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our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design CAD Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Participate in the development of flows & methodologies from Synthesis , Place& Route & all signoff flows.
Plan & execute flow releases, coordinate & track development tasks.
Exploration of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new tools features and methodologies to bring innovation with significant RoI.
Hands-on physical design block ownership end to end, from Synthesis floor planning, Place & Route with target to achieve best PPA.
Signoff on all domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Serve as the technical lead while mentoring and guiding team members.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design CAD Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Lead the development of flows & methodologies from Synthesis, Place & Route & All signoff flows.
Plan & execute flow releases, coordinate & track development tasks between the team.
Exploration of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new technologies tools & features and to bring innovation with significant RoI.
Serve as the technical lead while mentoring and guiding team members.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block or IP owner from RTL to GDS with horizontal domain ownership.
Collaboration with front-end and architecture teams to address issues, define design methodologies and improve QoR & convergence.
End to End ownership from Synthesis, DFT insertion, Floor Planning , Place & Route till signoff.
Signoff on all domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Exploratio of different methodologies from P&R till signoff to improve PPA & Turnaround time.
Evaluation of new technologies tools & features and to bring innovation with significant RoI.
Technical support and mentoring the engineers in the team.

our company's EyeC VLSI team - a group designing the chips for RADAR systems for ADAS and autonomous cars. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an end to end responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design STA Technical Expert to join the growing Physical Design Team, responsible for state of the art SoC design from definition to Tape-Out.
What will your job look like:
Leading FC timing activities & methodologies for brand New SoC, from definition to TO.
Writing design constraints (SDC) for FC/IP/Block levels for all modes.
Involved in chip architecture definition for functional & DFT domains.
Working in close collaboration with the front-end & architecture team.
Working with engineers to identify and overcome roadblocks and obstacles.
Defining AC timing from spec to implementation.
Supporting complex clock structures.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Leading Subsystem/IP Layout activities for complex Sub Full Chip with several levels of hierarchies.
Floorplanning, top-down deliveries & bottom up rollup , Sub FC/ IP level integration & verification.
Signoff on all physical design domains PV, IR/EM, LEC, LP Verification.
Physical Verification expert, building, maintaining and enhancing the flow for new technologies, improving reliability & convergence ToT.
Servings as a technical expert while mentoring and guiding team members,
Hands-on physical design block owner from RTL to GDS , an option.

our company's EyeC VLSI team - a group designing the chips for RADAR systems from advanced ADAS to Full Autonomous Driving. Our Physical Design group is working in a Startup like environment with respect to technical expertise, execution & responsibility . Each Physical Design engineer has an E2E responsibility from definition, execution & full signoffs, working closely with design & architecture teams for constraints development, design review & RTL modifications to achieve converges Were looking for a Physical Design Timing Expert to join the growing Technology Methodology & Execution team, that is responsible for developing both Technology Methodologies & Flows for all products and processes and the execution of complex Subsystems/IPs for our next generation Imagining Radar SoC from definition to Tape-Out.
What will your job look like:
Leading Subsystem/IP Timing activities for complex Sub FullChip with several levels of hierarchies.
Timing rollup , analysis & of blocks & sub system levels & timing signoff on Function & Scan models on Sub FC /IP level.
Define timing signoff methodologies, corners, derates margins and improve QoR & convergence.
Involved in the chip design & architecture definition for both functional & DFT domain.
Serve as the technical STA lead while mentoring and guiding team members.

You will join a team of talented and experienced Signal/Power Integrity (SI/PI) & Electrical Validation engineers with wide scope of responsibility, from Pre-Silicon SI/PI simulations to Post-Silicon Electrical validation and debugging, covering all High-Speed interfaces and Power Delivery of our company EyeQ ASIC products.
What will your job look like:
You will deal with design, simulations, optimization and debugging of high-speed interfaces - like LPDDR4/5, PCIe Gen4/5, C/DPHY, Multi Giga-Bit Ethernet, High-Speed interfaces over Power Cables, Power Delivery Networks.
You will develop Layout guidelines, review the physical design process and check its quality.
You will deal with state-of-the-art signal & power integrity simulation tools and methodologies, advanced results analysis, optimization/verification of our company and customers' PCB designs, etc.
This is a dynamic work environment that requires interfacing with Silicon & Hardware design engineers, IP providers, Electrical and System Validation teams, Customer Application Engineers, EDA tools vendors, and product managers.
The proximity to Electrical Validation activities - we are a single SI/EV team - is another strong advantage, enabling joint simulation-measurements efforts.

we are responsible to foster quality and excellence in our company's products and processes across the entire company. our company focuses on ensuring high customers' satisfaction through continuous improvement and implementation of automotive standards and best-practices such as ASPICE, IATF16949, ISO 9001, VDA/AIAG Core Tools and ISO26262, both internal and across the entire supply chain, In order to support our company's objectives, The QMS & Production Quality team is looking for a Production Quality & Reliability Engineer
What will your job look like:
Define and implement Quality & Reliability (QnR) framework and workplan for our company's components from first Silicon and onwards (from scratch)
Define and lead/participate in: QnR validation activities, Fault Isolation, Failure analysis according to 8D method, Yield enhancement, SORT kill criteria definition based on reliability risks, Statistical bin limits.
Work closely with colleagues from other departments (PMs, development engineers, production engineers, management) and other organizations (suppliers and customers).
Work with contract manufacturers to analyze the production process, process capability and capacity and measurement systems capability.
Assess and control the activities through performing VDA6.3 audits.
Create, manage and update PPAP folders for components.
Identify opportunities for improvement and execute them.
Create relevant work items templates and coach the teams how to use them.
Assess KPIs of processes and activities and suggest corrective actions and improvement.
Represent components QnR related issues with customers, suppliers and 3rd party organizations.

We are seeking an experienced and driven Quality and Reliability (Q&R) Engineer to own and manage the qualification and long-term reliability of advanced automotive semiconductor products. In this role, you will be responsible for defining, executing, and ensuring product compliance with industry standards (e.g., AEC-Q100, JEDEC, ISO26262), collaborating cross-functionally with design, test, packaging, and manufacturing teams to ensure robust quality performance throughout the product lifecycle.
What your job will look like:
Lead end-to-end quality and reliability activities for new automotive product introductions (NPI), including definition of Q&R plans, stress test strategy, and execution of qualification.
Define and align qualification strategy with AEC-Q100, JEDEC (JESD22), and customer-specific requirements.
Drive reliability risk assessments (FMEA, FMEDA, fault tree analysis) in collaboration with functional safety and design teams.
Manage product qualification timelines, budgets, and documentation, including reliability test reports, risk mitigation plans, and deviation justifications.
Interface with OSATs and test/assembly partners to ensure reliability test execution, including HTOL, ELFR, HAST, PTC, HTSL, and solder joint reliability.
Lead root cause analysis and corrective actions for product or qualification-related failures (FA/8D process).
Act as the Q&R voice in cross-functional reviews (DFX, tape-out, production ramp, and PCN).
Track field returns, drive reliability monitoring, and contribute to continuous improvement activities.
Support audits, customer quality inquiries, and product certifications as needed.