לוח משרות דרושים מהנדס אלקטרוניקה בחיפה וסביבתה

We are looking for highly motivated engineers who love the challenges and the opportunity of a small company.
Join us and be a part of a small and dynamic team, which revolutionizes the parallel processor architecture.

we are looking for a VLSI Design Engineer.

abra professional services is seeking for an Field Technician We are looking for a Field Technician – Certified Electrician to join the Operations team and support the maintenance and operation of cellular network infrastructure in the Northern region. The role involves extensive field work, including configuration, maintenance, and troubleshooting of cellular sites, radio equipment, and transmission systems. The technician will be responsible for ensuring network availability, performance, and quality while working in dynamic and sometimes challenging environmental conditions. Key Responsibilities:
* Maintenance and operation of cellular network infrastructure
* Configuration and commissioning of cellular sites, including radio and transmission equipment
* Troubleshooting and resolving faults at cellular sites
* Integration of cellular sites, including RF chains, antennas, radio systems, and transmission equipment
* Installation, operation, and maintenance of AC/DC power systems
* Field work under varying environmental conditions
* Participation in on-call rotations, including nights, weekends, and holidays

we are looking for forward-thinking, self-motivated engineers who thrive in fast-paced environments and "crisis times." Beyond technical excellence, successful candidates are:
Intrinsically, see the importance of every detail in "elegant solutions."
Excellent interpersonal and communication skills to work across diverse functional areas.
Schedule-driven with a desire to solve challenges that have never been solved before.
Responsibilities
Micro-Architecture & RTL: Design and implement high-quality, power-efficient RTL (Verilog/SystemVerilog) from block-level to sub-system levels.
Cross-Functional Collaboration: Partner with Architecture, Algorithm, Software, and Physical Design (PD) teams to translate product requirements into GDS-ready silicon.
Front-End Flow Management: Take ownership of "correct-by-construction" design tasks, including Synthesis, Lint, CDC/RDC (Clock/Reset Domain Crossing), and STA (Static Timing Analysis).
Verification Support: Work closely with Design Verification (DV) and Formal Verification teams to define coverage requirements, develop testbenches, and debug functional/performance issues.
Post-Silicon & Validation: Support pre-silicon emulation (FPGA, Palladium) and post-silicon validation in lab environments to ensure spec compliance.

This is a highly visible role where you will own the physical design cycle at the partition, IP, and Chip levels-enabling us to produce fully functional "first silicon" designs. Do you love working on challenges that no one has solved yet? If you are ready to join the world's leading engineers and work with state-of-the-art design flows, come join our group.
Responsibilities
You will be responsible for all phases of pre-silicon development, from initial definition to high-quality tape-out (Netlist to GDSII).
Lead block-level Place & Route (PnR), complex floor-planning, partitioning, and the creation of power domains and grid specifications.
Develop and validate high-performance, low-power clock network guidelines and distribution.
Drive static timing closure (STA), Physical Verification (DRC/LVS), and Electrical/Power analysis (EM, IR-Drop, Xtalk, and Noise).
Participate in establishing CAD and physical design methodologies for "correct-by-construction" designs and assist in flow development for chip integration.
Generate and implement ECOs to fix timing, noise, and EM/IR violations while meeting strict area and power constraints.
Work closely with logic design teams on SoC architecture and HDL (Verilog) to implement timing fixes and design optimizations.

As a Team Lead, you will lead and mentor a backend development team working on a complex, large-scale medical imaging platform. This role combines Agile leadership with hands-on technical contribution, driving high-quality software delivery in a regulated, customer-focused environment.

Your role

You will act as the Agile facilitator and technical leader of a Radiology Informatics backend team within Philips Image Management in Israel. You will guide the team in delivering scalable, high-performance software that supports advanced PACS solutions used by hospitals worldwide.
Serve as Scrum Master, ensuring effective adoption and continuous improvement of Agile (SAFe) practices
Lead team planning and execution toward iteration and program objectives
Contribute up to 50% hands-on software development and drive technical decision‑making.
Drive complex development efforts and resolve technical blockers
Promote clean, scalable, high-quality code and strong engineering standards
Ensure compliance with development processes, quality metrics, security, and regulatory requirements
Encourage system thinking, domain knowledge, and strong customer focus
Provide clear accountability, remove impediments, and act as an escalation point
Drive innovation through technical reviews, best practices, modern engineering approaches, and the adoption of AI development tools to enhance productivity and code quality
Collaborate with global cross-functional teams and stakeholders
Develop team capabilities through mentoring, delegation, and structured execution.

At High Sec Labs (HSL), a global leader in cybersecurity and secure connectivity solutions, we are looking for a talented Electronics Engineer to join our advanced development team. About the Role:
As part of our hardware group, you will take an active role in developing cutting-edge electronic products in the communication and cybersecurity domains. The role involves end-to-end board design, bring-up of new products, and integration of complex systems combining RF circuits, analog components, processors, and FPGAs.
Key Responsibilities: Design, bring-up, and validation of electronic boards and systems. Integration of RF, analog, digital, and FPGA-based circuits. Debugging, troubleshooting, and improving existing products. Close collaboration with multidisciplinary teams, including software and system engineers. Supporting the full product lifecycle from concept to production.

As an Expert EMIR & Power Integrity Lead, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon. You will own from block level to full-chip the Electro-Migration and IR Drop (EMIR) methodology, analysis, and sign-off, working at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering.

You will be responsible for defining power grid architectures and validating that products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes. Your work will directly impact the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Lead static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from block level to full-chip sign-off
Define and implement robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Collaborate with Physical Design teams to define optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Work closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Drive root-cause analysis for voltage drop violations and EM risks; propose and implement layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

As a Physical Design CAD Lead, you will be responsible for the physical implementation environment. Your primary mission is to build, optimize, and support the automated flows from RTL to manufacturable GDSII tape-out. You will own the flows, Database and will support the whole PD team to optimize their blocks for Power, Performance, Timing while keep the team aligned on Methodical, Efficient and balanced work Environment.


Key Responsibilities

Design and maintain automated flows for Synthesis, Place & Route, and Floor-planning
Develop robust environments for Static Timing Analysis, Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write custom plug-ins and scripts to extend the capabilities of vendor tools, tailoring them to our specific process node constraints and flows
Create automated "dashboards" and feedback loops to help design teams track and improve Power, Performance, and Area metrics across iterations
Collaborate with EDA vendors (Synopsys, Cadence, Siemens/Mentor) as consulters for our developed flows and results analysis     

As the Physical Design Chip Top Expert you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SoC Top level for chips that drive the worlds largest AI clusters. As PD Top Level Lead, you will own all PD disciplines of the Chip and own the T.O GDS that meet the chip signoff Criteria (Timing, LVS, EMIR, DRC, PV etc. ) ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

SoC Top level Ownership and oversee the Chip convergence.
Take full ownership of Top Level physical implementation, including floor planning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Work Closely with Package team on Bump map to Ballout taking into consideration all Signal integrity aspects

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

As a Senior DFT Engineer at Astera Labs, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews