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20/05/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match - powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
- Micro-architecture definition.
- RTL coding and debug.
- Synthesis and timing closure.
- Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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20/05/2026
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We're looking for a talented SoC Integration Lead to join our Nitro team and help shape what comes next. You will spearhead the SoC integration activities of sophisticated networking chips, collaborating closely with Architecture, RTL Design, Physical Design, Package Design, Verification, Software, DFT, and additional teams in a dynamic, open, and fast-paced environment. As a member of the Nitro project, you will have influence over the device through its entire lifecycle from product definition to mass production. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match, powering hundreds of thousands of businesses across 190 countries.

Key job responsibilities
Take full ownership of SoC integration, including IPs development, partitioning, clock domain crossing (CDC), reset domain crossing (RDC), exploratory synthesis, and design quality verification.
Drive chip-level design implementation by partnering with multiple teams including Architecture, RTL Design, DFT, Verification, System Verification, STA, and Physical Design.
Oversee the creation of SoC-level IP blocks such as fabrics, interfaces, and security modules.
Lead RTL integration activities including micro-architecture definition, RTL coding and debug, synthesis and timing closure, and sign-off.
Address diverse functional and structural challenges, encompassing functional debugging, physical design preparation, emulation, and design quality issue resolution.
Contribute to the creation and implementation of design flows and automated solutions that facilitate efficient SoC development.
Support Verification and Emulation teams through test plan development and coverage review.
Ensure the chip meets quality and reliability standards while delivering to physical design teams, emulation platforms, firmware developers, and other stakeholders.
Requirements:
Basic Qualifications
- BSc in Computer/Electrical Engineering.
- 10+ years of hands-on experience in chip design.
- Strong practical expertise in micro-architecture and RTL design (Verilog / SystemVerilog).
- Competency in scripting languages (Python, Perl, Bash, or Tcl).
- Strong communication, collaboration, and leadership skills.
- Demonstrated ability to own and drive complex integration units end-to-end.

