דרושים » חשמל ואלקטרוניקה » RTL Design Technical Lead, Servers, Cloud

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Cloud customers, and billions of users worldwide.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.

As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in our company, including support for customers who require specialized security solutions for their cloud services.

Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. We provide a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of us, is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional senior engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
*Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.

Required Senior SOC Performance Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Validate performance and power models from the architecture team and lab measurements against established goals, exercise open source benchmarks, analyze the results, and identify optimization opportunities.
Design and build tests to verify SoC design meets targets, and implement advanced technologies for running "benchmark representations" on pre-silicon environments.
Analyze problems to identify core design weaknesses, and drive resolution of performance issues in both pre- and post-silicon environments.
Collaborate closely with design, validation, and architecture teams to ensure hardware and software designs interface correctly and deliver products.
Develop performance measurement frameworks, including Key Performance Indicators (KPIs), to produce regular reports and dashboards that support stakeholder decision-making, and drive efforts to productize features that improve performance and power characteristics.

Required Senior CPU Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning and test execution to collecting and closing coverage.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and UVM, or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.

Required Senior Staff DSP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the architect for high-speed data paths, you will define the roadmap for scaling interconnect speeds. You will evaluate and select key technologies such as Co-Packaged Optics (CPO), advanced modulation formats, and new Forward Error Correction (FEC) methods to support future Artificial Intelligence (AI) computing clusters.
Responsibilities
Identify the "limits of physics" for current Digital Signal Processing (DSP) architectures and pivot the team toward next-generation solutions, such as Machine Learning (ML)-based equalization or Optical-specific DSP.
Define the requirements for DSP test chips to validate new architectures in advanced nodes before they hit production.
Drive the long-term power-reduction roadmap, ensuring our interconnects do not become the thermal bottleneck.
Represent us in the Optical Internetworking Forum (OIF) and Institute of Electrical and Electronics Engineers (IEEE) standards, ensuring our hyperscale requirements for latency and power are reflected in global specifications.

We are looking for exceptional senior chip architects to join a world-class team that is reinventing how workloads run at scale.

As a Chip Architect, you will define architecture and micro-architecture across the complete product lifecycle - from initial requirements and early-stage technology exploration through design, implementation, and production deployment. You will explore and analyze architectural options for current and next-generation solutions, including new physical layer (PHY) and interconnect technologies, innovative protocols, and fundamental improvements to our hardware and software stack to make us the best place to run ML workloads and establish Annapurna Labs solutions as the industry-leading platform for Training and Inference workloads.

This role requires a top-down understanding of our complete solution stack, including system architecture, software stack, chip architecture, and microarchitecture. You will work in close collaboration with multiple groups - Software, Silicon engineering, System and Platform teams, and cross-functional teams across us. Your architectural decisions will influence the design of chips deployed on millions of servers worldwide, powering the future of AI, machine learning, and general-purpose compute. This is an opportunity to have large-scale impact on how the world builds and deploys infrastructure.

we're seeking a visionary Physical Design Subsystem (Multiple IPs/Partitions) Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As the Physical Design Subsystem (Multiple IPs/Partitions) Lead you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SubSystem with your team for chips that drive the worlds largest AI clusters. You will lead the team and the transition from RTL to GDS, ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

Build and mentor a high-performing Partitions team , owning the end-to-end execution from Synthesis to Signoff
Take full ownership of Subsystem physical implementation, including floorplanning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Lead and guide external contractors and global partners to ensure seamless execution and delivery
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon

As a Design Verification Manager for the IP Group, you will lead a focused team responsible for the quality and reliability of our critical IP blocks. You will steer the IP verification roadmap, oversee the development of complex testbenches, and ensure our next-generation AI silicon meets the highest standards. Leading a team of talented engineers, you will tackle challenges at the unit and sub-system levels, playing a pivotal role in delivering high-performance hardware for the worlds largest AI clusters.

Key Responsibilities



Lead and mentor a team of design verification engineers, defining the technical roadmap and methodology for ASIC verification across unit and IP/sub-system levels
Drive the creation and execution of comprehensive design verification plans, ensuring all functional requirements are met on schedule for complex digital IPs
Oversee the architecture and maintenance of block-level verification strategies, heavily utilizing SV-UVM, alongside Formal Verification where applicable
Define functional coverage goals and quality metrics, driving the IP team toward 100% verification closure and sign-off
Partner closely with IP Design and Architecture teams to align on specifications, root-cause complex bugs, and optimize the IP development cycle

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation

Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization

Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration

Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration