Senior Silicon Physical Design Engineer

לפני 3 שעות

Senior Silicon Physical Design Engineer

חברה חסויה

Location: Haifa and Tel Aviv-Yafo

Job Type: Full Time

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Cloud customers, and billions of users worldwide.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.

This position is open to all candidates.

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לפני 3 שעות

RTL Design Technical Lead, Servers, Cloud

חברה חסויה

Location: Tel Aviv-Yafo and Haifa

Job Type: Full Time

Required RTL Design Technical Lead, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use the ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.) and Cloud. Our end users are Googlers, Cloud customers and the billions of people who use our services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the Design Activities at IPs, SubSystems(S.S) and SoC.
Plan, execute, track progress, assure quality, report status of the assigned activity.
Lead a team of designers both directly and in teams.
Define the Block/SoC level design documents such as Micro Architectural Specifications.
Own IP, S, SoC strategies for clocks, resets, and debugs. Enforce global methodologies and drive enhancements.

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in RTL Design cycle from IP to SoC and from specification to production.
8 years of experience in Technical leadership.
Experience in the following areas: RTL Design, Design Quality checks, Physical Design aspects of RTL coding, and Power.
Preferred qualifications:
Experience with synthesis techniques to improve Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with Design For Test and its impact on Design and Physical Design.
Experience with a scripting language like Python or Perl.
Knowledge in one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, and ARM processors.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.

This position is open to all candidates.

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לפני 3 שעות

Senior SOC Performance Engineer, Cloud

חברה חסויה

Location: Tel Aviv-Yafo and Haifa

Job Type: Full Time

Required Senior SOC Performance Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Validate performance and power models from the architecture team and lab measurements against established goals, exercise open source benchmarks, analyze the results, and identify optimization opportunities.
Design and build tests to verify SoC design meets targets, and implement advanced technologies for running "benchmark representations" on pre-silicon environments.
Analyze problems to identify core design weaknesses, and drive resolution of performance issues in both pre- and post-silicon environments.
Collaborate closely with design, validation, and architecture teams to ensure hardware and software designs interface correctly and deliver products.
Develop performance measurement frameworks, including Key Performance Indicators (KPIs), to produce regular reports and dashboards that support stakeholder decision-making, and drive efforts to productize features that improve performance and power characteristics.

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in Silicon post Validation or embedded systems.
3 years of experience in SoC or CPU performance and power modeling, analysis, and debugging.
Experience with computer architecture in areas like interconnects, traffic QoS, distributed caches, and I/O flows.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with hardware description languages like Verilog or SystemVerilog.
Experience in pre- and post-silicon analysis and debugging.
Experience in one or more functional areas, such as coherent fabrics (e.g., AMBA CHI/AXI), memory controllers (e.g., LPDDR5, DDR5), or I/O controllers (e.g., PCIe, CXL).
Experience in productizing features that enhance the performance or power characteristics of a design.

This position is open to all candidates.

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לפני 3 שעות

Senior Staff DSP Design Engineer, Cloud

חברה חסויה

Location: Tel Aviv-Yafo and Haifa

Job Type: Full Time

Required Senior Staff DSP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the architect for high-speed data paths, you will define the roadmap for scaling interconnect speeds. You will evaluate and select key technologies such as Co-Packaged Optics (CPO), advanced modulation formats, and new Forward Error Correction (FEC) methods to support future Artificial Intelligence (AI) computing clusters.
Responsibilities
Identify the "limits of physics" for current Digital Signal Processing (DSP) architectures and pivot the team toward next-generation solutions, such as Machine Learning (ML)-based equalization or Optical-specific DSP.
Define the requirements for DSP test chips to validate new architectures in advanced nodes before they hit production.
Drive the long-term power-reduction roadmap, ensuring our interconnects do not become the thermal bottleneck.
Represent us in the Optical Internetworking Forum (OIF) and Institute of Electrical and Electronics Engineers (IEEE) standards, ensuring our hyperscale requirements for latency and power are reflected in global specifications.

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Silicon Architecture, Mixed-Signal DSP, Communication Theory, or Systems Engineering.
Experience defining architectural specifications for high-bandwidth interconnects.
Experience with silicon development from initial concept through to high-volume production (Graphic Design System II (GDSII) to market).
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience representing organizations in industry standards bodies (e.g., IEEE, OIF, PCIe-SIG, or CXL).
Understanding of advanced low power DSP implementation.

This position is open to all candidates.

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27/04/2026

Senior Chip Design Engineer, Nitro Team

חברה חסויה

Location: Tel Aviv-Yafo and Haifa

Job Type: Full Time

As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in our company, including support for customers who require specialized security solutions for their cloud services.

Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. We provide a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of us, is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional senior engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
*Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.

Requirements:
Basic Qualifications
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.

This position is open to all candidates.

