דרושים » חשמל ואלקטרוניקה » Experienced board designer

Requirements:
* B.Sc. in Electrical Engineering.
* 5+ years of experience in board-level hardware design.
* Strong experience in analog and digital design, simulations, and component selection.
* Hands-on experience with hardware bring-up, testing, and integration.
* Experience with OrCAD design tools (mandatory).
* Familiarity with EMC/EMI standards.
* Experience with STM32 microcontrollers (an advantage).
* Fluent in Hebrew and English. Preferred Qualifications
* Experience with MIL- STD standards.
* Knowledge of programmable devices (CPLD / FPGA).
* Ability to work with software teams and read Embedded code.
* Customer-facing experience and willingness to travel abroad.
* Experience with Nvidia, Qualcomm, or similar SOM platforms.

Requirements:
* Actively participate in hands on PCB design including schematics creation and layout work using industry standard EDA tools.
* Participate in the development of next-generation electro-optical (EO) devices and sub-systems for high-speed communication.
* Support electro-optic sub-systems and evaluation boards through schematic design, component selection, characterization, layout considerations, and implementation. Provide guidance on fabrication and assembly.
* Utilize advanced PCB technologies including mSAP, high-density HDI, and state-of-the-art PCB materials optimized for high-speed signal integrity supporting speeds up to 224 Gbps.
* Lead board bring-up, characterization, and debug, including high-speed scope and VNA measurements.
* Collaborate with hardware project teams, including Production, Software/Firmware, Photonics, and system.
* Support customers by reviewing schematics and PCB layouts, providing guidance to ensure robust design and high-speed performance.
* Utilize state-of-the-art laboratory equipment. Requirements What Were Looking For:
* B.Sc. in Electrical Engineering.
* 8+ years as a board designer with experience in executing complex hardware projects.
* Extensive experience designing high-speed PCBs, covering impedance control, length matching, and SI/PI best practices for standards such as Gigabit Ethernet and PCIe.
* Hands-on experience with Cadence tools (Allegro, OrCAD) for schematic capture and PCB layout.
* Experience in design ownership on major blocks/clusters from definition through implementation phases.
* Strong hands-on laboratory skills and debugging capabilities.
* Skilled in working with advanced PCB materials and high-density PCB technologies, including complex stackups and fine-pitch routing.
* Strong project management skills, independence, and excellent interpersonal abilities.
* Strong understanding of transmission lines, impedance control, crosstalk, and return-path design.
* Familiarity with lab equipment such as oscilloscopes, VNAs, and spectrum analyzers. What Will Make You a Star Candidate:
* Proven proficiency in ANSYS HFSS / SIwave / 3D Layout for electromagnetic, SI, and PI simulations.
* Ability to interpret and simulate S-parameters, eye diagrams, and frequency-domain models.
* Experience in PCB design involving high-speed DSPs, including power integrity, signal-integrity constraints, and high-speed interface routing.
* Practical experience with high-speed sampling oscilloscopes and optical spectrum analyzers.
* Experience with optical transceivers.
* Knowledge of photonic integration technology and its ecosystem.
* Experience in lab automation using Python -based tools.

Requirements:
Education: B.Sc. in Computer Engineering or Electronic Engineering.
Experience: 5+ years of professional engineering experience.
Teamwork: Excellent communication skills. Proven track record of being a strong, supportive team member in collaborative R&D environments.
Core Languages: Strong proficiency in C and C++ programming.
RTOS Expertise: Proven experience in real-time embedded systems, specifically working with the VxWorks operating system.
Low-Level Development: Demonstrated experience in Board Support Package (BSP) implementation.
Networking: Strong knowledge of Ethernet protocols and Networking.
Advantages (Nice to Have):
Experience working on systems that include Layer 2 (L2) and Layer 3 (L3) protocols.
Experience working with Time-Division Multiplexing (TDM) networks.
Knowledge of the Linux operating system.

Requirements:
B.Sc in Electronic Engineering or equivalent experience
5+ years experience in high-speed design
Having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, DFM, DFA, DFT constraints in volume manufacturing is needed for this role.
Be an authority in using PCB design tools (Mentor - a must , more tools - Advantage)
Have a deep understanding of PCB Signal Integrity and Power integrity.
Knowledge in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling.
Strong verbal and written communication skills in English
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Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
8 years of experience in Analog/Mixed-Signal design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience leading a block or sub-system tape-out for high-speed I/Os.
Experience demonstrating innovation in high-speed link design through patents or product releases.
Experience with package and PCB co-design and their impact on signal integrity.
Experience in system-level modeling and simulation using tools like Matlab or Python.
Knowledge of noise analysis, jitter decomposition, and adaptive loops.

Requirements:
8+ years of hands-on experience with ASIC physical design (RTL-to-GDS).
Proven experience taking multiple full-chip SoCs from RTL through tapeout.
Deep knowledge of Cadence and/or Synopsys backend flows (experience with both is a strong plus).
Strong understanding of PnR, timing closure, SI, power, DRC/LVS, and signoff.
Excellent debugging and problem-solving skills.
Strong scripting skills in TCL and Python.
Nice-to-have / Advantage
Experience with multiple power domains and low-power design techniques.
Background that spans both frontend (RTL) and backend.
Experience influencing or defining methodology across teams or projects.

Requirements:
Experience: 8+ years in seeker or related sensing- system development for missiles, UAVs, or other guided weapons. Direct hands-on experience with at least one full seeker development cycle from concept to flight. Education: B.Sc. or higher in Electrical Engineering, Aerospace Engineering, Physics, or related field. M.Sc. preferred. Sensing depth: Strong working knowledge of one or more seeker modalities, RF (radar, semi-active), EO/IR, or laser, including signal-chain design and tracking algorithms. Systems thinking: Proven experience writing requirements, ICDs, and trade-study documents; comfortable owning a subsystem across all engineering disciplines. Lifecycle ownership: Experience taking hardware through qualification (MIL- STD -810, MIL- STD -461) and transferring to production.
* Eligible for security clearance. Preferred Qualifications
* Direct experience on surface-to-air missile or interceptor seekers.
* Background at IAI, Rafael, Elbit, or similar primes, particularly in seeker / EW / radar groups.
* Experience with multi-mode seekers (e.g., dual-mode RF + IR).
* Working knowledge of sensor fusion (Radar, EO/IR, IMU) and target-tracking algorithms.
* Background in algorithms / signal processing, MATLAB / Simulink / Python prototyping.
* FPGA/ DSP exposure for Real-Time signal processing on the seeker.