools for our newest, world-leading networking platforms. This position offers the opportunity to have a real impact in a dynamic, technology-focused company, impacting data centers and high-performance computing (HPC) clusters across the world. We are looking for independent engineers who excel in a fast-paced environment and are passionate about ensuring the stability of next-generation hardware.

What you'll be doing:
Design & Implement: Architect and develop high-performance diagnostic tools and frameworks using Python, tailored for our latest networking platforms.
Performance Optimization: Drive end-to-end development focusing on software that performs efficiently, ensuring diagnostic suites can handle high-throughput data and real-time monitoring without latency.
System Diagnostics: Take charge of developing features that bridge the gap between complex hardware behaviors and software-level diagnostics.
Collaborative Problem Solving: Partner with hardware, firmware, and driver teams to address real-world challenges that demand innovative solutions and a customer-centric approach.
Autonomous Execution: Own the full software development lifecycle of diagnostic features, from initial hardware specification to deployment in dynamic environments.
Requirements:
What we need to see:
B.Sc or equivalent experience in Computer Engineering, Computer Science, Electrical Engineering, or a related field.
5+ years of hands-on experience in the software development lifecycle, with a proven track record in performance-critical systems.
Python Mastery: Advanced programming skills in Python, with a focus on writing optimized, efficient, and scalable code for hardware interfacing.
Networking & HW Background: Solid understanding of networking protocols (TCP/IP, InfiniBand, or Ethernet) and hardware-level interaction.
Linux Expertise: Strong familiarity with Linux environments, associated debugging tools, and system-level performance tuning.
Strong analytical and debugging skills.
A highly collaborative great teammate who is also self-motivated, well-organized, and capable of working independently in a fast paced environment.

Ways to stand out from the crowd:
Performance Tooling: Experience with performance profiling, optimization, and low-level hardware communication (e.g., PCIe, I2C).
Low-Level Knowledge: Background in C/C++, RT embedded development, or driver development within a Linux environment.
Technical Leadership: Experience leading technical projects or mentoring team members in a dynamic setting.
Problem Solving: Confirmed experience in root-causing complex system-level issues and solving customer-facing hardware challenges.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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30/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are is looking for a strong technical senior architect to join us in shaping the future. Senior Architects are innovators who can translate business needs into workable technology solutions. Their expertise is deep and broad. They are hands on, producing both detailed technical work and high-level architectural designs.

As a Senior architect in the AI Networking Research team, you will explore technological challenges on accelerate networking and building AI data centers. Research new transport functions and semantics for optimizing AI workloads, AI systems communication and accelerations and much more. You will also be leading architectural and development efforts across numerous technological fields, related to the modern AI data center, such as distributed AI and deep learning solutions, data analytics, High Performance Computing (HPC), Software Defined Networking (SDN), virtualization, storage, and more.

What youll be doing:

Enhance our GPU Networking offerings for accelerating AI workloads, such as our Dynamo, our NIXL and our UCX, tailored to the unique requirements of AI workloads.

Co-design hardware features (e.g., in GPUs, DPUs, or interconnects) that accelerate data movement and enable new capabilities for inference and model serving.

Identify and evaluate new technologies, innovations and partner relationships for alignment with our technology roadmap and business value.

Lead architecture and design of new technologies and innovations such as runtime systems, communication libraries, AI-specific technologies.

Lead proof-of-concept development to evaluate and drive such technologies.
Requirements:
What we need to see:

Hold a M.Sc. or Ph.D. in Computer Science, Electrical or Computer Engineering from a leading university (or equivalent experience).

5+ years of industry experience (or equivalent) in system architecture, AI systems architecture, scaling of AI, Parallelism of AI frameworks, or deep learning training workloads.

Experienced in algorithm design, system programming, computer architecture and operating systems.

Experienced in virtualization, networking and storage.

Deep understanding of performance profiling and optimization techniques, together with defining and using hardware features.

Strong programming and software development skills.

Ability and flexibility to work and communicate effectively in a multi-national, multi-time-zone corporate environment.

Ways to stand out from the crowd:

Shown research track record.

Have experience and passion for system architecture, CPU/GPU/memory/storage/networking.

Stellar communication skills.

Knowledge in Deep Learning frameworks and AI communication libraries (NCCL, UCX, MPI and equivalents).