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01/04/2026

Senior/ Staff Chip Top Physical Design Engineer

חברה חסויה

Location: Haifa

Job Type: Full Time

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

Requirements:
B.Sc. or M.Sc. in Electrical Engineering
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus)
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration

This position is open to all candidates.

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01/04/2026

Senior/ Staff Physical Design Engineer - EMIR & Power Integrity

חברה חסויה

Location: Haifa

Job Type: Full Time

we're seeking a highly skilled Physical Design Engineer specializing in EMIR & Power Integrity to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As a Physical Design Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will execute the Electro-Migration and IR Drop (EMIR) analysis and sign-off from block level to full-chip, working closely at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering. You will be responsible for validating power grid architectures to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Execute static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from the block level through to full-chip sign-off
Implement and maintain robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Work with Physical Design teams to implement optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Collaborate closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Perform root-cause analysis for voltage drop violations and EM risks, proposing and implementing layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with strict foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

Requirements:
Bachelor's or Master's degree in Electrical Engineering or a related technical field
5+ years of hands-on experience in EMIR/Power Integrity analysis for high-performance SoCs or high-speed connectivity products
Strong proficiency in industry-standard EMIR tools (Ansys RedHawk/RedHawk-SC, Totem, or Cadence Voltus)
Deep understanding of EM/IR challenges in advanced FinFET nodes (7nm, 5nm, 3nm), including fin-heating, thermal coupling, and layout-dependent effects
Solid understanding of Place & Route flows, power grid synthesis, extraction (RC), and standard cell architecture
Proven ability to debug complex voltage drop issues, identify "weak spots" in the grid, and drive convergence on large, complex designs
Proficiency in Python, Tcl, or Perl for flow automation and data parsing

This position is open to all candidates.

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01/04/2026

Staff Physical STA Expert

חברה חסויה

Location: Haifa

Job Type: Full Time

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter

Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
8+ years of deep, hands-on experience in Static Timing Analysis (STA) at leading semiconductor companies, specifically working on advanced process technologies
Deep expertise in multi-scenario STA, timing/SDC constraint development and verification. You have a "full-chip" perspective, managing both complex macro-level designs and top-level integration
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (P&R, Physical Verification) and how they intersect with timing closure

This position is open to all candidates.

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לפני 2 שעות

Senior CPU Design Verification Engineer, Cloud

חברה חסויה

Location: Tel Aviv-Yafo and Haifa

Job Type: Full Time

Required Senior CPU Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning and test execution to collecting and closing coverage.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and UVM, or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.

Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
8 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, or a related field.
3 years of experience creating and using verification components and environments in standard verification methodology.
Experience with verification techniques, and the full verification life cycle.
Experience with performance verification of ASICs and ASIC components.
Experience with Application-Specific Integrated Circuit (ASIC) standard interfaces and memory system architecture.
Knowledge of CPU/Processor architectures (e.g., pipeline, cache, memory subsystem, instruction sets, exceptions) like ARM, X86 or RISC-V, is highly beneficial for verifying processor cores or IP blocks.

This position is open to all candidates.

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01/04/2026

Physical Design Subsystem (Multiple IPs/Partitions) Lead

חברה חסויה

Location: Haifa

Job Type: Full Time

we're seeking a visionary Physical Design Subsystem (Multiple IPs/Partitions) Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As the Physical Design Subsystem (Multiple IPs/Partitions) Lead you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SubSystem with your team for chips that drive the worlds largest AI clusters. You will lead the team and the transition from RTL to GDS, ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

Build and mentor a high-performing Partitions team , owning the end-to-end execution from Synthesis to Signoff
Take full ownership of Subsystem physical implementation, including floorplanning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Lead and guide external contractors and global partners to ensure seamless execution and delivery
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon

Requirements:
B.Sc. or M.Sc. in Electrical Engineering
15+ years of hands-on experience in Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience in leading teams or projects with a "can-do" approach and excellent communication skills
Deep expertise in RTL2GDS flows, including P&R, STA, Physical verification (DRC/LVS), Formal verification, low-power implementation (UPF/CPF), EMIR and evaluating foundry process nodes and third-party IPs
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Experience managing both complex Macro-level designs subsystem level and Full-Chip integration

This position is open to all candidates.

עדכון קורות החיים לפני שליחה

8599392

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שמך המלאמה השם שלך?

מייל

תיאור

שליחה

תודה על שיתוף הפעולה

מודים לך שלקחת חלק בשיפור התוכן שלנו :)

המשרה נמחקה

תוכל לצפות בה בדף המשרות שלי

המשרה הוחזרה לרשימת תוצאות החיפוש

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המשרות השמורות שלך?

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אירעה שגיאה בשליחת פרטיך למשרה

01/04/2026

Senior/ Staff Physical Design STA Engineer

חברה חסויה

Location: Haifa

Job Type: Full Time

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure

This position is open to all candidates.

עדכון קורות החיים לפני שליחה

8599360

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