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The Engineering department is looking for a Product Leader to be responsible for End-to-End system engineering related aspects
our Engineering department is part of DMD division.
You will be responsible for overseeing all NPI-related processes, ensuring manufacturability and sustainability across our multidisciplinary products, including both hardware and software.
Responsibilities
What will you be doing:
Lead NPI activities from the early design phases (DFx, prototyping) through the first article stage, implementation (High Volume Manufacturing), and ongoing sustainability
Lead and support aspects of existing products through ECO, including new Design, Failure Analysis, Wavers review, End Of Life substitute, Procedures
Act as a focal point with Supply Chain, Purchasing, Quality, Logistics, Service and R&D
Responsible of System aspects in Production line, through product cycle- NPI to End of Life
Support Production requirements, jigs/ test tools, troubleshooting, cost reduction activity and reliability.

Our Engineering department is seeking an NPI Electronic Engineer responsible for end-to-end electronics engineering aspects.
You will join the Engineering team within the DMD division and take ownership of all NPI-related processes. The role focuses on ensuring manufacturability and sustainability across our multidisciplinary products, including both hardware and software.
Responsibilities
What will you be doing:
Lead NPI activities from concept and DFx through first article, high volume manufacturing and ongoing sustainability
Own electronic modules through the full product cycle, NPI to End of Life
Lead ECO processes including new design introduction, Failure Analysis, Waiver reviews, EOL substitutions, and Procedure updates
Support Production with jigs, test tools, troubleshooting, cost reduction, and reliability improvements
Act as the focal point with Supply Chain, Purchasing, Quality, Logistics, and R&D
Source electronic components including PCBs, power supplies, cables, and electromechanical assemblies; define alternatives for obsolete or at-risk parts.

Responsibilities
* Develop and program PLC-based control systems, with a focus on complex, multi-axis machines
* Define, tune, and optimize control loops (Motion / PID / Closed Loop)
* Integrate automation systems including:
* Motors, drives, sensors, and vision systems
* Industrial communication protocols (EtherCAT, Modbus, TCP/IP, etc.)
* Troubleshoot and analyze system -level issues (electrical, mechanical, and control-related) with a hands-on approach
* Collaborate closely with multidisciplinary teams (mechanical, electrical, and R&D) across the full product lifecycle
* Write clean, modular, and maintainable code following best practices (including version control)
* Perform system validation, testing, and debugging on complex machines
* Provide Technical Support and support system integration at customer sites when required (local/global)

Country:
Israel
City:
Herzliya

we are looking for a Senior Core Datapath Engineer.
Roles and Responsibilities:
Design, develop, and enhance I/O subsystems, virtualization, kernel programming, and memory management for cutting-edge system software products.
Drive performance optimization, and efficient memory management.
Perform in-depth debugging, triaging, and resolution of user and kernel-level, performance profiling, and memory-related issues.
Develop innovative solutions, addressing challenges in virtualization, multithreading, and hardware-software interaction.
Explore and implement new methodologies fostering continuous improvement and innovation.
Proactively identify bottlenecks in system design, and recommend and implement robust, scalable solutions.
Stay updated on evolving trends in kernel development, design, and virtualization technologies to bring innovative practices to the team.
Troubleshoot and optimize complex I/O and kernel features to enhance performance, scalability, and reliability.
Collaborate with cross-functional teams to align on design goals and ensure seamless integration with the system architecture.
Exhibit flexibility in taking on new or related tasks, showcasing adaptability and a proactive, problem-solving mindset.
Provide technical leadership in architecture design, problem-solving, and decision-making across complex technical domains.
Lead technical discussions, design reviews, and decisions on critical system challenges, driving the adoption of innovative solutions and best practices.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

V&V Engineer ensures that our products meet all system requirements, adhere to specifications, and deliver a high-quality, competitive solution that fulfills customer needs and expectations.

What will you do?
Serve as the Verification & Validation focal point for a dedicated program within an Agile team.
Conduct requirements and PBI analysis, as well as risk assessment and comprehensive test planning.
Design and execute tests at all levels - from software standalone to full system integration, including black box and grey box testing at the system level.
Define and develop automated tests to support both V&V and R&D activities.
Analyze, document, and report test results, ensuring accurate defect logging and tracking to resolution.
Monitor and follow up on defects and open issues through their full lifecycle.
Collaborate with development teams to provide actionable feedback, support fault isolation, and maintain high-quality data handoffs.
Identify and investigate cross-product issues and dependencies.
Support the Service and Field teams in resolving escalated customer issues and contributing to root cause analysis.

This is an excellent opportunity to work on challenging and complex projects at advanced technology environment with major companies in the semiconductor domain!

This role will enable you to improve your technical skills, working with the industry leading engineers over a wide range of topics while interacting with the business world.

The Application Engineer will provide expert level technical customer Pre-Sale and post-sale support for Cadence customers in Physical Design area.

