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משרה בלעדית
לפני 20 שעות
Location: Haifa
Job Type: Full Time
Key job responsibilities
Define and design systems to support K2 cards development and manufacturing.
Define and provide feedback to the design of the K2 Smart Network Interface Card.
Work with design partners and manufacturing sites, to enable healthy mass production of the K2 card.
Analyze and debug design/manufacturing/integration issues.
Continuously assess process capabilities and innovate to simplify processes, reduce costs, and shorten the time cycle of K2 cards development and manufacturing.
Collaborate with members of cross-functional teams, to gain knowledge and improve product design, processes, and quality.
Work with customers, to optimize the entire value stream and put together joint processes that will lead to improved time cycle and lower costs.
Willing to travel abroad one or two times a year, for a week at a time.
Requirements:
- At least 5 years' experience leading hardware products from design to mass production: life cycle, components selection, schematics, layout, thermal, mechanical design, review, hardware-software interfaces, and production testing.
- At least 5 years experience in board design and practical hardware lab.
- Experience with CPLD and FPGA design and development
- Proficiency in HDL languages: VHDL and/or Verilog
- Understanding of digital logic design, synthesis, simulation, and timing constraints

Preferred Qualification:
- Server design or integration experience in leading industrial company.
- Practice with Linux based Operating system.
- Practice with Bash/ Python language scripts.
This position is open to all candidates.
 
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8653817
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לפני 11 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for a Sustaining Lead Engineer to join the team responsible for maintaining and improving the manufacturing health of our cloud server platforms at scale.

As a Sustaining Lead Engineer, you will own the ongoing producibility, yield, and quality of our Graviton server products across high-volume manufacturing sites - driving root-cause analysis, process improvements, and supply continuity for products already in mass production. This is a multidisciplinary role spanning hardware, firmware, test, and manufacturing process domains.

Key job responsibilities
- Support new product introduction (NPI) to volume transition by defining production-readiness criteria and validating manufacturing processes at scale.
- Own manufacturing yield, quality, and reliability metrics for Graviton server platforms in volume production; drive systematic root-cause analysis and corrective actions for field and factory issues.
- Partner with Contract Manufacturers (CMs) to monitor process health, resolve production escapes, and implement continuous improvement initiatives across multiple high-volume lines.
- Lead debug and failure analysis of field returns and fleet-level reliability events - identify systemic failure modes, develop containment actions, and drive permanent fixes back into design and manufacturing processes.
- Partner with supply chain to review, identify, and qualify second-source electrical components to mitigate supply-chain risk and ensure continuity of supply without disrupting production.
- Develop and maintain sustaining test strategies - including failure analysis workflows, screening methods, and data-driven disposition criteria - to protect outgoing quality.
- Analyze manufacturing and field data at scale to identify trends, repeat-offender units, and systemic failure modes; translate findings into actionable design or process changes.
- Willing to travel 4-6 times annually for week-long trips to manufacturer sites.
Requirements:
Basic Qualifications
- Bachelor's degree in electrical engineering or equivalent.
- 8+ years of experience developing and supporting hardware products.
- Demonstrated experience leading cross-functional efforts across HW, FW, test, and manufacturing teams.
- Working knowledge of server or complex electronic system architecture (PCB, power delivery, high-speed interfaces such as DDR4/5, PCIe Gen3/4/5).
- Hands-on experience with manufacturing test development, debug, and data analysis at scale.
- Familiar with scripting (Python/Bash) for practical uses such as data analysis.

Preferred Qualifications
- Experience working directly with Contract Manufacturers (CMs) or ODMs in a sustaining or production engineering capacity,
- Volume manufacturing - including yield management, failure analysis, root-cause investigation, and corrective/preventive action processes.
- Knowledge of networking, storage, or Linux at a system level.
- Track record of technical leadership in a matrixed, multi-site environment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8719434
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
You will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis is expected. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible.
Responsibilities
Lead the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Establish and direct the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge and latch-up (ESD/LU), and biased highly accelerated stress test (b/HAST)) and conduct in-depth failure analysis to resolve quality issues.
Analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical quality and reliability models (e.g., early life failure (ELF), time-dependent dielectric breakdown (TDDB), or negative bias temperature instability (NBTI)) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
4 years of experience in Integrated Circuit (IC) silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JMP Scripting Language (JSL).
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8717555
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required ChipDev CAD Engineer, Hardware, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
Our Cloud's software engineers develop the next-generation technologies that change how billions of users connect, explore, and interact with information and one another. We're looking for engineers who bring fresh ideas from all areas, including information retrieval, distributed computing, large-scale system design, networking and data storage, security, artificial intelligence, natural language processing, UI design and mobile; the list goes on and is growing every day. As a software engineer, you will work on a specific project critical to our Cloud's needs with opportunities to switch teams and projects as you and our fast-paced business grow and evolve. You will anticipate our customer needs and be empowered to act like an owner, take action and innovate. We need our engineers to be versatile, display leadership qualities and be enthusiastic to take on new problems across the full-stack as we continue to push technology forward.
Responsibilities
Manage project priorities, deadlines, and deliverables. Design, develop, test, deploy, maintain, and enhance software solutions.
Create software solutions that improve the hardware design process through automation. Propose, design, and implement software automation that directly addresses bottlenecks in today's ASIC and SoC EDA flow.
Work directly with the hardware team on projects prototype and then deploy tools to make a positive impact on our chip hardware development process. Participate in, or lead design reviews with peers and stakeholders to decide amongst available technologies.
Review code developed by other developers and provide feedback to ensure best practices (e.g., style guidelines, checking code in, accuracy, testability, and efficiency).
Triage product or system issues and debug/track/resolve by analyzing the issues and the impact on hardware and quality.
Requirements:
Minimum qualifications:
Bachelors degree or equivalent practical experience.
4 years of experience building developer tools that improve developer velocity, code quality, and code health (e.g., compilers, automated).
4 years of experience with software development in one or more programming languages, and with data structures and algorithms.
3 years of experience testing, maintaining, or launching software products, and 1 year of experience with software design and architecture.
Preferred qualifications:
3 years of industry experience with high performance, large-scale systems, and debugging.
Experience in chip design and related EDA tools and flows.
Deep understanding of object oriented programming and functional programming.
Proficiency in code and system health, diagnosis and resolution, and software test engineering.
Ability to write and understand SystemVerilog register transfer level (RTL) code.
Excellent software skills and design practices.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8717592
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לפני 16 שעות
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior DFT Lead
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing autonomous solutions that define the next-generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Collaborate with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Oversee DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post-silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8718728
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required AI SoC Design Verification Engineer, Cloud