Preferred Qualifications
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- Knowledge of coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Demonstrated commitment to quality standards and experience delivering to physical design teams, emulation platforms, firmware developers, and other stakeholders.
- Advanced degree in a related technical field.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking an experienced Staff/ Principal Architect to lead the architecture of high-performance connectivity solutions, with a strong focus on PCIe, high-speed networking, and Ethernet-based systems.
This role will define next-generation architectures for AI infrastructure, working at the intersection of silicon, system, and protocol design. You will play a key role in shaping innovative solutions that enable hyperscale customers to build scalable, high-bandwidth, and low-latency systems.
This is a unique opportunity to join a new and growing Israel site, influence technical direction, and take ownership of critical architectural decisions impacting industry-leading products.
Key Responsibilities
Define and drive system and chip-level architecture for high-speed connectivity products
Lead architecture for PCIe-based interconnects, networking protocols, and Ethernet subsystems
Analyze system requirements and translate them into scalable and efficient hardware architectures
Drive tradeoff analysis across performance, power, latency, area, and cost
Collaborate with cross-functional teams including RTL, Physical Design, Firmware, Validation, and Product Engineering
Define and review micro-architecture specifications and ensure alignment across teams
Contribute to standard-based and custom protocols for next-generation AI infrastructure
Support performance modeling, simulation, and architectural validation
Work closely with customers and partners to understand emerging use cases and requirements
Mentor engineers and help build strong technical leadership within the Israel R&D center.
Requirements:
Basic Qualifications
10+ years of experience in semiconductor architecture, ASIC design, or system engineering
Strong expertise in PCIe architecture (Gen4/5/6+) and its ecosystem
Deep understanding of Networking and Ethernet (e.g., 25G/50G/100G/400G and beyond)
Experience designing high-speed, low-latency data paths
Solid understanding of SoC architecture and integration challenges
Experience working across full chip development lifecycle
Strong analytical and problem-solving skills with ability to evaluate complex tradeoffs
Ability to influence and collaborate across multiple engineering domains
Preferred Experience
Experience with CXL, NVLink, UALink, or other advanced interconnect protocols
Background in AI/ML infrastructure, data center systems, or hyperscaler environments
Experience with SerDes-based systems and high-speed PHY integration
Familiarity with networking stacks, switching, or RDMA technologies
Experience with performance modeling tools and architectural simulators
Knowledge of power/performance optimization techniques at system level
Track record of driving architecture from concept to silicon.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 4 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Junior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Junior ASIC Design Engineer, you won't just build chips - you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Basic Qualifications
Education: Bachelors degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience: 0-2 years of experience in logic design (relevant internships, university labs, or hands-on academic projects are highly valued).
Technical Skills:
Foundational knowledge of Verilog and/or SystemVerilog.
Strong understanding of digital design principles and fundamental RTL coding concepts.
Soft Skills: Excellent communication skills with a strong motivation to learn, adapt, and collaborate effectively within cross-functional teams.
Preferred Qualifications
Master's degree in Electrical Engineering or related field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
Silicon One is seeking a CAD Engineer to join the Silicon One Physical Design team.
Meet the Team:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As part of our team, youll contribute to the development of our next-generation network devices-Silicon One. Our team operates in a startup-like environment within a stable and leading corporation.
Our design center is uniquely equipped, hosting all silicon hardware and software development fields under one roof.
We are revolutionizing the industry by building a new internet for the 5G era, providing a unified, programmable silicon architecture that serves as the foundation for all of our future routing products. Our devices are designed to be universally adaptable across service providers and web-scale markets, catering to both fixed and modular platforms. They deliver high speed without compromising on programmability, buffering, power efficiency, scale, or feature flexibility.
Silicon One is a ground-breaking, groundbreaking technology that will serve our customers and end users for decades to come. The Internet now has a new, faster, better, and safer engine!
Your Impact:
You'll be joining our Physical Design team within Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be the tech lead for CAD within the team, leveraging your extensive backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.
We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Requirements:
Minimum Qualifications
A VLSI Design Engineer with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevent background.
5+ years of hands-on experience in a relevant domain
Strong understanding of Place & Route flow
Preferred Qualifications
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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1 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.
As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities
DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies
Lead DFT planning, specification, and quality tracking across the project lifecycle
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout
Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels
Own end-to-end DFT activities from specification through silicon bring-up and production support
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements
Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred)
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs
Proven experience in leading DFT activities across full chip development cycles
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent)
Solid experience with DFT verification methodologies and coverage analysis
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development
Preferred Qualifications
Experience with advanced process nodes (7nm and below)
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar)
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems
Knowledge of silicon bring-up, production test flows, and yield optimization
Familiarity with STA, low-power design, and CDC as it relates to DFT integration
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.
Requirements:
Bachelor's degree in Computer Science, Electrical Engineering, or a related technical field
8+ years of experience in ASIC development and 3+ years in Program or Product Management or Technical/Engineering management
Proven leadership skills, with the ability to manage projects from technical details to the big picture
Experience in managing ASIC design flow, RTL, synthesis, functional verification, and physical layout
Experience in pre-silicon testing (Emulation, FPGA) and post-silicon validation is preferred
Excel in interpersonal communication, relationship building, and collaboration within cross-functional teams
Excellent organizational and leadership skills, and are capable of multitasking in a fast-paced environment
Preferred Qualifications
Familiarity with Networking technologies and concepts
Excellent strategic planning and communication skills, with a self-motivated focus on execution.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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2 ימים
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a Chip Design Manager to join our Networking team! As a Chip Design Manager in our Networking Business Unit, you will lead a team of highly skilled engineers responsible for verifying the next generation of our cutting-edge network products and GPU technologies. This is a unique opportunity to make a real impact at the heart of our AI and HPC revolution, while working in a fast-paced, innovative environment. You will join a passionate, experienced team working at the forefront of silicon verification - using advanced methodologies and tools to ensure design correctness for world-class solutions in data centers, high-performance computing, networking, and storage.

