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משרה בלעדית
לפני 5 שעות
Location: Haifa
Job Type: Full Time
Key job responsibilities
Define and design systems to support K2 cards development and manufacturing.
Define and provide feedback to the design of the K2 Smart Network Interface Card.
Work with design partners and manufacturing sites, to enable healthy mass production of the K2 card.
Analyze and debug design/manufacturing/integration issues.
Continuously assess process capabilities and innovate to simplify processes, reduce costs, and shorten the time cycle of K2 cards development and manufacturing.
Collaborate with members of cross-functional teams, to gain knowledge and improve product design, processes, and quality.
Work with customers, to optimize the entire value stream and put together joint processes that will lead to improved time cycle and lower costs.
Willing to travel abroad one or two times a year, for a week at a time.
Requirements:
- At least 5 years' experience leading hardware products from design to mass production: life cycle, components selection, schematics, layout, thermal, mechanical design, review, hardware-software interfaces, and production testing.
- At least 5 years experience in board design and practical hardware lab.
- Experience with CPLD and FPGA design and development
- Proficiency in HDL languages: VHDL and/or Verilog
- Understanding of digital logic design, synthesis, simulation, and timing constraints

Preferred Qualification:
- Server design or integration experience in leading industrial company.
- Practice with Linux based Operating system.
- Practice with Bash/ Python language scripts.
This position is open to all candidates.
 
