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חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, within a dynamic, open, fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for excellent electrical engineering graduates to join our talented Physical Design team, which develops our next generation products for the cloud market.
We will be conducting a unique training program for three months, where where you will be studying the following with our technical experts and team leaders:
* Backend development flow and stages (RTL to GDS).
* A wide variety of relevant tools and knowledge.
* Practical experience with the most advanced technologies in the industry.

Key job responsibilities
Join our three-month training program where you'll work alongside technical experts and team leaders to gain:
*Backend development expertise (RTL to GDS flow).
*Hands-on experience with industry-leading tools and technologies.
*Practical skills in AI-driven innovations and cutting-edge methodologies.
You'll collaborate with cross-functional teams throughout the chip development cycle and become an essential part of our dynamic physical design team, playing a critical role in next-generation cloud computing solutions development.
Requirements:
Basic Qualifications
- BSc in Electrical/Computer Engineering. Please submit your grade sheet combined with your CV as a single PDF document.
- Recent graduates or students currently in their 8th semester (final year).
- Available to work full-time.

Preferred Qualifications
- Experience in the industry.
- Demonstrated passion for technological innovation.
- Ability to adapt and learn rapidly in a dynamic environment.
This position is open to all candidates.
 
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11/08/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a junior Embedded Software Engineer, to join us in building the next generation of networking products. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, fast-paced environment. Working for Annapurna Labs is thrilling and a constant learning experience. As an embedded SW development engineer, you will be responsible for developing features for Annapurna Labs next-generation hardware, to enable high network bandwidth and packets-per-seconds (PPS) performance, with consistently low latency. You will work to bring up a broad selection of instance types, optimized for various use cases, to suit each of our customers needs, such as varying combinations of CPU, memory, storage, and networking capabilities. As a SW development engineer, you will play a key role in shaping architecture definitions and SW system designs, and help to resolve complex customer issues. You will continuously evolve technically, while working to monitor AWS cloud health, maintain high quality standards, develop highly-optimized code, and provide exceptional customer satisfaction.

Key job responsibilities
We will be conducting a unique onboarding training program, where you will be studying the following with our technical experts and team leaders:
* Embedded systems basics.
* Annapurna technologies in EC2.
* Cloud compute development.
* Networking 101.
Requirements:
Basic Qualifications
- B.Sc. in Computer Science/Computer Engineering/Electrical Engineering or related field. Make sure to include a grade sheet with your CV in a single PDF.
- Knowledge of C programming language.

Preferred Qualifications
- Experience in embedded SW Development.
- Hands-on experience developing in a Linux environment
- Experience with HW/SW interfaces at both the board and chip level.
- Understanding of computer architecture.
- Personal characteristics: team player, highly motivated, willing to work in a dynamic and demanding environment, creative, and a fast learner.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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לפני 5 שעות
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for talented engineers to join the Pre-silicon Verification team and help us technically lead the challenges of the next decade, developing a semiconductor platform based on revolutionary architecture, and taking part in the development of cutting-edge products within a disruptive system architecture.
Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment.
Requirements:
Basic Qualifications
- B.Sc. in Electrical or Computer Engineering. Please include your academic transcript with your CV in a single PDF
- Understanding of object-oriented programming concepts
- Knowledge of Verilog/SystemVerilog/Specman

Preferred Qualifications
- Familiarity with hardware verification concepts and tools (UVM , Coverage Driven verification)
- Experience with at least one scripting language (Python, Perl, Bash, or Tcl)
- Knowledge of PCIe, Processors, Ethernet, DDR
This position is open to all candidates.
 
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10/08/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the whole ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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05/08/2026
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
Are you passionate about working on a team that is at the cutting and bleeding edge of hardware technology? Our Design-for-Test Engineering team works on groundbreaking innovations involving crafting creative solutions for DFT architecture, verification and post-silicon validation on some of the industry's most sophisticated semiconductor chips. We are looking for an experienced DFT Engineer to join the ATPG team. The position includes taking part in development of the next generation DFT technologies and working closely with a wide range of our groups and aspects - chip design, backend, verification, and production testing.

Working on the most advanced technologies and complex products, our DFT solution are unique and innovative internal developments, and we are continuously improving and evolving the solution to meet the challenging goals. If you find groundbreaking Technologies, and next generation products interesting, then this is the team for you. Take opportunity to join our team for an exciting and educational environment, where every individual has significant contribution to our products and achievements!

What youll be doing:
You will be in charge of state of the art Design for Test/ATPG flows and implementation.
Take full ATPG ownership end to end on a project, from Arch & planning to pattern generation, verification and post Silicon bring up and diagnosis.
Inventing and maintaining automation flows that provide the short test time to productionץ
Requirements:
What we need to see:
3+ years of hands on DFT/ATPG experience knowledge & technical experience in DFT ASIC Design and in ATPG tools.
Strong programming skills in scripting languages.
BSc. in Electrical Engineering or Computer engineering.
Quick learner, proactive and self-motivated, eager to learn and contribute, sense or ownership, commitment, and responsibility.

Ways to stand out from the crowd:
Knowledge of DFT including scan, BIST, on-chip scan compression, fault models, ATPG, and fault simulation.
Experience in Mentor TestKompress ATPG tool and retargeting flow.
Programming languages: TCL, PRL, Phyton & Unix shell scripts.
Experience with ATE and Silicon bring-up.
This position is open to all candidates.
 
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30/08/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for talented engineers to join the Pre-silicon Verification team and help us technically lead the challenges of the next decade, developing a semiconductor platform based on revolutionary architecture, and taking part in the development of cutting-edge products within a disruptive system architecture.

Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment.
Requirements:
Basic Qualifications
- Electrical/Computer Science engineer.
- 4+ years of experience with RTL verification.
- Knowledge of Hardware Verification concepts and tools (UVM , Coverage Driven verification),
- Sound understanding and knowledge of object-oriented programming concepts, Verilog/SystemVerilog/Specman.

Preferred Qualifications
- Knowledge of the following programming languages: Perl/Bash/TCl/Python.
- Knowledge of PCIe, Processors, Ethernet, DDR.
This position is open to all candidates.
 
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11/08/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for exceptional engineers to join the top-tier team developing the next generation semiconductor platform based on a revolutionary architecture. You will participate in design activities, working on the next generation of our products.

As a Chip Design Engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities:
* Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.
Requirements:
Basic Qualifications
- 4+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- BSc in Electrical Engineering/Computer Engineering/Computer Science.

Preferred Qualifications
- Background in protocols (AXI, CHI, DDR, Networking, PCIe).
- knowledge of Network-on-Chip (NOC) architecture.
- Experience with coherent and non-coherent fabric design.
- Experience with the entire SoC cycle - Synthesis / STA / CDC / Lint.
- Experience with Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 2 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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