We are seeking a Optomechanics and Thermal Engineer to join the Switch Group. In this role, you will be a key contributor to the design, analysis, and validation of high-bandwidth Ethernet switching systems, working closely with cross functional teams to ensure robust thermal and mechanical performance
Own the Optomechanics/mechanical and thermal design, simulation, validation, and integration of our next-generation Switch Group development and reference design systems for Data Centers for AI hyperscale customers.
You will work shoulder-to-shoulder with HW, SIE, FW, Validation, and silicon teams to drive decisions on cooling solutions, power delivery packaging, structural integrity, and manufacturability, and will lead the Optomechanics-thermal engagement with our ODM and component vendors.
Own the Optomechanics-thermal design of Switch Group systems (including thermal solutions and mechanical challenges on PCB / chassis/rack level).
Design and execute Optomechanics and thermal experiments in the lab - from DOE through measurement, analysis, and corrective action.
Debug mechanical and thermal failures; drive root-cause to closure; take previous learnings to next products.
Requirements: What We're Looking For
Bachelor's degree or above in Optomechanics/Mechanical Engineering or related fields and 15+ years of related professional experience.
8-10 years of experience as an Optomechanics/Mechanical and Thermal Design Engineer in the electronics industry.
Deep knowledge of optical design for fiber-optic and copper cabling, including relevant standards, test equipment, handling, and reliability.
Solid grounding in optical principles: coupling efficiency, mode-field matching, alignment sensitivity, and loss mechanisms.
Proficiency in mechanical drawings, GD&T, and tolerance analysis (stack-up, RSS), with the ability to review and guide others (ODMs).
Advanced skills in 3D CAD (Creo preferred, or SolidWorks) and thermal simulation tools (FloEFD, Flotherm, Ansys Icepak, or similar).
Strong experience with mechanical and thermal FEA, including correlating models with measured results.
Knowledge of materials selection and coatings, including thermal interface materials (TIMs).
Working knowledge of manufacturing processes (sheet metal, CNC, skiving, brazing) and DFM/QC reporting.
Excellent written and verbal communication, including presenting to technical leadership, and a record of leading technical projects across disciplines.
Preferred Qualifications:
Hands-on experience with silicon photonics, optical transceivers, or co-packaged optics validation or packaging.
Experience designing sheet-metal enclosures (chassis, sleds) for data center applications.
Familiarity with test sockets (pogo-pin and elastomer) and temperature-forcing systems, and what makes their implementation succeed or fail.
Understanding of how mechanical design affects high-speed electrical performance, and experience with ECAD-MCAD collaboration (DXF/IDF exchange, PCB/PCBA design considerations).
Knowledge of industry standards such as OCP, Ethernet, PCIe, and JEDEC.
This position is open to all candidates.