דרושים » חשמל ואלקטרוניקה » Power and Signal Integrity Engineer, PhD Graduate

Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

we're seeking a highly skilled Physical Design Engineer specializing in EMIR & Power Integrity to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will execute the Electro-Migration and IR Drop (EMIR) analysis and sign-off from block level to full-chip, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering. You will be responsible for validating power grid architectures to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Execute static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from the block level through to full-chip sign-off
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Work with Physical Design teams to implement optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Collaborate closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Perform root-cause analysis for voltage drop violations and EM risks, proposing and implementing layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with strict foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Cloud customers, and billions of users worldwide.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

As an Expert EMIR & Power Integrity Lead, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon. You will own from block level to full-chip the Electro-Migration and IR Drop (EMIR) methodology, analysis, and sign-off, working at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering.

You will be responsible for defining power grid architectures and validating that products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes. Your work will directly impact the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Lead static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from block level to full-chip sign-off
Define and implement robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Collaborate with Physical Design teams to define optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Work closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Drive root-cause analysis for voltage drop violations and EM risks; propose and implement layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

Required SoC Vision Architect, Silicon, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a SoC Vision Architect in our Silicon team, you will be at the heart of defining the hardware that powers the next-generation of our products. You will bridge the gap between Artificial Intelligence (AI) research and physical silicon, architecting the Image Signal Processor (ISP), CODECS and the pixel data path. You will deliver unparalleled image quality while staying within the tight Power, Performance, and Area (PPA) constraints. You will participate in the concept, architecture, documentation, and implementation of a new product.
Responsibilities
Define a flexible imaging pipeline hardware architecture, from the sensor interface (e.g., Mobile Industry Processor Interface (MIPI)) through the ISP, the encoder/decoder, scaling and memory output.
Partner with our research to transform advanced computational imaging algorithms into high-efficiency hardware logic.
Conduct trade-off analyses between power, performance, and silicon area to meet thermal envelopes and current limitations.
Influence external executive vendor roadmaps, ensuring deep co-optimization between their future products and our custom silicon.
Lead collaboration across Architecture, Register-Transfer Level (RTL), Physical Design and Validation teams.

Required SoC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design for Test (DFT) Engineer, you will be responsible for defining, implementing, and deploying advanced DFT methodologies for digital or mixed-signal chips. You will define silicon test strategies, DFT architecture, and create DFT specifications for next generation SoCs. You will design and verify the DFT logic and prepare for post silicon and co-work/debug with test engineers.
Responsibilities
Develop DFT strategy and architecture (e.g., Memory Built-In Self Test (MBIST), Automatic Test Pattern Generation (ATPG), hierarchical DFT).
Complete all Test Design Rule Checks (TDRC) and design changes to fix TDRC violations to achieve high-test quality.
Insert DFT logic, boundary scan, scan chains, DFT Compression, Logic Built-In Self Test, Test Access Point (TAP) controller, clock control block, and other DFT IP blocks.
Insert MBIST logic including test collar around memories, MBIST controllers, eFuse logic, and connect to core and TAP interfaces.
Document DFT architecture, test sequences, and boot-up sequences associated with test pins.

Required Senior SOC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will play a crucial role in Design for Testing (DFT) Architecture and DFT design, and support devices of extreme complexity to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality matrix throughout the project life-cycle, and providing sign-off DFT to tapeout.
Responsibilities
Lead and execute activities in the design, implementation, and verification of DFT solutions for large-scale ASICs.
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage the DFT team's workload and deliverables, provide technical leadership and guidance to the team.
Lead DFT execution of a silicon project (e.g., planning, execution, tracking, quality, and signoff).

Required RTL Design Technical Lead, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use the ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.) and Cloud. Our end users are Googlers, Cloud customers and the billions of people who use our services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the Design Activities at IPs, SubSystems(S.S) and SoC.
Plan, execute, track progress, assure quality, report status of the assigned activity.
Lead a team of designers both directly and in teams.
Define the Block/SoC level design documents such as Micro Architectural Specifications.
Own IP, S, SoC strategies for clocks, resets, and debugs. Enforce global methodologies and drive enhancements.

Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.