What You'll Be Doing:

Lead and grow a team of formal verification engineers focused on pre-silicon FV of complex digital designs.

Define and drive strategies and methodologies across multiple projects to prove design correctness and ensure quality.

Collaborate closely with Architecture, Design, and DV teams to identify verification needs and drive closure.

Provide technical guidance, mentoring, and support to engineers on the team.

Own planning and execution of verification deliverables to ensure high quality and timely tapeouts.
Requirements:
What We Need to See:

BSc or MSc in Electrical/Computer Engineering, Computer Science, or Mathematics.

5+ years of managerial experience leading engineering teams in chip design or verification.

8+ years of industry experience in RTL design, functional verification, or related domains.

Strong understanding of chip design flows and verification methodologies.

Excellent leadership, analytical, problem-solving, and communication skills.


Ways to Stand Out from the Crowd:

Experience with formal verification tools and methodologies (e.g., JasperGold, VC Formal).

Background in assertions, coverage models, or formal testbench development.

Track record of building and scaling high-performing engineering teams.

A passion for recruiting, mentoring, and developing talent.
This position is open to all candidates.
 
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חברה חסויה
Location: Herzliya and Haifa
Job Type: Full Time
We are seeking talented, creative and disciplined engineers to join the best-in-class team that plays a significant part in the development of new silicon for our eco-systems by engaging in a dynamic, highly collaborative environment. As a Wireless MAC System Architect, you will be a core member of our highly innovative and visible Wireless System-on-Chip (SoC) design team that defines modem architectures, develops MAC-layer algorithms, and invents embedded DSP algorithms for chips enabling exciting new wireless applications. You will be responsible for developing state-of-the-art wireless SoC products that are enjoyed by millions of our customers. Application areas include ultra-wideband sensing and specialized wireless audio; products enabled or improved by our teams SoCs include specialized audio headsets (such as AirPods), watches and iPhones.

In this role you will be responsible for the architecture of the Connectivity IP with focus on the MAC sub-system: - Define, document and Spec Connectivity MAC architecture and performance requirements.
- Analyze & simulate the performance of the Connectivity IP in real-life use-cases, achieving benchmarking performances in several metrics, including Throughput, Robustness, Co-existence with other Wireless IPs and more.
- Working closely with other architects (PHY, Power Management, FW and SW) to introduce best in class Connectivity IP solution.
- Develop innovative system architectures and protocols to deliver best-in-class performance for the MAC subsystem of custom wireless silicon solutions.
- Introduce cross-domain features where opportunities exist for innovation to achieve enhanced performance.
- Produce MAC architecture, specifications and corresponding performance/reference modeling in support of digital HW and FW design and verification efforts.
- Develop and maintain a MAC systems infrastructure applying the best methodologies for system-level simulation, pre-silicon prototyping (including emulation and FPGA prototyping), FW QA, regression and MTBF testing, and system verification to ensure first-time design success.
- Support the delivery of new wireless technologies to the Product Systems teams.
Requirements:
Minimum Qualifications
At least 7 years of industry experience in Wireless MAC HW architecture / MAC design micro-architecture.
Extensive technical background in one or more of the following:
MAC system engineering, including familiarity with media access protocols and related industry standards.
Wireless MAC standards, such as those found in IEEE 802.11, 802.15, Bluetooth or 3GPP.
Communications systems, including familiarity with Radio and PHY layer concepts.
HW / SW partitioning and the related tradeoffs, including how to balance those for optimal power consumption, die area, flexibility, etc.
Firmware development principles and methods, including FW regression testing, QA, and protocol interoperability testing.
SoC development, low-power design and implementation, and digital architecture fundamentals.
Excellent organizational skills.
Excellent communication skills - both written and oral.

Preferred Qualifications
B.Sc/ M.Sc in Electrical or Computer Engineering or Computer Science or related field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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10/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
Supporting the Verification and Emulation teams: Test plan development, coverage review.
Ensuring the chip meets quality and reliability standards.
Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications
- Bachelor's degree in computer science or equivalent.
This position is open to all candidates.
 
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