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8653817
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09/04/2026
Location: Haifa
Job Type: Full Time
we are looking for a Hardware Lead Engineer.
As HW Lead Engineer, in the Nitro team, you will be responsible for defining Annapurna Labs Smart Network Interface Card (NIC) design, leading development and validation cycles, and bringing the product to healthy mass production.
Youll provide leadership in new technologies, bringing them to large-scale deployment, in a continuous effort to deliver a world-class customer experience. We offer a fast-paced, intellectually challenging position, where youll work with technical experts, senior leaders, covering multiple technologies. We are changing the industry, and looking for individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities:
- Define the architecture and design specifications of next generation K2 Nitro Cards.
- Own full product life cycle, engage with design partners and manufacturing sites to enable high-yield mass production.
- Lead the analysis and debugging of complex design, manufacturing, and integration challenges.
- Continuously design for process optimization to improve product quality, simplify workflows, and accelerate the Nitro card development lifecycle.
Requirements:
- B.Sc. in Electrical/Computer Engineering or equivalent
- 8+ years design experience in Hardware Design
- At least 6 years of experience leading complex hardware products through the entire lifecycle, from initial concept to high-volume mass production.
- Experienced in managing hardware-software interfaces and implementing scalable production testing.
- Design and lab experience with at least one of the following interfaces: DDR4/5, PCIe Gen4/5/6, 100/25/10GbE; Practical experience with high-speed lab equipment.
Preferred Qualifications:
- HW/SW/FW Integration experience
- Computer architecture knowledge, experience with server design or architecture (x86/ARM/ and ML/GPU clusters)
- Experience with operating systems, boot flows, networking, and remote debugging
- Experience with mass production products
- Basic skills in scripting: Python/Bash etc.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
8603340
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, or equivalent practical experience.
5 years of experience in board design (schematic and layout supervision) for server, networking, or high performance computing products.
Experience in designing with serial interfaces (e.g., SerDes, PCIe, Ethernet, DDR) and signal integrity (insertion loss, crosstalk, impedance matching).
Preferred qualifications:
Experience with DC-DC power converter design and power integrity concepts.
Experience bringing up complex SoCs and debugging interaction between hardware, firmware, and software.
Proficiency with Electronic Design Automation (EDA) tools (Cadence Concept/Allegro, or similar).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8642064
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3 ימים
Location: Haifa
Job Type: Full Time
we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8652014
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience in logic design and debug with Design Verification (DV).
Experience with microarchitecture and specifications.
Preferred qualifications:
Experience with logic synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (Lint, CDC, VCLP etc.).
Experience in a scripting language like Python or Perl.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of one of these areas, PCIe, UCIe, DDR, AXI, ARM processors family.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8643611
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Team Manager, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design Team Manager within the Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will oversee the Intellectual Property (IP) and SoC VLSI design cycle from architecture to production. You will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads. You will be responsible for mentoring and developing team members and tech leads, driving improvements in leadership, technical execution, and design flows.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and System-on-Chips (SoCs).
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of one of the following areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8643602
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3 ימים
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
3+ years of hands-on experience in DFT roles at semiconductor companies
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent)
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8652211
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
8 years of experience in technical leadership.
Experience in one of the following areas: arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Experience developing RTL for ASIC subsystems.
Preferred qualifications:
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in TCP, IP, Ethernet, PCIE and DRAM including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
8642044
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Analog Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Analog Design Engineer, you will design and integrate analog sub-systems. You will be responsible for ensuring the analog front-end (AFE) communicates with the digital signal processor (DSP), the package and silicon are a single electrical entity. Your work will bridge the analog and digital worlds to enable industry-leading performance.
The ML, Systems, & Cloud AI (MSCA) organization, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.).
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Own the architecture and implementation of a major sub-component, such as the entire receiver AFE or the clocking/phase-locked loop (PLL) distribution network.
Design the critical suspension system (e.g., equalization/continuous-time linear equalizer (CTLE), analog-to-digital converter (ADC) that allows the digital core to function perfectly despite a noisy, high-loss channel.
Lead the definition and design of test chips to prove out novel topologies and circuit techniques in next-generation gate-all-around (GAA) nodes.
Work with DSP, firmware, and system architects to define hardware/software partitioning and interface specifications.
Provide technical guidance and mentorship to engineers on the team.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field or equivalent practical experience.
10 years of experience in analog/mixed-signal design.
Preferred qualifications:
Master's or PhD degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience leading a block or sub-system tape-out for high-speed Inputs/Outputs.
Experience with noise analysis/jitter decomposition/adaptive loops.
Experience with package and printed circuit board (PCB) co-design and their impact on signal integrity.
Experience in system-level modeling and simulation using tools like Matlab or Python.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8643567
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Senior IC Test Engineer
Haifa
Full time
We are the Production Test team - responsible for the definition, development, and deployment of production test operations for the worlds most advanced SoCs for ADAS and self-driving vehicles.
This is your opportunity to join a team during its initial forming stage and leave your mark as we assume full ownership for its silicon production operations to enable high volume manufacturing for cutting-edge automotive products.
What will your job look like?
Work closely with the design teams from early stages of the design process to review DFX architecture and define test requirements.
Define test methodologies and generate test content for high-speed interfaces of embedded IP blocks (LPDDR4/5, PCIe Gen4/5, D/C/MPHY).
Test program coding, pattern conversion and pre-Si validation (virtual test simulations)
Support Load Board and Probe Card design activities.
Lead post-Si test program debug activities to enable delivery of samples to internal and external customers.
Test program characterization and tuning to enhance test program quality to meet automotive standards.
Support Quality & Reliability team to enable effective and timely qual plan execution.
Lead test deployment activities with tier-one Foundry and OSAT vendors to enable large-scale Wafer-Sort and Final-Test operations.
Requirements:
BSc or MSc degree in Electrical Engineering.
7+ years of experience as IC Product/Test engineer.
Hands on experience in bring-up & productization of complex IC products.
Prior experience with Teradyne UltraFlex/UltraFlexPlus is - significant advantage.
Deep understanding of structural DFT methods (scan, mbist, jtag, ).
Proficiency in C/C++ and scripting language (Perl, Python, ) in Unix environment.
Experience with data and yield analysis using known statistical methods and tools (e.g. JMP).
Familiarity with Verilog and RTL behavioral simulations - an advantage
Strong sense of ownership, commitment, and responsibility.
Team player, with the ability to work in a rapidly evolving environment.
Good interpersonal communication skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8638967
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Design Verification Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Senior Design Verification Engineer, you will be a part of Research and Development team to verify digital designs, develop constrained-random test environments and drive system testing to closure. You will collaborate with design and verification teams, manage the verification life-cycle and uncover bugs through corner-case testing.
Responsibilities
Plan and execute the verification of digital design blocks by understanding specifications and working with design engineers to define key verification scenarios.
Develop and refine random verification environments using SystemVerilog/UVM or Specman to ensure effective test coverage.
Define and implement various coverage measures to capture stimulus and corner-case scenarios.
Collaborate with design engineers to debug tests and ensure functional correctness of design blocks.
Drive coverage analysis to identify verification gaps and demonstrate progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
8 years of experience verifying digital logic at Register-Transfer Level (RTL) using SystemVerilog or Specman/E for Field Programmable Gate Arrays (FPGAs) or Application-specific integrated circuit (ASICs).
Experience with Central Processing Unit (CPU ) implementation, assembly language, or compute System on a Chip (SOC).
Experience verifying digital systems using standard IP components/interconnects (e.g., microprocessor cores, hierarchical memory subsystems).
Experience creating and using verification components and environments in standard verification methodology.
Preferred qualifications:
Masters degree in Electrical Engineering or Computer Science.
2 years of experience verifying digital logic at Register-Transfer Level (RTL) using SystemVerilog or Specman/E for Field Programmable Gate Arrays (FPGAs) or Application-specific integrated circuit (ASICs).
Experience with UVM, SystemVerilog, or other scripting languages (e.g., Python, Perl, Shell, Bash, etc.).
This position is open to all candidates.
 
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