Deep understanding of Inference and Training workloads and optimizations, like Prefill/Decode, data parallelism, Tensor parallelism, FDSP and others.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Automation and Infrastructure Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high-volume manufacturing at wafer fabrications and Outsourced Semiconductor Assembly and Test (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next-generation of chips.
You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices, drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs
You will have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities:
Provide tools, set the environment and create automation to silicon engineering (SiEng) teams, collaborate with Test, Product, quality and reliability (Q&R) and system-level test (SLT) teams.
Create smooth and effective ways to manage silicon engineering (SiEng) datastream to and from suppliers and internally, between different platforms, while optimizing formats and datalogs, convert per need.
Verify test solutions on pre-silicon models (simulation or emulation) and support Automated Test Equipment (ATE) test development setup and environment.
Develop test method for ATE platforms.
Provide pre and post silicon dashboards and indicators that will reflect the status, demonstrate progress and point on the gaps.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in test or product engineering, with experience in infrastructure and automation and people management experience.
Experience in pre-silicon validation, test content generation, ATE program development, big data handling and post-silicon enabling from New Product Introduction through high-volume manufacturing.
Experience with ASIC test methodologies (mbist, atpg, dft serdes, sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience in ATE hardware design and proliferation: loadboards/probecards, handler kits, sockets, and thermal control solutions.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Rehovot and Tel Aviv-Yafo
Job Type: Full Time
Required SoC Test and Product Engineer Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and outsourced semiconductor assembly and tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices.
You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities
Develop and implement strategies for high-volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, defective parts per million reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and return merchandise authorization managing.
Drive product leadership for silicon engineering organization from architectural definition to global availability.
Collaborate with cross-functional teams across the globe including ATE and SLT test engineering, quality and reliability, packaging, supplier management and operations to build, deploy, and maintain a high volume manufacturing screening solution.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in product engineering or test engineering.
3 years of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for high volume manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, statistical analysis (e.g., JMP), yield management systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and report.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Chip Architect, Cloud, Silicon
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As an SoC Chip Architect, you will lead the definition of groundbreaking, high-performance custom silicon and multi-chiplet systems for our Cloud AI infrastructure. You will bridge the gap between hyperscale data center workload requirements and silicon implementation across various domains, collaborating with cross-functional partners to design scalable, energy-efficient, and feature-rich SoCs.
You will be part of a team pushing the boundaries of custom silicon engineering, architecting next-generation data center products that deliver industry-leading performance, low latency, and massive bandwidth for Cloud and our flagship AI services.
Responsibilities
Lead top-level SoC architecture across multiple disciplines, including IP architects, digital design, verification, physical design, validation, firmware, power management, security, and system software.
Architect and analyze complex multi-chiplet systems, including chip partitioning, die-to-die (D2D) interconnects, advanced packaging constraints, and high-performance on-chip fabrics (NoC).
Define top-level SoC subsystems, memory hierarchies, clock distribution, reset schemes, and power domains to ensure optimal system performance and operational efficiency.
Formulate end-to-end operational flows, latency models, and system throughput analyses for data center workloads.
Own the SoC architecture specification and lead it throughout the complete product life-cycle: concept, modeling, implementation, tape-out, and post-silicon bring-up.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or equivalent practical experience.
15 years of experience leading the architectural definition of high-performance SoCs, ASICs, or multi-chiplet systems from concept through production.
Experience architecting SoC interconnects, memory hierarchies, and system-level fabrics.
Experience writing, owning and maintaining comprehensive SoC architecture specifications.
Experience working across hardware, firmware, and system software boundaries with system-level reasoning.
Preferred qualifications:
Masters degree or PhD in Electrical Engineering or Computer Engineering.
Experience with AI workload analysis, their mapping across different data center system components, and optimizing hardware solutions to better serve them.
Experience scaling and optimizing high-performance AI accelerators, compute chiplets, or IO Hub SoCs for data center/cloud deployments.
Proven track record of architecting multi-chiplet systems utilizing cutting-edge silicon process technology and advanced packaging (2.5D/3D, D2D interfaces such as UCIe, BoW, or high-speed SerDes).
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Engineer, Edge AI, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make our product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement groundbreaking data center.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
3 years of experience with RTL development for ASIC subsystems using Verilog.
Experience with speed interfaces such as PCIe, InfiniBand, and their low latency, security, and reliability principles.
Experience with micro architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience with scripting languages (e.g., Python or Perl).
Knowledge of arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Knowledge of high performance and low power design techniques.
Knowledge of FPGA, emulation platforms, and SoC architecture.
Knowledge of assertion-based formal verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Design Engineer, Edge AI, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make our product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement groundbreaking data center.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
8 years of experience with RTL development for ASIC subsystems using Verilog.
Experience with speed interfaces such as PCIe, InfiniBand, and their low latency, security, and reliability principles.
Experience with micro architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience with scripting languages (e.g., Python or Perl).
Knowledge of arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Knowledge of high performance and low power design techniques.
Knowledge of FPGA, emulation platforms, and SoC architecture.
Knowledge of assertion-based formal verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8847232
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Physical Design Lead, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Lead physical design of complex SoC to tape-out while working with multiple team members.
Evaluate and develop physical design methodologies and decide on the SoC flow.
Work with architects and logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure.
articipate in design reviews and track issue resolution, and engage in technical and schedule tradeoff discussions. Create execution plans for projects and manage team efforts from concept to working silicon in volume.
Understand architecture and design specifications with the larger team, and define physical design strategies and tactics to meet quality and schedule goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
Experience in silicon implementation and chip integration.
Experience in ASIC development teams.
Experience in managing physical design teams working on digital designs that produce and deliver silicon.
Preferred qualifications:
Experience in extraction of design parameters and analyzing data trends.
Experience and breadth in engineering across physical design, top-level implementation, GDS tape-out.
Experience in top-level floor planning, block integration, static timing analysis, and sign-off.
Understanding of circuit design, device physics, and deep sub-micron technology.
Knowledge of delivery of high complexity silicon in technology process nodes.
Ability to lead cross-functional teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8847267
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