We are looking for a talented and experienced engineer to participate in the physical design of the companys product for leading one of Nextsilison BE projects. This position involves working with external back-end developers as well as carrying out critical tasks in-house, and leading aggressive back-end initiatives to meet challenging targets in terms of area, timing, and layout. In this role, you will be at the center of the companys design efforts and will have a significant influence on product architecture.
Responsibilities
Generate and analyze critical block- and chip-level static timing constraints
Spec and define full chip floor plan, including pin placement, partitions, and power grid
Develop and validate high-performance, low-power clock network guidelines
Perform critical block-level place and route and create designs that meet timing, area, and power constraints
Review the vendors physical design verification flow at chip and block level and guide other designers on how to fix LVS and DRC violations
Work with vendors on defining physical design methodologies and assist in flow development for chip integration.

Required Physical Design Team Leader
Description
We are reimagining high-performance computing (HPC & AI). Our accelerated compute solutions leverage intelligent adaptive algorithms to vastly accelerate supercomputers, driving them forward into a new generation. We have developed a novel software-defined hardware architecture that is achieving significant advancements in both the HPC and AI domains.
Everything we do is guided by three core values:
Professionalism: We strive for exceptional results through professionalism and unwavering dedication to quality and performance.
Unity: Collaboration is key to success. That's why we foster a work environment where every employee can feel valued and heard.
Impact: We're passionate about developing technologies that make a meaningful impact on industries, communities, and individuals worldwide.
Come help lead the design and development of one of the most ambitious products at the forefront of compute technology!
Responsibilities
Lead a physical design team responsible for all stages of the physical design process-floor planning, placement, clock tree synthesis, routing, timing, and power optimization at both block and subsystem levels.
Mentor and guide a team of physical design engineers through all stages of the design flow.
Collaborate closely with project managers and other technical leads to ensure timely delivery and successful completion of projects.
Drive the technical direction of the physical design process to ensure efficient, high-quality outcomes.
Develop and implement best practices for physical design and continuous improvements of design workflows.
Optimize designs for performance, power, and area (PPA) to meet project goals.
Ensure compliance with DRC (design rule checking) and LVS (layout versus schematic) requirements. .
Drive timing analysis and closure, working closely with the RTL design team to resolve timing violations.

We are looking for a talented Communication PHY Research Engineer to join our
growing, highly motivated, and skilled modem research team, to lead and participate in
research of proprietary wireless communication signals and design modulators,
demodulators as part of our counter-drone cyber-based product.
Responsibilities:
Research and analysis of proprietary air interface: algorithm research of sampled wireless signals using MATLAB or Python, to define all radio characteristics including sample rate, modulation scheme, error corrections, spreading techniques and more.
Full modem implementation and simulation in MATLAB or Python.
Analysis of protocol behavior and performance improvements.
Proposing and developing algorithmic approaches to address technical challenges and complex problems.
Technical subject matter expert (SME) for communication protocols, providing support and consultation on R&D-related challenges and issues.

Our Product Engineering group is looking for a highly motivated Hardware Engineer to lead Change Impact Analysis activities related to engineering design changes (ECOs/ECRs) across our cutting-edge networking and computing platforms. This role is critical to ensuring that all product modifications are seamlessly evaluated for their impact on hardware, mechanical design, system performance, and test coverage across the product lifecycle. You will work closely with R&D, mechanical engineering, manufacturing, quality, and test teams to assess risks, define mitigations, and maintain excellence in product integrity and testability.


What Youll Be Doing:

Review and define impact of engineering change ECO/ECR) across complex hardware systems.

Evaluating the impact of component, layout, and mechanical changes on hardware functionality, manufacturability, and testability.

Define alternative sources of components for products and products test stations.

Collaborating with cross-functional teams to ensure smooth implementation of changes without compromising product quality.

Supporting DFT (Design for Testability) requirements in the face of ongoing design changes.

Reviewing BOM and layout revisions and assessing ripple effects on power delivery, signal integrity, and thermal performance.

Maintaining change traceability and documentation to meet engineering and compliance standards.

Coordinating with manufacturing and operations teams to ensure product readiness and alignment with production timelines.

We are seeking a passionate QA Engineer to join our FW testing team. This position will be part of our growing team, which enables our products to meet the industry-leading benchmarks of efficiency and quality. As a Firmware QA Engineer, you will be immersed in the latest advancements and actively contribute to developing world-class products. Your efforts will directly impact the performance and quality of our offerings, ensuring they consistently meet industry-leading standards.

We are looking for an ideal candidate who will be actively involved in testing industry-leading features in the FW sector, able to rapidly acquire new feature knowledge, conduct both manual and automated tests, and contribute to the development of automation systems.

What you'll be doing:

Review arch design and requirements documents for new features introduced in several domains like HCA, Data Center GPU Platforms, Switch

Design, develop, and perform tests for the new features, as part of FW GA or update releases.

Automate newly added tests in the existing automation framework, and add new capabilities and features to the framework.

Report bugs found during execution, assist with reproduction and debugs to understand root cause, verify bug fixes provided by R&D team, and raise if not fixed.

Conduct tests in various areas, including regression, performance, functional, and security. Keep track of testing progress and generate summary reports of testing activities.

Fully collaborate with different external teams like : :product marketing, R&D, and verification.

Define and build setups topologies for appropriate product coverage.