About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design Verification Engineer, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, system testing, and drive verification closure.
As part of our server chip design team, you will verify digital designs. You will collaborate closely with design and verification engineers on projects and perform direct verification. You will build efficient and effective constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning, test execution, to collecting and closing coverage.
The AI and Infrastructure team is redefining what’s possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. 
We're the driving team behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and Universal Verification Methodology (UVM), or formally verify designs with SystemVerilog Assertion (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital systems using standard IP components/interconnects (microprocessor cores, hierarchical memory subsystems).
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with verification techniques, and the full verification life-cycle.
Experience with performance verification of ASICs and ASIC components.
Experience with ASIC standard interfaces and memory system architecture.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
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8717488
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Team Manager, Servers, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design Team Manager within the Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will oversee the Intellectual Property (IP) and SoC VLSI design cycle from architecture to production. You will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads. You will be responsible for mentoring and developing team members and tech leads, driving improvements in leadership, technical execution, and design flows.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and System-on-Chips (SoCs).
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of one of the following areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8717559
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Bui
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Senior System Engineer
Job Description Summary
As a Senior System Engineer, you will play a critical role in the design, development, integration, and verification of complex medical imaging systems. You will be responsible for translating clinical needs into technical requirements, ensuring the robust performance, safety, and regulatory compliance of our innovative healthcare solutions.
Job Responsibilities
Lead and participate in the full product lifecycle, from concept and requirements definition through design, development, testing, and deployment of medical imaging systems.
Translate high-level clinical and user requirements into detailed system and subsystem specifications, ensuring traceability and comprehensive coverage.
Perform complex system analysis, modeling, and simulation to optimize system performance, identify potential risks, and propose innovative solutions.
Collaborate closely with cross-functional teams including hardware, software, clinical, quality assurance, regulatory, and manufacturing engineers to ensure seamless integration and successful product delivery.
Define and execute system verification and validation plans, including test protocols, data analysis, and reporting, to ensure compliance with medical device regulations (e.g., FDA, CE).
Conduct root cause analysis for system-level issues, propose effective corrective actions, and drive their implementation.
Contribute to the continuous improvement of system engineering processes, tools, and methodologies within the organization.
Mentor junior engineers and provide technical guidance on complex system engineering challenges.
Stay abreast of industry trends, emerging technologies, and regulatory changes relevant to medical imaging systems.
Requirements:
Bachelor's or Master's degree in Electrical Engineering, Biomedical Engineering, or a related technical field.
5+ years of experience in system engineering, with a significant portion in the medical device industry (preferably imaging systems such as MRI, CT, X-ray, Ultrasound).
Proven experience in defining system requirements, architecture, and design for complex products.
Strong understanding of medical device regulations (e.g., IEC 60601, ISO 13485, FDA QSR, MDR).
Experience with risk management activities for medical devices.
Excellent analytical, problem-solving, and decision-making skills.
Strong communication and interpersonal skills, with the ability to effectively collaborate with diverse teams.
Ability to work independently and as part of a team in a fast-paced, dynamic environment.
Fluency in English and Hebrew (written and spoken) is required.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC and IP Design Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital reasoning design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience with reasoning synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power and design techniques.
Experience in reasoning design and debug with Design Verification (DV).
Preferred qualifications:
Experience with a scripting language like Python or Perl.
Experience with design sign-off and quality tools (e.g., Lint, clock domain crossing (CDC), etc.).
Knowledge of System on a chip (SOC) architecture and assertion-based formal verification.
Knowledge of design techniques.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate SDRAM (DDR), Advanced Extensible Interface (AXI), ARM processors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8717567
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 17 שעות
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC Quality and Reliability Engineer, Cloud
You will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, you will work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. You will be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the-art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. You will have an opportunity to create silicon and follow it into the field and back to drive improvements for the next-generations of chips.
As a part of this role, you will have an understanding of Integrated Circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. You will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams within the larger organization.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical quality and reliability models (including early life failure (ELF), time-dependent dielectric breakdown (TDDB), and negative bias temperature instability (NBTI)) to predict device failure mechanisms and lifetime behaviors.
דרישות:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field, or equivalent practical experience.
10 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing.
Experience working with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Proven track record with silicon reliability on process nodes and advanced packaging technologies.
Deep knowledge of Design-for-Reliability (DfR) rules and implementation techn המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8718507
סגור
שירות זה פתוח ללקוחות VIP בלבד